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MicroBlade™
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MP Servers
GPU / Coprocessor
MicroCloud
Networking
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NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD




 

Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Mainstream | WIO | DCO | GPU | Storage | Workstation | Twin | FatTwin | Ultra | Max IO |


Serverboards SKUs - Display  | ALL | UP | DP | MP | or Socket P (E5) / H4 (E3) |



 Supermicro Serverboards

Supermicro's new generation X11 DP and UP serverboards offer the highest levels of performance, efficiency, security and scalability in the industry with up to: 3TB DDR4 2666MHz in 24 DIMM slots per node, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe hot-swap HDD/SSD support, 10GBase-T/10G SFP+/56Gbps FDR InfiniBand networking options, SATA Disk-on-Module (DOM), and IPMI 2.0 plus KVM with dedicated LAN. The SuperWorkstation boards offer in addition 7.1 HD Audio, and up to 11 USB ports.

The Supermicro X11 DP and UP Serverboards and SuperWorkstation boards support the Intel® Xeon® Scalable processors for exceptional performance. They are offered in a variety of form factors, including ATX, E. ATX, E.E. ATX, and several proprietary versions supporting the broadest array of market segments:

  • Data Center Optimized (DCO)
  • Application Optimized
  • Resource Optimized
  • I/O Optimized (WIO)
  • Twin
  • TwinPro™
  • FatTwin™
  • GPU/Coprocessor
  • SuperWorkstation
  • SuperStorage
  • SuperBlade®
  • MicroBlade
  • MicroCloud
  • Max IO

With these New Generation X11 Serverboard and SuperWorkstation Platforms, Supermicro offers the most extensive range of computing solutions for Data Center, Enterprise, Cloud, HPC, Hadoop/Big Data, Storage, and Embedded environments.



BigTwin
Workstation


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8; M.2 Interface: PCI-E 3.0 x4
  • 2 PCI-E 3.0 NVMExpress x4 Internal Ports
  • 2 Gigabit Ethernet LAN ports
  • 1 VGA, TPM Header, 7.1 HD Audio, 1 COM (header), Thunderbolt header
  • 2 USB 3.1 (1 Type A, 1 Type C rear), 7 USB 3.0 (4 rear, 2 front header, 1 Type A)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: E-ATX, 12" x 13"
 

BigTwin
7 PCI-E 3.0 slots

 / 

  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset (X11DPH-i); Intel® C622 chipset (X11DPH-T)
  • 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4; supports up to 22110
  • 2x 1GbE LAN ports via Marvell® 88E1512 (X11DPH-i)
  • 2x 10GBase-T LAN ports via Intel® X557 (X11DPH-T)
  • IPMI 2.0 and KVM with dedicated LAN
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 7 USB 3.0 (4 rear, 2 via headers, 1 Type A)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: E-ATX, 12" x 13"
 

BigTwin
Intel Quick Assist Technology


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C627 chipset
  • 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 3 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4; supports up to 22110
  • 2x 10GBase-T LAN ports via Intel® X557
  • IPMI 2.0 and KVM with dedicated LAN
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 7 USB 3.0 (4 rear, 2 via headers, 1 Type A)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: E-ATX, 12" x 13"
 

BigTwin
NVMe port option
3 AOC in 1U
SAS3 AOM support

 / 

  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C622 chipset (X11DDW-NT); Intel® C621 chipset (X11DDW-L)
  • 12 DIMMs, up to 1.5TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x32 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot, 1 PCI-E 3.0 x16 for AOM; M.2 Interface: PCI-E 3.0 x4
  • 4 PCI-E 3.0 NVMExpress x4 Internal Ports (X11DDW-NT)
  • 2x 10GBase-T LAN ports via Intel® C622 (X11DDW-NT)
  • 2x 1GbE LAN ports, 1 dedicated LAN for IPMI 2.0
  • 1 VGA, 1 COM (header), TPM 2.0 Header
  • 6 USB 3.0 ports (4 rear + 2 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary WIO, 12.3" x 13.4"
 

BigTwin
For Server SKU only
FatTwin™

 / 

  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 12 DIMMs, up to 1.5TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot, 1 PCI-E 3.0 x16 for Supermicro proprietary slot; M.2 Interface: PCI-E 3.0 x4; 1 PCI-E 3.0 x16 SIOM slot for flexible networking options
  • 4 PCI-E 3.0 NVMExpress x4 Internal Ports (X11DPFR-SN)
  • 1 VGA, TPM 2.0 Header
  • 2 USB 3.0 ports (rear)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary FatTwin, 8.53" x 19.66"
 

BigTwin
For Server SKU only
TwinPro™


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x24 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot, 1 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 for Supermicro proprietary slot, 1 PCI-E 3.0 x16 SIOM slot for flexible networking options
  • 1 VGA, TPM 2.0 Header
  • 2 USB 3.0 ports (rear)
  • Form factor: Proprietary, 6.81" x 18.86"
 

BigTwin
For Server SKU only
BigTwin™


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 24 DIMMs, up to 3TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot, 1 PCI-E 3.0 x24 Left riser slot, and 1 PCI-E 3.0 x8 for Supermicro proprietary slot, 1 PCI-E 3.0 x16 SIOM slot for flexible networking options
  • 1 VGA, TPM 2.0 Header
  • 2 USB 3.0 ports (rear)
  • Form factor: Proprietary, 7.61" x 18.86"
 

BigTwin
For Server SKU Only
Ultra, Up to 24 DIMMs,
Flexible Networking

 / 

  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • Up to 24 DIMMs, up to 3TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • Riser card support: 
    • 1 PCI-E 3.0 x32 Right Riser Slot or
    • 1 PCI-E 3.0 x8 Right Riser Slot + 1 PCI-E 3.0 x40 Ultra Riser Slot
  • 4 PCI-E 3.0 NVMExpress x4 Internal Ports
  • Flexible network via Ultra Riser Cards
  • IPMI 2.0 and KVM with dedicated LAN
  • Up to 14 SATA3 ports via C621; RAID 0, 1, 5, 10
  • 2 VGA D-Sub, TPM 2.0 Header, 1 COM
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary Ultra/WIO, 17" x 16.8"
 

BigTwin
For Server SKU Only
Ultra, up to 16 DIMMs
Flexible Networking

 / 
X11DPU-X (coming soon)

  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • Up to 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • Riser card support: 
    • 1 PCI-E 3.0 x32 Right Riser Slot or
    • 1 PCI-E 3.0 x8 Right Riser Slot + 1 PCI-E 3.0 x40 Ultra Riser Slot
  • 4 PCI-E 3.0 NVMExpress x4 Internal Ports
  • Flexible network via Ultra Riser Cards
  • IPMI 2.0 and KVM with dedicated LAN
  • Up to 14 SATA3 ports via C621; RAID 0, 1, 5, 10
  • 2 VGA D-Sub, TPM 2.0 Header, 1 COM
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary Ultra/WIO, 17" x 16.8"
 

BigTwin
GPU


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 12 DIMMs, up to 1.5TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 4 PCI-E 3.0 x16 slots or 1 PCI-E 3.0 x32 Left Riser slot
  • 2x 10GBase-T LAN ports via Intel® X550
  • IPMI 2.0 and KVM with dedicated LAN
  • 4 SATA3 (6Gbps) ports via C621
  • TPM 2.0 Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 2 USB 2.0 ports (rear)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 15.2" x 13.2"
 

BigTwin
GPU


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 6 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 (in x8 slot)
  • 2x 10GBase-T LAN ports via Intel® X550
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C621
  • 7.1 HD Audio header, TPM 2.0 Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 4 USB 2.0 ports (2 rear, 2 via header)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 15.12" x 13.2"
 

BigTwin
Workstation


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 16 DIMMs, up to 2TB 3DS ECC RDIMM, up to DDR4 2666MHz
  • 3 PCI-E 3.0 x16 (in x16), 3 PCI-E 3.0 x8 slots
  • 2 Gigabit Ethernet LAN ports shared with IPMI
  • Up to 8 SAS3 ports via Broadcom 3008; IT mode
  • 1 VGA, TPM Header, 7.1 HD Audio, 1 COM (header)
  • 6 USB 3.0 (4 rear, 2 headers)
  • Form factor: E-ATX, 12" x 13"
 

BigTwin
For Server SKUs only
GPU


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 4 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 2 PCI-E 3.0 NVMe x4 internal ports
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C621
  • TPM 2.0 Header, 1 COM port (header)
  • 2 USB 3.0 (rear)
  • Form factor: Proprietary, 9.2" x 19.8"
 

BigTwin
Mainstream

 / 

  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 (X11DPi-N) / C622 (X11DPi-NT) chipset
  • 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 4 PCI-E 3.0 x16 slots, 2 PCI-E 3.0 x8 slots
  • 2 PCI-E 3.0 NVMExpress x4 Internal Ports
  • M.2 Interface: PCI-E 3.0 x4; support 2260, 2280, 22110
  • 2x 10GBase-T LAN ports (X11DPi-NT)
  • 2x 1GbE LAN ports (X11DPi-N)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 4 USB 2.0 ports (2 rear, 2 headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: E-ATX, 12" x 13"
 

BigTwin
DCO


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 8 DIMMs, up to 1TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x16 slots, 3 PCI-E 3.0 x8 slots, 1 PCI-E 3.0 x4 (in x8) slot
  • M.2 Interface: PCI-E 3.0 x4; support 2260, 2280
  • 2x 1GbE LAN ports via Marvell® 88E1512
  • 1 VGA, TPM 2.0 Header, 1 COM port (header)
  • 3 USB 3.0 (2 via header, 1 Type A), 4 USB 2.0 ports (2 rear, 2 via header)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 10"
 

BigTwin
Mainstream


  • Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C622 chipset
  • 8 DIMMs, up to 1TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 or x8), 1 PCI-E 3.0 x8 (x0 or x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
  • 2x 10GBase-T LAN ports via Intel® X557
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C622
  • TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A) 6 USB 2.0 ports (2 rear, 4 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 9.6"
 

BigTwin
WIO

 / 

  • Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C622 chipset
  • 6 DIMMs, up to 768GB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x32 Left Riser Slot
  • M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
  • 2x 10GBase-T LAN ports via Intel® X557
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C622
  • 4 SAS3 (12Gbps) ports via Broadcom 3008 (X11SPW-CTF)
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 7 USB 2.0 ports (2 rear, 5 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary WIO, 8.15" x 13.05"
 

BigTwin
Embedded

 / 
 / 

  • Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C622 (X11SPM-TPF, X11SPM-TF) / C621 (X11SPM-F) chipset
  • 6 DIMMs, up to 768GB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4; support 2242, 2280
  • 2x 10G SFP+ ports via Inphi CS4227 (X11SPM-TPF)
  • 2x 10GBase-T LAN ports via Intel® X557 (X11SPM-TF)
  • 2x 1GbE LAN ports via Marvell® 88E1512 (X11SPM-F)
  • IPMI 2.0 and KVM with dedicated LAN
  • 12 SATA3 (6Gbps) ports via C622/C621
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 6 USB 2.0 ports (2 rear, 4 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Support 12V DC power input
  • Form factor: Micro ATX, 9.6" x 9.6"
 

BigTwin
Cost Optimized Storage

 / 

  • Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C622 chipset
  • 8 DIMMs, up to 1TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16 (x16 or x8), 1 PCI-E 3.0 x8 (x0 or x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
  • 2 PCI-E 3.0 NVMExpress x4 Internal Ports
  • M.2 Interface: PCI-E 3.0 x4 and SATA
  • 2x 10G SFP+ ports via Inphi CS4227 (X11SPH-nCTPF)
  • 2x 10GBase-T LAN ports via Intel® X557 (X11SPH-nCTF)
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C622
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 8 USB 2.0 ports (2 rear, 6 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 9.6"
 

BigTwin
I/O Intensive


  • Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 8 DIMMs, up to 1TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x8 (in x16 slot), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
  • 2x 1GbE LAN ports via Intel® i210
  • IPMI 2.0 and KVM with dedicated LAN
  • 8 SATA3 (6Gbps) ports via C621
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 8 USB 2.0 ports (2 rear, 6 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 9.6"
 

BigTwin
GPU


  • Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 6 DIMMs, up to 768GB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16 Center Right slot, 1 PCI-E 3.0 x16 Left Riser slot, 1 PCI-E 3.0 x16 Right Riser Slot
  • M.2 Interface: PCI-E 3.0 x4 and SATA
  • 2x 10GBase-T LAN ports via Intel® X550
  • IPMI 2.0 and KVM with dedicated LAN
  • 6 SATA3 (6Gbps) ports via C621
  • 1 VGA, TPM Header, 1 COM (header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 4 USB 2.0 ports (2 rear, 2 via header)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 7.71" x 16.64"
 

BigTwin
For Server SKUs only
MP, 4-Way


  • Quad Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 48 DIMMs, up to 6TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x32 (rear left), 1 PCI-E 3.0 x40 (rear right), 1 PCI-E 3.0 x8 (in x16, rear middle), 1 PCI-E 3.0 (x32 for 2U or x48 + x8 for 4U) on front for NVMe/Internal card support. 1 PCI-E 3.0 (x32 for 2U or x48 for 4U) on front for NVMe/Internal card support
  • IPMI 2.0 and KVM with dedicated LAN
  • 12 SATA3 (6Gbps) ports
  • 1 VGA, 1 TPM Header, 1 COM (rear), 2 USB 3.0 (rear)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 16.8" x 20.5"
 

BigTwin
For Server SKUs only
MP, 8-Way


  • For use in X11 8-way system (sold as a complete system only)
  • Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 12 DIMMs, up to 1.5TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0, M.2 Interface: 4 PCI-E 3.0 x4, 4 NVMe
  • Quad LAN with Lewisburg (on PCH board)
  • I/O: USB, Video, TPM (on PCH board)
  • Form factor: Proprietary, 11" x 14.33"
 

BigTwin
For Server SKUs only
GPU


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C622 chipset
  • 24 DIMMs, up to 3TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 4 PCI-E 3.0 x24 riser, 2 PCI-E 3.0 NVMe x4 Internal Port(s)
  • M.2 Interface: 2 PCI-E 3.0 x4
  • 2x 10GBase-T LAN ports via Intel® C622
  • Up to 8 SATA3 (6 Gbps) ports via C622; RAID 0,1,5,10
  • 1 VGA, TPM Header, 1 COM port (rear)
  • 4 USB 3.0 ports (rear)
  • SuperDOM (Disk on Module) port
  • Form factor: Proprietary, 17.0" x 19.5"
 

BigTwin
Max I/O (Embedded)


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 16 DIMMs; up to 2TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 11 total PCI-E 3.0 slots
  • M.2 Interface: PCI-E 3.0 x4; supports up to 22110
  • 2x 10GBase-T LAN ports via Intel® X550
  • 1 VGA, TPM 2.0 Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 via header, 2 via header, 1 Type A), 4 USB 2.0 (2 rear, 2 via header)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 15.12" x 13.2"
 

BigTwin
For Server SKUs only
Storage


  • Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 24 DIMMs, up to 3TB 3DS ECC LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x16 for Add-On-Module (AOM)
  • U.2 Interface: 4 PCI-E 3.0 x4, 4 PCI-E 3.0 NVMe x4 Internal Port(s)
  • IPMI 2.0 and KVM with dedicated LAN
  • Up to 4 SATA3 (6 Gbps) ports via C621; RAID 0,1,5,10
  • 1 VGA, TPM Header, 1 COM port (rear)
  • 3 USB 3.0 ports (2 rear + 1 Type A)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 16.9" x 11"
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2666MHz
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries


Support Resources:

MBSA Tool
  • DP MB Selection Tool



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