System Specifications

Processors

Intel® Xeon® 6900-series processors with P-cores that support Dual Socket BR (LGA-7529)

CPU TDP supports up to 500 W TDP CPUs (air cooled or liquid cooled)

Chipset

System on Chip

BIOS

AMI 64 MB SPI Flash

Memory

24 DIMM slots that support up to 6 TB of RDIMM DDR5 ECC memory with speeds of up to 6400 MT/s or up to 6 TB of MRDIMM DDR5 ECC memory with speeds of up to 8800 MT/s

Storage Drives

Default: Eight front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays

Option A: 16 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays

Option B: 24 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays

*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details.

PCI Expansion Slots

Up to four CXL 2.0 x16/x8 devices

Option A*:

Four PCIe 5.0 x16 FH/10.5"L double-width slots

Two PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible)

Option B*:

Eight PCIe 5.0 x8 (in x16) FH/10.5"L slots

Two PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible)

*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the Expansion Slot Configurations.

Input/Output

LAN: One RJ45 1 GbE dedicated BMC LAN port

USB: Two USB 3.0 ports (rear)

Video: One VGA port

Motherboard

X14DBM-AP; (WxL) 17" x 15.565" (43.18 x 39.54 cm)

Chassis

CSE-HS201-R000NFP; 2U rackmount; (WxHxD) 3.5" x 17.2" x 31.74" (88.9 x 437 x 806.2 mm)

System Cooling

Six counter-rotating 60 x 60 x 56-mm fans

Direct-to-chip cold plate (optional)

Power Supply

Two 2600 W redundant (1 + 1) Titanium Level (96%) power supplies

Operating Environment

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)

Operating Relative Humidity: 8% to 90% (non-condensing)

Non-operating Relative Humidity: 5% to 95% (non-condensing)

Regulatory Compliance

FCC, ICES, CE, UKCA, VCCI, RCM, NRTL, CB

Certified Safety Models

HS201-R16X14, HS201-R20X14, HS201-R26X14

Applied Directives, Standards

Directives:

EMC/EMI: 2014/30/EU (EMC Directive)

Electromagnetic Compatibility Regulations 2016

FCC Part 15 Subpart B

ICES-003

VCCI-CISPR 32

AS/NZS CISPR 32

CISPR 32

CISPR 35

BS/EN 55032

BS/EN 55035

BS/EN 61000-3-2

BS/EN 61000-3-3

BS/EN 61000-4-2

BS/EN 61000-4-3

BS/EN 61000-4-4

BS/EN 61000-4-5

BS/EN 61000-4-6

BS/EN 61000-4-8

BS/EN 61000-4-11

Environment:

Delegated Directive (EU) 2015/863

Directive 2011/65/EU (RoHS)

REACH Regulation EC 1907/2006

WEEE Directive 2012/19/EU

California Proposition 65

Product Safety:

2014/35/EU (LVD Directive)

UL/CSA 62368-1 (USA and Canada)

Electrical Equipment (Safety) Regulations 2016

IEC/BS/EN 62368-1

Perchlorate Warning

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. Perchlorate Material-special handling may apply. See https://www.dtsc.ca.gov/hazardouswaste/perchlorate