Optimized for High-Density AI & HPC Data Center Racks
Supermicro’s Rear Door Heat Exchanger (RDHx) supports cooling capacities from 10 kW to 120 kW. Designed for high-density AI and HPC racks, it mounts quickly onto standard EIA, ORv3, and MGX racks, removes residual heat with N+1 redundant fans, and integrates seamlessly into new or existing data centers as part of the Data Center Building Block Solutions® (DCBBS) portfolio.
- Fast, Flexible Deployment
- Universal rack compatibility and simple mounting reduce installation time
- Cooling Capacity
- 10 kW to 120 kW to remove all residual heat
- Zero Downtime
- Redundant fans designs (3 to 12) keep cooling at peak performance
- High Reliability
- Smart anti-condensation system prevents moisture damage
Choose the Rear Door Heat Exchanger That Fits Your Needs
| Heat Removal | Supplementary | Advanced | Maximum |
|---|---|---|---|
| Cooling Capacity | Lowest | High | Highest |
| Recommendation | For rack-scale solutions with liquid cooling on the most critical components | For rack-scale solutions with liquid cooling on GPUs and CPUs only | For racks with only air-cooled servers |
Supplementary Heat Removal
Purpose-built for rack solutions with low heat-removal requirements
- Cooling Capacity: Up to 25 kW
- Redundant fans designs (3 to 8) keep cooling at peak performance
- Power Consumption (Max): 1.25 kW to 2.84 kW
| Product(s) | 
| 
| 
|
|---|---|---|---|
| Specification | EIA Rack | MGX Rack/EIA Rack/ORv3 Rack | MGX Rack/ORv3 Rack |
| Power Supply |
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|
|
| DC Power Type | N/A | Direct DC Input/DC via Converter | Direct DC Input |
| Cooling Capacity | Up to 20 kW | Up to 25 kW | Up to 20 kW |
| Fan Quantity | 5 | 3 | 8 |
| Power Consumption (Max) | 2 kW | 1.25 kW | 2.84 kW |
| Dimensions |
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| Weight | 120 kg (without coolant) | 64 kg (without coolant) | 110 kg (without coolant) |
| Protocols | Redfish®, SNMP, Web-based UI, and Supermicro SuperCloud Composer® (SCC) |
Advanced Heat Removal
Engineered for high-density rack solutions with elevated heat loads
- Cooling Capacity: Up to 50 kW
- Redundant fans designs (4 to 10) keep cooling at peak performance
- Power Consumption (Max): 1.7 kW to 3.3 kW
| Product(s) |
|
| 
|
|---|---|---|---|
| Specification | EIA Rack | MGX Rack/EIA Rack/ORv3 Rack | MGX Rack |
| Power Supply |
|
|
|
| DC Power Type | N/A | Direct DC Input/DC via Converter | Direct DC Input |
| Cooling Capacity | Up to 50 kW | Up to 50 kW | Up to 50 kW |
| Fan Quantity | 6 | 4 | 10 |
| Power Consumption (Max) | 3.3 kW | 1.7 kW | 3.3 kW |
| Dimensions |
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|
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| Weight | 130 kg (without coolant) | 114 kg (without coolant) | 120 kg (without coolant) |
| Protocols | Redfish®, SNMP, Web-based UI, and Supermicro SuperCloud Composer® (SCC) |
Maximum Heat Removal
Built for extreme heat loads, providing the highest cooling capacity to enable maximum compute density
- Cooling Capacity: Up to 120 kW
- Redundant fans designs (5 to 12) keep cooling at peak performance
- Power Consumption (Max): 2.1 kW to 5 kW
| Product(s) |
| 
|
|
|---|---|---|---|
| Specification | MGX Rack/EIA Rack/ORv3 Rack | EIA Rack | MGX Rack/EIA Rack/ORv3 Rack |
| Power Supply | Alternating Current (AC) | Alternating Current (AC) | Alternating Current (AC) |
| Cooling Capacity |
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|
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| Fan Quantity | 5 | 12 | 6 |
| Power Consumption (Max) | 2.1 kW | 5 kW | 3.6 kW |
| Dimensions |
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| Weight | 136 kg (without coolant) | 160 kg (without coolant) | 146 kg (without coolant) |
| Protocols | Redfish®, SNMP, Web-based UI, and Supermicro SuperCloud Composer® (SCC) |
Full Direct Current (DC) Design for More Efficient RDHx Cooling
In high-density AI data centers, every watt used and every degree of heat removal are critical. Our purpose-built DC fan for rear door heat exchangers uses a true full DC Design, drawing power directly from the MGX DC rack to eliminate conversion losses. Built-in MGX power redundancy keeps cooling online without extra backup hardware. The result is a simpler, more efficient architecture that cuts energy waste, improves power use, and supports dense AI racks.
Build Next-Generation Data Centers with Data Center Building Block Solutions®
Supermicro's Data Center Building Block Solutions (DCBBS) delivers complete, modular AI infrastructure. Built from validated components and sub-systems, DCBBS provides end-to-end deployment flexibility – from individual GPUs and networking switches to complete racks, site infrastructure, management software, and professional services.
Learn MoreMaximize Performance and Efficiency with Integrated Liquid Cooling Rack Solutions Powered by Supermicro DCBBS
In high-density AI data centers, seamless integration between racks and liquid cooling is essential for maximum performance and efficiency. Supermicro Rack Series and rear door heat exchangers work together as a fully optimized liquid-cooling rack-scale solution — engineered, tested, and delivered by Supermicro.
Rack Integration Services
Accelerated Time-To-Deployment and Reduced Time-to-Online for AI Data Centers
SuperCloud Composer Management Software
All-in-one platform that provides a unified dashboard to manage rack-scale and liquid cooling hardware