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X9SKV-1125

Super Micro Computer, Inc.
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  Products   Motherboards   Xeon® Boards   [ X9SKV-1125 ]

Supermicro motherboard X9SKV-1125
Communication, Embedded 7 Years


Key Features
1. Single socket FCBGA 1284;
    Intel® Xeon® E3-1125C processor
    (40W, 2.0GHz. 8M, formerly known
    as Gladden)
2. Intel® Communication Chipset 8903
3. Up to 32GB DDR3 ECC 1600/1333MHz
    ECC SODIMM in 4 sockets
4. Expansion slot: 1x PCIe 2.0 x8
    (slot 6 or slot 7 option by jumper)
5. Intel® i210AT dual port GbE LAN
    Intel® i350-AM4 quad port GbE LAN
6. 2x SATA2 (3Gbps)
7. 5x USB 2.0 ports
8. Quad ports programmable LAN Bypass
9. Operating Temperature: 0°C - 60°C
   
 
Links & Resources
Tested Memory List
Motherboard Manual
Update Your BIOS
Download the Latest Drivers and Utilities
Download Driver CD
OS Compatibility

RoHS 6/6

Product SKUs
Motherboard
  • X9SKV-1125 (Bulk Pack)
 
Physical Stats
Form Factor
  • Flex ATX
Dimensions
  • 9.0" x 7.2", (22.86cm x 18.29cm)
 
Processor/Cache
CPU
  • Intel® Xeon® E3-1125C processor (40W, 2.0 GHz.8M, formerly known as Gladden)
  • FCBGA 1284
 
System Memory
Memory Capacity
  • 4x 204-pin DDR3 DIMM sockets
  • Supports up to 32 GB DDR3 ECC SODIMM
Memory Type
  • 1600/1333MHz ECC DDR3 SDRAM, 204-pin gold-plated SODIMM
DIMM Sizes
  • 8GB, 4GB, 2GB, 1GB
Memory Voltage
  • 1.5 V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors
      (using ECC memory)
 
On-Board Devices
Chipset
  • Intel Communication Chipset 8903
SATA
  • Intel 8903
USB
  • Intel 8903
Network Controllers
  • Dual LAN via Intel® i210AT Gigabit Ethernet
  • Quad LAN 2 pair bypass with Intel® i350-AM4 Gigabit Ethernet
  • Virtual Machine Device Queues reduce I/O overhead
  • Supports 10BASE-T, 100BASE-TX, and 1000BASE-T, RJ45 output
TPM
  • TPM header
 
Input / Output
SATA
  • 2x SATA2 (3Gbps) ports
LAN
  • 2x RJ45 Gigabit Ethernet LAN ports
  • 4x RJ45 Gigabit Ethernet LAN ports
USB
  • 5x USB 2.0 ports total (2 rear, 2 via header and 1 Type A)
Serial Port / Header
  • 2x serial ports (1 rear, 1 header)
DOM
  • 1x DOM (Disk on Module) power connector
Chassis (Optimized for X9SKV-1125 )
1U Chassis
Important Chassis Notes
  • To support the new generation Intel® Xeon® processor-based motherboards, Revision M chassis is recommended. Please talk to your sales representative for details.

 
Expansion Slots
PCI-Express
  • 1x PCIe 2.0 x8 (slot 6/7 option by jumper)
 
System BIOS
BIOS Type
  • 128Mb SPI Flash with AMI BIOS
BIOS Features
  • Plug and Play (PnP)
  • APM 1.2
  • DMI 2.3
  • PCI 2.3
  • ACPI 1.0 / 2.0 / 3.0 / 4.0
  • USB Keyboard support
  • Hardware BIOS Virus protection
  • SMBIOS 2.7.1
  • UEFI
  • RTC (Real Time Clock) Wakeup
 
Management
Software
Power Configurations
  • ACPI / APM Power Management
  • Keyboard Wakeup from Soft-Off
  • CPU Fan auto-off in sleep mode
  • Power-on mode for AC power recovery
 
PC Health Monitoring
Voltage
  • Monitors for CPU Cores, +3.3V, +5V, ±12V, +5V Standby, VBAT, HT, Memory, Chipset Voltages.
FAN
  • Total of six 4-pin fan headers supporting up to 6 fans w/ tachometer status monitoring
  • Status monitor for speed control
  • Status monitor for on/off control
  • Low noise fan speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support
  • I2C temperature sensing logic
  • Thermal Monitor 2 (TM2) support
  • PECI
LED
  • CPU / System Overheat LED
  • Suspend static indicator LED
Other Features
  • Chassis intrusion detection
  • Chassis intrusion header
  • RoHS, Halogen Free
  • Quad Port Programmable LAN bypass
  • Intel QuickAssist Technology
 
Operating Environment
Operating Temperature Range
  • 0°C - 60°C (32°F - 140°F)
Parts List (Bulk Package)
  Part Number Qty Description
Motherboard MBD-X9SKV-1125 1 X9SKV-1125 Motherboard
I/O Cables CBL-0044L 1 57.5CM SATA FLAT S-S PBF
I/O Shield MCP-260-00071-0N 1 STD I/O SHIELD
Optional Parts List
  Part Number Qty Description
1U I/O Shield MCP-260-00072-0B 1 1U I/O Shield for X9SKV with EMI Gasket in CSE-510/505/504
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.