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Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



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SuperServer®
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SuperBlade® &
  MicroBlade


 




 

Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Ultra | Twin | FatTwin | DCO | WIO | GPU | Mainstream | Storage | Workstation | Embedded |


  SuperServer® SKUs -  | All | 1U | 2U | 3U/4U | UP | DP | MP |  Socket P (E5) / H4 (E3)  |

  Supermicro WIO Servers


Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

Supermicro WIO SuperServer® systems offer a wide range of I/O options to deliver truly optimized systems for specific requirements. Users can optimize the storage and networking alternatives to accelerate performance, increase efficiency and find the perfect fit for their applications. In addition to enabling customizable configurations and optimization for multiple application requirements, Supermicro WIO SuperServers also provide attractive cost advantages and investment protection.

The Supermicro WIO SuperServer® product family supports up to: 1.5TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz memory in 12 DIMM slots, 3/6 Add-on Cards in 1U/2U, 12 SATA 3.0 (6Gbps) ports with Intel® C620 controller, hot-swap 2.5" or 3.5" drive bays, SATA3 and NVMe hybrid ports, optional NVMe drives, LAN options up to 2x 10GBase-T or 2x 1GbE ports, redundant Titanium Level (96%) power supplies, integrated IPMI 2.0 with KVM over dedicated LAN, and dual or single Intel® Xeon® Scalable processors up to 28 cores and 205W TDP.

Supermicro WIO SuperServers are optimized for General Purpose, ERP/MRP, and Network and Security Appliance Applications and used as Firewall, Mail and VPM servers.

Support Up To:
  • 28 Cores per CPU
  • 1.5TB DDR4 2666MHz ECC R/LR DIMM memory in 12 DIMM slots
  • 205W per socket
  • 3/6 PCI-E 3.0 x16 slots (1U/2U)
  • NVMe
  • Redundant 1200W high efficiency (96%) power supplies


WIO, Flexible I/O
10 Hot-swap 2.5" bays
Opt. 2 NVMe support

SYS-1029P-WTRT
• Cloud and other virtualization needs, hosting & application delivery,
   database processing & storage, simulation, automation
• Dual Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 10 Hot-swap 2.5" drive bays; 8 SATA3 + 2 NVMe/SATA3 hybrid ports
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM,
   1 PCI-E M.2 SSD
Platinum Level • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
• 1 VGA, 6 USB 3.0 (4 rear, 2 front via header)
• 4 Counter-rotating 4cm PWM cooling fans
• 750W Redundant Platinum Level Power Supplies
 

WIO, Flexible I/O
8 Hot-swap 2.5" bays
1 Slim DVD-ROM (Opt.)

SYS-1029P-WTR
• Web Server, FireWall Applications, DNS, Print, Login, Gateway,
   Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 2.5" drive bays; 1 slim DVD-ROM bay (option)
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM,
   1 PCI-E M.2 SSD
Platinum Level • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
• 1 VGA, 6 USB 3.0 (4 rear, 2 via header)
• 4 Counter-rotating 4cm PWM cooling fans
• 750W Redundant Platinum Level Power Supplies
 

WIO, Flexible I/O
8 Hot-swap 2.5" bays
1 Slim DVD-ROM (Opt.)

SYS-1029P-WT
• Web Server, FireWall Applications, DNS, Print, Login, Gateway,
   Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 2.5" drive bays; 1 slim DVD-ROM bay (option)
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM,
   1 PCI-E M.2 SSD
Platinum Level • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
• 1 VGA, 6 USB 3.0 (4 rear, 2 via header)
• 4 Counter-rotating 4cm PWM cooling fans
• 600W Multi Output Platinum Level Power Supply
 

WIO, Flexible I/O
4 Hot-swap 3.5" bays

SYS-6019P-WTR
• Web Server, FireWall Applications, DNS, Print, Login, Gateway,
   Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5" drive bays
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM,
   1 PCI-E M.2 SSD
Platinum Level • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
• 1 VGA, 4 USB 3.0 (rear)
• 4 Counter-rotating 4cm PWM cooling fans
• 750W Redundant Platinum Level Power Supplies
 

WIO, Flexible I/O
4 Hot-swap 3.5" bays

SYS-6019P-WT
• Web Server, FireWall Applications, DNS, Print, Login, Gateway,
   Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5" drive bays
• 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM,
   1 PCI-E M.2 SSD
Platinum Level • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
• 1 VGA, 4 USB 3.0 (rear)
• 4 Counter-rotating 4cm PWM cooling fans
• 600W Multi Output Platinum Level Power Supply
 

WIO, Flexible I/O, UP
10 Hot-swap 2.5" bays

SYS-1019P-WTR
• Database Processing and Storage, Data Center Applications
• Single Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 10 Hot-swap 2.5" drive bays, M.2 mini-PCI-e support
• 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
Platinum Level • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 5 Counter-rotating 4cm PWM cooling fans
• 500W Redundant Platinum Level Power Supplies
 

WIO, Flexible I/O, UP
4 Hot-swap 3.5" bays

SYS-5019P-WT
• Database Processing and Storage, Data Center / Firewall Applications
• Single Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5" drive bays, 1 slim DVD-ROM bay,
   M.2 mini-PCI-e support
• 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
Platinum Level • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 5 Counter-rotating 4cm PWM cooling fans
• 600W Multi Output Platinum Level Power Supply
 

WIO, Flexible I/O, UP
4 Hot-swap 3.5" bays

SYS-5019P-WTR
• Database Processing and Storage, Data Center / Firewall Applications
• Single Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 4 Hot-swap 3.5" drive bays, M.2 mini-PCI-e support
• 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
Platinum Level • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 5 Counter-rotating 4cm PWM cooling fans
• 500W Redundant Platinum Level Power Supplies
 

WIO, Flexible I/O, UP
8 Hot-swap 3.5" bays

SYS-5029P-WTR
• Database Processing and Storage, Connectivity/Storage Computer
   Nodes, Data Warehouse
• Single Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors
• 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 3.5" drive bays, 1 Slim DVD-ROM bay,
   M.2 mini-PCI-e support
• 4 PCI-E 3.0 x8 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
Platinum Level • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
• 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
• 3 Hot-swap 8cm PWM cooling fans
• 500W Redundant Platinum Level Power Supplies
 

WIO, Flexible I/O
12 Hot-swap 3.5" bays

SYS-6029P-WTRT
• Web Server, FireWall Applications, DNS, Print, Login, Gateway,
   Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 12 Hot-swap 3.5" drive bays with SES2 and Mini-i-Pass
• 1 PCI-E 3.0 x16 (FHHL), 2 PCI-E 3.0 x8 (FHHL), 2 PCI-E 3.0 x8 (LP)
Titanium Level • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
• 1 VGA, 4 USB 3.0 (rear)
• 3 high-performance 8cm PWM fans
• 1200W Redundant Titanium Level (96%) Power Supplies
 

WIO, Flexible I/O
8 Hot-swap 3.5" and
2 Fixed 3.5" bays

SYS-6029P-WTR
• Web Server, FireWall Applications, DNS, Print, Login, Gateway,
   Compact Network Appliance, Cloud Computing
• Dual Socket P (LGA 3647) support:
   Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
• 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
• 8 Hot-swap 3.5" drive bays with SGPIO, 2 Fixed 3.5" drive bays
• 4 PCI-E 3.0 x8 (FHHL), 2 PCI-E 3.0 x8 ((LP)
Titanium Level • 2x GbE ports via Intel C621, 1 Dedicated IPMI port
• 1 VGA, 4 USB 3.0 (rear)
• 3 high-performance 8cm heavy duty PWM fans
• 1000W Redundant Titanium Level (96%) Power Supplies
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Embedded / Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2666MHz
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries
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