System Specifications
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Processors |
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Dual Intel® Xeon® 6 Processors (in Socket E2 LGA 4710) with four UPIs (up to 24 GT/s) and a thermal design power (TDP) up to 350 W |
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BIOS |
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AMI SPI BIOS NAND Flash 64 MB support SPI dual / quad speed control, Real Time Clock (RTC) wakeup, riser card auto detection support, SuperServer Automation Assistant (SAA), Redundant power supply unit detection, SPM, SUM-OOB / InBand |
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Memory |
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4 TB of ECC DDR5 memory with speeds up to 6400 MT/s in 1DPC configuration, up to 8 TB of ECC DDR5 memory with speeds up to 6000 MT/s in 2DPC configuration. Note: Memory speed/capacity support depends on the processors used in the system. |
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Storage Drives |
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Eight front hot-swap E1.S NVMe drive bays Two M.2 NVMe slots (M-key; RAID support via S3808N controller) |
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PCI Expansion Slots |
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Two PCIe 5.0 x16 (in x16) FHHL slots |
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Input/Output |
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Two RJ45 10 GbE LAN ports (Intel® X710) Eight OSFP 800 Gb/s InfiniBand LAN ports (NVIDIA ConnectX®-8 SuperNIC) One RJ45 1 GbE Dedicated BMC LAN port (ASPEED AST2600) (via DC-SCM) One VGA port |
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Motherboard |
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X14DBG-LC2: Proprietary, 17" x 15.21" (431.8 x 386.3 mm) (L x W) |
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Chassis |
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CSE-GP202TS-000NP: 2-OU rackmount 21.1" x 3.7" x 31.69" (537 x 94 x 805 mm) (W x H x D) |
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System Cooling |
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Four 80 mm hot-swap fans Four 40 mm internal fans Three air shrouds Direct to Chip (D2C) cold plate |
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Security |
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Hardware Root of Trust (RoT), Trusted platform module 2.0 (AOM-TPM-9672V) |
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Power Supply |
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1400 A Busbar 33000 W Power-Shelves |
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Operating Environment |
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Operating Temperature: 10º to 35º C (50º to 95º F) Non-operating Temperature: -40º to 60º C (-40º to 140º F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-Operating Relative Humidity: 5% to 95% (non-condensing) |
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Regulatory Compliance |
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FCC, ICES, CE, UKCA, VCCI, RCM, NRTL, CB |
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Certified Safety Models |
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Certified as compliant with UL or CSA: GP202LC-B300 |
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Perchlorate Warning |
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California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. Perchlorate Material-special handling may apply. See https://www.dtsc.ca.gov/hazardouswaste/perchlorate |
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Applied Directives, Standards |
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Directives: EMC/EMI: 2014/30/EU (EMC Directive) Electromagnetic Compatibility Regulations 2016 FCC Part 15 Subpart B ICES-003 VCCI-CISPR 32 AS/NZS CISPR 32 CISPR 32 CISPR 35 BS/EN 55032 BS/EN 55035 BS/EN 61000-3-2 BS/EN 61000-3-3 BS/EN 61000-4-2 BS/EN 61000-4-3 BS/EN 61000-4-4 BS/EN 61000-4-5 BS/EN 61000-4-6 BS/EN 61000-4-8 BS/EN 61000-4-11 Environment: Delegated Directive (EU) 2015/863 Directive 2011/65/EU (RoHS) REACH Regulation EC 1907/2006 WEEE Directive 2012/19/EU California Proposition 65 Product Safety: 2014/35/EU (LVD Directive) UL/CSA 62368-1 (USA and Canada) Electrical Equipment (Safety) Regulations 2016 IEC/BS/EN 62368-1 |
