We have following configuration:
X7DCL-i + 825TQ-R700LPV which is an optimized chassis per your website. But the default air shroud that comes with chassis( MCP – 310– 00005 -00 ) do not fit in as it is interfered by chipset heat sink and CPU heat sink. Therefore we conducted thermal tests without air shroud in following configuration:
Mbd: X7DCL-I with latest BIOS 7DCL8188 dated 8/18
Chassis: CSE-825TQ-R700LPV
CPU: Xeon E5450 and X5460
HDD: 8* 147GB SAS 15K RPM HDD (ST3146855SS)
Memory: 6* 1GB DDR2 Reg ECC 533MHz
SAS RAID card: LSI SAS 8708ELP (8 port SAS RAID)
During the thermal test the following utilities were tested:
1. Intel’s “MaxPower Utility.exe” (at 100% load) corresponding to the CPU used
2. “IO meter test” version: 2004.07.30
3. “Crunch” version: 1.00.00 – run continuously in batch mode
Ambient temp: 35 C and 40 C
Fan speed mode: Disabled( Full speed )
But on both E5450(80 W) and X5460( 120 W ) tests, CPU temp are over specification and we get an overheat alarm. How do we resolve this issue?
For such combination, the default air shroud can’t fit in so you will need to use an active heat sink otherwise it will over heat. We do not have such active heat sink, you may need to find one, for example like below linked:
http://www.avc.com.tw/tw/products/Z6U440Y001.htm
or other active heat sinks specifically for LGA771 CPU and 2U chassis.
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