Gaudi3 OAM Key Hardware
The table below details the key components of the HL-325L.
|
Key Hardware Features |
Description |
|---|---|
|
AI ASIC |
Gaudi3 with HBM memory |
|
Main NVM Components |
SPI Flash (16 MB), I2C EEPROM (4 KB), FRU EEPROM (2 Kb) |
|
Board Management |
CPLD – LCMXO5 and two L-ASC 10 |
|
Voltage Regulators |
Onboard |
|
Monitoring |
Thermal, Voltage and Current sensors: onboard and on-die (Gaudi3) |
|
Clocks |
Onboard: 50 MHz, 156.25 MHz Input clock from the B2B connector: 100 MHz |
HL-325L Key Interfaces
|
Key Hardware Interface |
Description |
|---|---|
|
Host Link |
x16 PCIe Gen5 |
|
Networking: Card to Card and Scale-out |
48 x 112 Gb PAM4 SerDes Links |
|
JTAG |
In-field CPLD programming and low-level ASIC debug |
|
UART |
Low-level debug and BMC access |
|
I2C Master |
On/off board peripherals |
|
I2C Slave/SMBUS |
BMC control and monitoring interface |
HL-325L Key Thermal and Mechanical Properties
|
Key Thermal & Mechanical Properties Feature |
Details |
|---|---|
|
Module Dimension |
102 mm x 170 mm |
|
PCB Thickness |
185 mil / 4.7 mm |
|
Weight |
2.95 Kg |
|
Connectors |
Two Molex Mirror Mezz Connectors (MPN: 2189161115-SD) Stack height: 8-mm differential pair Impedance: 90 ohm ± 5% |
|
HL-325L, HL-338 and HL-335 Bottom Stiffener Height (including Mylar) |
8 mm ±0.15 mm |
|
Power |
Up to total of 600 W for two main input voltages rails: 44 V – 59.5 V DC (54 V Nominal): 850 W 12 V DC: 35 W 3.3 V: 9 W |
|
Ambient Temperature* |
5°C to 35°C |
|
Approach Temperature* |
10°C to 48°C, considering shadowing other components |
|
Relative Humidity |
20% to 90% |
|
Cold Boot T Temperature |
10°C |
|
Storage T Temperature |
-20°C to 85°C |
|
Airflow |
185 CFM |
|
Transportation Temperature Range |
-55°C to +85°C (short-term storage) |
|
Altitude |
Sea level to 3000 ft, without temperature derating |
*For higher temperatures, higher airflow will be required.