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Supermicro Expands Integrated Open Compute Project Portfolio to Accelerate Rack-Scale AI Data Center Deployments

  • Integrated Open Compute Project (OCP) based portfolio spans rack-scale AI/HPC systems, ORv3 and ORW racks, 48V DC power, networking, and liquid cooling solutions to enable higher-density compute in existing and new data centers
  • Portfolio extends from infrastructure to intelligent operations with DCBBS Coolants, in-rack CDUs, switches, and Supermicro System Management Software Suite for infrastructure management
  • Supermicro DCBBS brings these OCP-based technologies together into integrated rack-scale solutions, simplifying and speeding deployment across compute, power, networking, and cooling for a faster Time-to-Online (TTO)
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CIIF 2026

Shanghai, China (6.2H-B158)
Oct 12 - Oct 16, 2026

Join us for CIIF Shanghai 2026 this October

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CIIF

OCP Summit 2026

San Jose, CA (Booth # B4)
Oct 12 - Oct 15, 2026

Join us for OCP Summit 2026 this October

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Supermicro Appoints Shesha Krishnapura to Board of Directors as an Independent Director and Announces the Retirement of Judy Lin

SAN JOSE, Calif. – October 8, 2026 – Super Micro Computer, Inc. (NASDAQ: SMCI) (“Supermicro” or the “Company”), an AI, Enterprise, Storage, and 5G/Edge Total IT Solution Provider featuring Data Center Building Block Solutions® (DCBBS), today announced the appointment of Shesha Krishnapura as an independent member of its Board of Directors, effective as of October 9, 2026.

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BIG DATA & AI WORLD

Singapore (Booth #5-D44)
Sep 29 - Sep 30, 2026

Join us for BIG DATA & AI WORLD this September

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bigdata

Supermicro Now Shipping NVIDIA Vera Rubin NVL72 Racks

  • Supermicro’s DCBBS now supports all critical computing infrastructure to speed time-to-online for NVIDIA Vera Rubin NVL72 deployments
  • Full liquid-cooling stack optimized for the NVIDIA Vera Rubin platform, from cold plates to CDUs, to cooling towers
  • From a power envelope to an operational cluster: DCBBS Blueprints define a balanced bill-of-materials from 5 MW to gigawatt scale, with 1,152 GPUs and 331 TB of HBM4 per Scalable Unit
  • One accountable team across site survey, project design, integration, L11 and L12 testing, on-site deployment, and ongoing support
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LEAP 2026

Riyadh, Saudi Arabia (Booth #H5.B50)
Aug 31 - Sep 3, 2026

Join us for LEAP 2026 this September

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leap

OCP Tech Day Korea

Seoul, Korea (Booth #4)
Aug 21 - Aug 21, 2026

Join us for OCP Tech Day Korea this August

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