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SuperMinute: Supermicro BigTwin™



X11 Twin Family Datasheet



White Paper: CAPEX Savings and Performance Advantages of BigTwin's Memory Optimization



BigTwin™ White Paper



BigTwin Supermicro BigTwin™ Solutions


The Supermicro BigTwin™ is the first and only 2U multi-node system supporting the highest performance processor, memory, storage, I/O and an incredible 30% better thermal capacity. The 5th generation of Supermicro's Twin architecture is fully optimized for today's diverse workloads and architected for further technology breakthroughs.

  • Performance: Supporting the 2nd generation Intel® Xeon® Scalable processors up to 205W, the BigTwin achieves incredible performance in a 2U multi-node platform. Each node of the BigTwin supports up to 6TB DDR4-2933MHz in 24 DIMM slots for dramatically faster and increased memory capacity compared to previous generations of Twin systems, as well as support for Intel® Optane™ DC Persistent Memory. With up to 12 hot-swappable 2.5" drive bays per node, storage performance is accelerated with options for All-Flash NVMe, SAS or SATA drives.

  • Density: BigTwin systems boast incredibly high density with up to 4 hot swappable nodes in a 2U form factor, and double the I/O capacity of competitive 2U solutions. Support for Supermicro I/O Module (SIOM) enables flexible networking options of 1G, 10G, 25G, or 100G Ethernet or 100G InfiniBand/Omni-Path and frees up 2 low-profile PCI-E 3.0 x16 expansion slots per node.

  • Efficiency: Supermicro's Twin architecture is designed with power and cost efficiency in mind. The BigTwin reduces power consumption with shared cooling and power design, leveraging redundant 2200W high efficiency (96%) power supplies. Maximum compute in a 2U system enables data center footprints to be reduced by 50% compared to standard 2U servers with equivalent performance.





SIOM Cards
Product Brief


Generation: | Display All | X11 | X10 |

Display Filter: | Display All | 2.5" Drive Bays | 3.5" Drive Bays |





BigTwin
BigTwin™
4 NVMe/SATA3 +
2 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
6 NVMe per Node
N+1 Cooling


  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" NVMe drive bays per node; 2 M.2 SATA3 or NVMe support
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 16 Heavy duty 40x56mm fans w/ optimal fan speed control (4 fans per node)
  • 2600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 + 2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
  • 1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
6 NVMe per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" NVMe drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 +
2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
6 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3 +
8 SAS3 per Node


  • 2 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 (12Gbps) support via Broadcom 3216; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 +
2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
  • 1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
  • At least one network card must be bundled
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3108; HW RAID 0, 1, 5, 6, 10, 50, 60
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
24 NVMe support
6 NVMe per Node


  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • At least one network card must be bundled
  • 6 Hot-swap 2.5" NVMe drive bays per node
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) High-efficiency Power Supplies
Titanium Level
 
BigTwin
16 NVMe support
4 NVMe/SAS3/SATA3 +
2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • At least one network card must be bundled
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) High-efficiency Power Supplies
Titanium Level
 
BigTwin
BigTwin™
6 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • At least one network card must be bundled
  • 6 Hot-swap 2.5" SATA3 drive bays per node
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) High-efficiency Power Supplies
Titanium Level
 


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