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Overview

Highlights

  • 3U systems supporting 24, 12 or 8 nodes with 4 DIMM slots
  • Hot-swappable 3.5” or 2.5” NVMe/SAS3/SATA3 options
  • Onboard 10 Gigabit Ethernet for optimized cost effectiveness

Innovations

  • Designed for Hyperscale and Cost Effectiveness
    The MicroCloud modular architecture provides high density, serviceability and cost effectiveness required for today’s demanding hyperscale deployments. The 24/12/8 modular server nodes are conveniently integrated into a compact 3U chassis that is less than 30 inches deep, saving over 76% of rack space when compared to traditional 1U servers.
  • Power and Density Optimized
    The MicroCloud family offers hyperscale data center optimized single socket computing solutions with the latest lower-power and high-density system-on-chip (SoC) processors, including Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors to enable a wide range of flexible and scalable cloud and edge computing solutions.
  • Front I/O Option for Easy Access and Serviceability
    Power and I/O ports are located at the front of the chassis for rapid server provision, upgrades, and service. Rear I/O option is also available when hot-swappable storage is preferred.

Optimized for:

  • Hosting & Content Delivery
  • Hyperscale / Hyperconverge
  • Resource-saving Architecture
  • Data Center
  • Cloud
Product Features

Form Factor

3U MicroCloud Server Enclosures

Memory

Up to 4 DIMM slots, up to 512GB DDR4 memory per node

Power

Platinum and Titanium Level (96%) Efficiency

Management

Open Industry Standard IPMI, Redfish APIs, Rack Scale Management

Processors

Up to Intel® Xeon® processor E5-2600 v4/v3, E3-1200 v6/v5, E/D-2100, Intel® Atom® processor C3900 product families

Drives

Up to 4x 2.5" SATA3 drives or 2x U.2 NVMe + 2x 2.5" SATA3 drives per node

Input/Output

Up to 1 PCI-E x16 low-profile expansion slot with flexible on-board Micro-LP networking options

Services

Worldwide Global Services
Models
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