System Specifications
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Processors |
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Intel® Xeon® 6900-series processors with P-cores that support Dual Socket BR (LGA-7529) CPU TDP supports up to 500 W TDP CPUs (air cooled or liquid cooled) |
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Chipset |
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System on Chip |
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BIOS |
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AMI 64 MB SPI Flash |
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Memory |
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24 DIMM slots that support up to 6 TB of RDIMM DDR5 ECC memory with speeds of up to 6400 MT/s or up to 6 TB of MRDIMM DDR5 ECC memory with speeds of up to 8800 MT/s |
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Storage Drives |
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Default: Eight front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays Option A: 16 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays Option B: 24 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays *NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details. |
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PCI Expansion Slots |
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Up to four CXL 2.0 x16/x8 devices Option A*: Four PCIe 5.0 x16 FH/10.5"L double-width slots Two PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible) Option B*: Eight PCIe 5.0 x8 (in x16) FH/10.5"L slots Two PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible) *Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the Expansion Slot Configurations. |
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Input/Output |
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LAN: One RJ45 1 GbE dedicated BMC LAN port USB: Two USB 3.0 ports (rear) Video: One VGA port |
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Motherboard |
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X14DBM-AP; (WxL) 17" x 15.565" (43.18 x 39.54 cm) |
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Chassis |
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CSE-HS201-R000NFP; 2U rackmount; (WxHxD) 3.5" x 17.2" x 31.74" (88.9 x 437 x 806.2 mm) |
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System Cooling |
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Six counter-rotating 60 x 60 x 56-mm fans Direct-to-chip cold plate (optional) |
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Power Supply |
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Two 2600 W redundant (1 + 1) Titanium Level (96%) power supplies |
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Operating Environment |
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Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
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Regulatory Compliance |
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FCC, ICES, CE, UKCA, VCCI, RCM, NRTL, CB |
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Certified Safety Models |
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HS201-R16X14, HS201-R20X14, HS201-R26X14 |
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Applied Directives, Standards |
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Directives: EMC/EMI: 2014/30/EU (EMC Directive) Electromagnetic Compatibility Regulations 2016 FCC Part 15 Subpart B ICES-003 VCCI-CISPR 32 AS/NZS CISPR 32 CISPR 32 CISPR 35 BS/EN 55032 BS/EN 55035 BS/EN 61000-3-2 BS/EN 61000-3-3 BS/EN 61000-4-2 BS/EN 61000-4-3 BS/EN 61000-4-4 BS/EN 61000-4-5 BS/EN 61000-4-6 BS/EN 61000-4-8 BS/EN 61000-4-11 Environment: Delegated Directive (EU) 2015/863 Directive 2011/65/EU (RoHS) REACH Regulation EC 1907/2006 WEEE Directive 2012/19/EU California Proposition 65 Product Safety: 2014/35/EU (LVD Directive) UL/CSA 62368-1 (USA and Canada) Electrical Equipment (Safety) Regulations 2016 IEC/BS/EN 62368-1 |
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Perchlorate Warning |
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California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. Perchlorate Material-special handling may apply. See https://www.dtsc.ca.gov/hazardouswaste/perchlorate |