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SuperServer 6019P-WTR

Super Micro Computer, Inc.
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  Products   Systems   WIO   [ 6019P-WTR ]





Integrated Board
Super X11DDW-L

Views: | Angled View | Top View |
| Front View | Rear View |

Key Features
• Web Server, Firewall Apps.
• Corporate-Wins, DNS, Print, Login
• Gateway, provisioning servers
• Compact Network Appliance
• Cloud Computing

1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 12 DIMM slots
3. 2 PCI-E 3.0 x16 (FHHL) slots,
    1 PCI-E 3.0 x8 (LP) slot,
    1 PCI-E 3.0 x16 for Add-on-Module,
    1 PCI-E M.2 SSD slot
4. 4 Hot-swap 3.5" SAS3/SATA3 drive bays
5. 2 1GbE LAN ports via Intel X722
6. 1 VGA, 4 USB 3.0 (rear)
7. 750W Redundant Power Supplies
    Platinum Level High-efficiency

 Drivers & Utilities   BIOS   IPMI   Tested Memory  OS Certification Matrix 

Product SKUs
SYS-6019P-WTR
  • SuperServer 6019P-WTR (Black)
 
Motherboard

Super X11DDW-L
 
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-165W with IVR
Cores
  • Up to 28 Cores with Intel® HT Technology
 
System Memory
Memory Capacity
  • 12 DIMM slots
  • Up to 1.5TB ECC 3DS LRDIMM, 768GB ECC RDIMM, DDR4 up to 2666MHz
Memory Type
  • 2666/2400/2133MHz ECC DDR4 SDRAM
 
On-Board Devices
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Dual LAN with Gigabit Ethernet from C621
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video
  • ASPEED AST2500 BMC
 
Input / Output
SATA
  • 4 SATA3 (6 Gbps) ports
LAN
  • 2 RJ45 Gigabit Ethernet ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 4 USB 3.0 ports (rear)
Video
  • 1 VGA port
Serial Port / Header
  • 1 Fast UART 16550 header
DOM
  • 2 SuperDOM (Disk on Module) ports
 
System BIOS
BIOS Type
  • AMI 32Mb SPI Flash ROM
 
Management
Software
Power Configurations
  • ACPI / APM Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for 8x fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
 
Dimensions and Weight
Width
  • 17.2" (437mm)
Height
  • 1.7" (43mm)
Depth
  • 23.5" (597mm)
Gross Weight
  • 46 lbs (20.9kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
 
Expansion Slots
PCI-Express
  • 2 PCI-E 3.0 x16 (FHHL) slots
  • 1 PCI-E 3.0 x8 (LP) slot
  • 1 PCI-E 3.0 x16 for Add-on-Module (AOM)
  • 1 PCI-E M.2 SSD slot
 
Drive Bays
Hot-swap
  • 4 Hot-swap 3.5" SATA3 drive bays
 
Backplane
SAS/SATA HDD Backplane
 
System Cooling
Fans
  • 4 Counter-rotating 4cm PWM fans
 
AC/DC240V Input Redundant Power Supply
700W/750W Redundant Power Supplies with PMBus
Total Output Power
  • 700W/750W
Dimension
(W x H x L)
  • 54.5 x 40.25 x 320 mm
Input
  • 100 - 140Vac / 8 - 6A / 50-60Hz
  • 200 - 240Vac / 4.5 - 3.8A / 50-60Hz
  • 200 - 240Vdc / 4.5 - 3.8A (CCC Only)
+12V
  • Max: 58A / Min: 0.5A (100 - 140Vac)
  • Max: 62A / Min: 0.5A (200 - 240Vac)
  • Max: 62A / Min: 0.5A (200 - 240Vdc)
    (CB/CCC Only)
+5V sb
  • Max: 3A / Min: 0A
Output Type
  • Gold Finger Connector Mating with Molex 45984-4343
Certification Platinum Level Certified
  UL/cUL/CB/BSMI/CE/CCC
  Platinum Certified
  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

See Parts List

Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.