X11DDW-L

Datacenter Optimized

Key Features

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
1 PCIe 3.0 x32 Left Riser Slot,
1 PCIe 3.0 x16 Right Riser Slot,
1 PCIe 3.0 x16 for Add-On-Module (AOM)
M.2 Interface: PCIe 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with GbE
from C621
1 VGA port

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Optimized Servers

SYS-1029P-WT SYS-1029P-WTR SYS-6019P-WT SYS-6019P-WT8 SYS-6019P-WTR SYS-6029P-WTR

Specifications

Product SKUs
MBD-X11DDW-L

Physical Stats
Form Factor	Proprietary WIO
Dimension	12.3" x 13.4" (31.24cm x 34.04cm)

Processor
CPU	2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
Note	BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)

System Memory
Memory Capacity	12 DIMM slots Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type	2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes	LRDIMM: 64GB, 128GB RDIMM: 64GB, 128GB
Memory Voltage	1.2V
Error Detection	Corrects single-bit errors Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset	Intel® C621
SATA	Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI	ASPEED AST2500
Graphics	1 ASPEED AST2500 BMC port(s)
Network Controllers	Dual LAN with GbE, from C621

Input / Output
LAN	2 RJ45 Gigabit Ethernet LAN ports
USB	6 USB 3.2 Gen1 port(s) (2 via header; 4 rear)
Video Output	1 VGA port(s)
DOM	2 SuperDOM (Disk on Module) ports
TPM	1 TPM Header

Expansion Slots
PCIe	1 PCIe 3.0 x32 Left Riser Slot, 1 PCIe 3.0 x16 Right Riser Slot, 1 PCIe 3.0 x16 for Add-On-Module (AOM)
M.2	M.2 Interface: PCIe 3.0 x4 Form Factor: 22110, 2280, 2242, 2260 Key: M-Key

System BIOS
BIOS Type	256MB UEFI

Management
Software	SuperDoctor® 5, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, IPMI2.0, Watchdog

PC Health Monitoring
Voltage	Monitors CPU voltages, +5V standby, +5V, +3.3V, +12V, +1.8V, Memory Voltages
LED	UID/Remote UID Power LED BMC/IPMI Heartbeat LED CPU / System Overheat LED
Temperature	Monitoring for CPU and chassis environment CPU thermal trip support
FAN	6x 4-pin fan headers (up to 6 fans) PWM fan speed control 6 fans with tachometer status monitoring Status monitoring for speed control
Other Features	UID, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion detection

Operating Environment
Operating Temperature Range	10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range	-40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range	8% - 90% (non-condensing)
Non Operating Relative Humidity Range	5% - 95% (non-condensing)

Resources

Servers (Optimized for X11DDW-L)

SYS-1029P-WT

SYS-1029P-WTR

SYS-6019P-WT

SYS-6019P-WT8

SYS-6019P-WTR

SYS-6029P-WTR

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Chassis

SC113AC2-R706WB2

SC815TQC-R706WB2

SC116AC2-R706WB2

SC823MTQC-R802WB

SC825TQC-R1K03WB

SC825TQC-R802WB

SC826BAC4-R1K23WB

SC825MBTQC-R802WB

...

= Optimized SuperServer Chassis
= Optimized Global Chassis
Blue color = Compatible Chassis
= Compatible Global Chassis

Component Options

Software

Documentation

Parts List

X11DDW-L

Products
Motherboards
X11DDW-L