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The Industry's Widest Variety of I/O Optimized Servers

1U WIO SuperServer
2U WIO SuperServer

WIO Servers

Supermicro WIO SuperServer® systems offer a wide range of I/O options to deliver truly optimized systems for specific requirements. Users can optimize the storage and networking alternatives to accelerate performance, increase efficiency and find the perfect fit for their applications. In addition to enabling customizable configurations and optimization for multiple application requirements, Supermicro WIO SuperServers also provide attractive cost advantages and investment protection.

The Supermicro WIO SuperServer® product family supports up to: 1.5TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz memory in 12 DIMM slots, 3/6 Add-on Cards in 1U/2U, 12 SATA 3.0 (6Gbps) ports with Intel® C620 controller, hot-swap 2.5" or 3.5" drive bays, SATA3 and NVMe hybrid ports, optional NVMe drives, LAN options up to 2x 10GBase-T or 2x 1GbE ports, redundant Titanium Level (96%) power supplies, integrated IPMI 2.0 with KVM over dedicated LAN, and dual or single Intel® Xeon® Scalable processors up to 28 cores and 205W TDP.

Supermicro WIO SuperServers are optimized for General Purpose, ERP/MRP, and Network and Security Appliance Applications and used as Firewall, Mail and VPM servers.

Support up to:

  • 28 Cores per CPU
  • 1.5TB DDR4 2666MHz ECC R/LR DIMM memory in 12 DIMM slots
  • 205W per socket
  • 3/6 PCI-E 3.0 x16 slots (1U/2U)
  • NVMe
  • Redundant 1200W high efficiency (96%) power supplies
New Generation of Computing Excellence
New Intel® Xeon® Scalable processors supported.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
WIO, Flexible I/O, UP • 10 Hot-swap 2.5" bays • 2 NVMe w/ AOC opt.
  • Database Processing and Storage, Data Center Applications
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 10 Hot-swap 2.5" drive bays, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 500W Redundant Power Supplies
X11SSW-F + • SC514-R407W
  • Appliance Server, WIO, Embedded Applications
  • Single Socket H4 (LGA 1151) supports: Intel® Xeon® processor E3-1200 v6/v5 family, Intel® 7th/6th Gen Core i3 series processor, Intel® Celeron® and Intel® Pentium processors
  • Intel® C236 chipset
  • 2x 2.5" internal fixed SATA3 drive bays
  • 1 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 Left Riser slot; 1 PCI-E 3.0 x4 (in x8); 1 M.2 connector
  • Up to 64GB DDR4 2400MHz ECC UDIMMs in 4 sockets
  • 2 RJ45 1GbE LAN ports (Intel® i210-AT)
  • Integrated IPMI 2.0 with KVM and Dedicated LAN
  • 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 2 SuperDOM ports with built-in power; TPM header
  • 400W Redundant High-efficiency Power Supplies
WIO, Flexible I/O • 8 Hot-swap 2.5" bays • 1 Slim DVD-ROM (Opt.)
  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 8 Hot-swap 2.5" drive bays; 1 slim DVD-ROM bay (option)
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 6 USB 3.0 (4 rear, 2 via header)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 600W Multi Output Platinum Level Power Supply
WIO, Flexible I/O • 8 Hot-swap 2.5" bays • 1 Slim DVD-ROM (Opt.)
  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 8 Hot-swap 2.5" drive bays; 1 slim DVD-ROM bay (option)
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 6 USB 3.0 (4 rear, 2 via header)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 750W Redundant Platinum Level Power Supplies
WIO, Flexible I/O • 10 Hot-swap 2.5" bays • 2 NVMe support
  • Cloud and other virtualization needs, hosting & application delivery, database processing & storage, simulation, automation
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 10 Hot-swap 2.5" drive bays; 8 SATA3 + 2 NVMe/SATA3 hybrid ports
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 6 USB 3.0 (4 rear, 2 front via header)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 750W Redundant Platinum Level Power Supplies
WIO, Flexible I/O, UP • 4 Hot-swap 3.5" bays
  • Database Processing and Storage, Data Center / Firewall Applications
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 4 Hot-swap 3.5" drive bays, 1 slim DVD-ROM bay, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 600W Multi Output Platinum Level Power Supply
WIO, Flexible I/O, UP • 4 Hot-swap 3.5" bays
  • Database Processing and Storage, Data Center / Firewall Applications
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 4 Hot-swap 3.5" drive bays, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
X11SSW-F + • SC815TQC-R504WB
  • HA, VM, Communication, WIO, Flexible I/O
  • Single Socket H4 (LGA 1151) supports: Intel® Xeon® processor E3-1200 v6/v5 family, Intel® 7th/6th Gen Core i3 series processor, Intel® Celeron® and Intel® Pentium processors
  • Intel® C236 chipset
  • 4x 3.5" Hot-swap SATA3 bays w/ RAID
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) AOC Slot; 1 M.2 connector
  • Up to 64GB DDR4 2400MHz ECC UDIMMs in 4 sockets
  • 2 RJ45 1GbE LAN ports (Intel® i210-AT)
  • Integrated IPMI 2.0 with KVM and Dedicated LAN
  • 1 VGA, 2 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 2 SuperDOM ports with built-in power; TPM header
  • 500W (1+1) Redundant High-efficiency Power Supplies
WIO, Flexible I/O, UP • 8 Hot-swap 3.5" bays
  • Database Processing and Storage, Connectivity/Storage Computer Nodes, Data Warehouse
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 8 Hot-swap 3.5" drive bays, 1 Slim DVD-ROM bay, M.2 mini-PCI-e support
  • 4 PCI-E 3.0 x8 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 3 Hot-swap 8cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
WIO, Flexible I/O • 4 Hot-swap 3.5" bays
  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 4 Hot-swap 3.5" drive bays
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 600W Multi Output Platinum Level Power Supply
WIO, Flexible I/O • 8x 3.5" + 2x 2.5" bays
  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 8 Fixed 3.5" + 2 Fixed 2.5" drive bays
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E M.2 SSD
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 6 Counter-rotating 4cm PWM cooling fans
  • 650W/600W Multi-output Platinum Level Power Supply
WIO, Flexible I/O • 4 Hot-swap 3.5" bays
  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 4 Hot-swap 3.5" drive bays
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 750W Redundant Platinum Level Power Supplies
WIO, Flexible I/O • 8 Hot-swap 3.5" and • 2 Fixed 3.5" bays
  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 8 Hot-swap 3.5" drive bays with SGPIO, 2 Fixed 3.5" drive bays
  • 4 PCI-E 3.0 x8 (FHHL), 2 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 3 high-performance 8cm heavy duty PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies
WIO, Flexible I/O • 12 Hot-swap 3.5" bays
  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 12 Hot-swap 3.5" drive bays with SES2 and Mini-i-Pass
  • 1 PCI-E 3.0 x16 (FHHL), 2 PCI-E 3.0 x8 (FHHL), 2 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 3 high-performance 8cm heavy duty PWM fans
  • 1200W Redundant Titanium Level (96%) Power Supplies