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NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD




 

Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Ultra | Twin | FatTwin | DCO | WIO | GPU | Mainstream | Storage | Workstation | Max IO |


  SuperServer® SKUs -  | ALL | 1U | 2U | 3U/4U | UP | DP | MP | Socket P (E5) / H4 (E3) |

 Max IO Servers

Supermicro Max IO solutions are resource optimized, cost-effective and ideal for space-constrained applications. Supermicro's highly dense yet compact server designs provide excellent compute, networking, storage and I/O expansion. These servers utilize Supermicro optimized thermal designs to save energy, operate at lower decibels and minimize system power consumption. Several models provide redundant power and cooling options and run at an extended temperature range. Supermicro's high quality assures reliable, long life and uninterrupted operation.

Supermicro Max IO solutions support a range of Intel® technologies for a diverse portfolio of use cases. Support for high-performance enterprise level Socket P processors enables customers to meet the requirements of applications including Industrial Automation (IPC), Medical Imaging, Intelligent Transport, Digital Signage, Digital Security and Surveillance, Network, Storage appliances, Edge Computing and other variety of other applications.


SuperServer
11 PCI-E Slots
16 Hot-swap 2.5", 1 Peripheral 5.25"


  • 2U Max I/O Server - Expansion / Performance / Flexibility
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 2.5" drive bays and 1 peripheral 5.25" bay
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4‑2666
  • 2 PCI-E 3.0 x16 (HSSI), 2 PCI-E 3.0 x16 (or 4 PCI-E x8), 4 PCI-E 3.0 x8 , 1 PCI-E 3.0 x4 (in x8 slot)
  • 1 PCI-E 3.0 x4 M.2 2280 slot from PCH
  • 2 GbE, 1 Video, 2 COM, 2 USB 3.0 (rear), 4 USB 2.0 (rear), 1 Type A
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 4x 80mm 7K RPM middle fans
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
11 PCI-E Slots
8 Hot-swap 3.5", 2 Peripheral 5.25"


  • 3U Max I/O Server - Expansion / Performance / Flexibility
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 8 Hot-swap 3.5" SATA3 drive bays and 2 Peripheral 5.25" bays
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4‑2666
  • 2 PCI-E 3.0 x16 (HSSI), 2 PCI-E 3.0 x16 (or 4 PCI-E x8), 4 PCI-E 3.0 x8 , 1 PCI-E 3.0 x4 (in x8 slot)
  • 1 PCI-E 3.0 x4 M.2 2280 slot from PCH
  • 2 GbE, 1 Video, 2 COM, 4 USB 3.0 (2 rear, 2 via header), 4 USB 2.0 (2 rear, 2 via header), 1 Type A
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 3x 80mm middle fans and 1x 80mm fear exhaust fan
  • 980W Redundant Platinum Level Power Supplies
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2666MHz
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries
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