Overview
|
System Overview |
|
|---|---|
|
Motherboard |
X14DBT-B |
|
Chassis |
CSE-827BQ2-R3K60P |
|
Processor |
Intel® Xeon® 6700 series processors with E-cores (in Socket E2 LGA4710) with four UPIs (24 GT/s max.) and a thermal design power (TDP) up to 165 W. Note: Dual processors with TDPs exceeding 165 W can be supported under limited conditions. Please contact Supermicro support for details. |
|
Memory |
16 DIMM slots |
|
Drive Support |
Default: Total three bays per node Two front hot-swap 3.5" PCIe 5.0 NVMe/SAS drive bays One front hot-swap 3.5" PCIe 4.0 NVMe/SAS drive bay Two M.2 PCIe 5.0 x2 NVMe slots (M-key 22110; VROC required for RAID) |
|
Expansion Slots (Per Node) |
Default: Two PCIe 5.0 x16 (low-profile) slots One PCIe 5.0 x16 AIOM slot (OCP 3.0 Compatible) |
|
I/O Ports (Per Node) |
LAN: One RJ45 1 GbE Dedicated BMC LAN port USB: Two USB 3.2 Gen1 Type-A ports (rear) Video: One VGA port |
|
System Cooling |
Fans: Four 14.9 K RPM heavy-duty 80 x 80 x 38 mm fans Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional) |
|
Power |
Two 3600 W Redundant (1 + 1) Titanium Level (96%) power supplies |
|
Form Factor |
17.68" x 3.47" x 30.5" (449 x 88 x 774 mm) (WxHxD) |
Notes:
-
A Quick Reference Guide can be found on the following page of the Supermicro website: https://www.supermicro.com/en/products/system/bigtwin/2u/sys-622bt-hnc8r
-
The following safety models associated with the SYS-622BT-HNC8R have been certified as compliant with UL or CSA: 827B-36 or 827B-R36X14