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Whitepaper: Servers Optimized for Highest Performance-per-Watt



Energy Efficient Servers



Whitepaper: FatTwin™ Power Savings



Whitepaper: Data Center Power Saving with Supermicro



Video: FatTwin Power Savings



Video: 4-Node Front I/O



Video: FatTwin Advantage



Video: Free-Air Cooling




 

Supermicro FatTwin™ Server Solutions



Titanium Level 96% Efficiency
FatTwin™ Server Solution - Best TCO with Highest Performance-per-Watt/per-Dollar

The new generation X11 Supermicro FatTwin™ is a high-density 8/4 hot-plug node SuperServer® system available with a variety of memory capacities, HDD technologies, M.2 SSD NVMe, PCIe alternatives, and networking capabilities. The FatTwin™ supports up to: 1.5TB ECC RDIMM DDR4-2666MHz memory in 12 DIMM slots, 1 PCI-E 3.0 x16 and 1 SIOM flexible nework card 8 ports of Broadcom SAS 3.0 (12Gbps) HBA or HW RAID, 10 ports of SATA 3.0 (6Gbps) with Intel® C621 controller, redundant Titanium Level (96%) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN, and dual Intel® Xeon® Scalable processor families up to 26 cores and 165W TDP.

The Supermicro FatTwin represents a revolution in Green Computing and is highly efficient by design; this system supports customers' critical applications while reducing Data Center TCO in order to help preserve the environment, and extends the compute and storage capabilities of Supermicro's existing Twin SuperServer systems to achieve increased performance and power efficiency. Due to its shared components, the FatTwin improves cost-effectiveness and reliability, while its modular architecture makes it flexible to configure and easy to maintain.

Versatile configurations allow the FatTwin to be optimized for many different environments including Enterprise, Data Center, Cloud Computing, HPC, Financial, Science and Engineering, File and Storage Servers.

  • NEW! Support for New Generation X11 Solutions with Dual Intel® Xeon® Scalable processors up to 165W per node
  • 12 DIMM slots; Up to 1.5TB ECC RDIMM
  • Low-Profile PCI-E 3.0 x16 slot
  • SAS3/SATA3/NVMe support
  • Redundant 2200W/1200W Titanium (96%) Power Supplies



 
  Family: GPGPU, Front I/O

X10 X11

  Solution Families -
Application / Product Families: | Display All | GPGPU | Hadoop/Storage | NVMe Ready |
Display by Features: | Front / Rear I/O | 2.5" / 3.5" | 4 / 8 Node | 29" / 35" Enclosure |



Supermicro® FatTwin™ solutions support Kepler GPU cards and Coprocessor MIC. (GPU/MIC support matrix). Through parallel processing capability of GPU/MIC, Supermicro FatTwin platforms achieve even higher performance. Engineering, scientific and research fields can dramatically accelerate application performance with minimal investment in development with Supermicro®'s GPU/MIC supercomputing solutions.



SYS-F628G3-FT+

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  • Up to 2 Hot-swap 3.5" SATA (-FT+/-FTPT+) or SAS3 (-FC0+/-FC0PT+) HDDs per U
  • Outstanding high-density compute performance for Engineering and Scientific Research, Modeling, Simulation and HPC applications
  • 4 Hot-plug System Nodes in 4U, each Node:
  • Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family; QPI up to 9.6GT/s
  • 16 DIMM slots; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
  • 3 PCI-E 3.0 x16 support 3 Double-width GPU/Xeon Phi™; and 2 PCI-E 3.0 x8 Low-profile slots
  • I/O ports: 2 GbE/10GBase-T ("PT"), 1 Video, 2 USB 3.0
  • Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
  • SAS3 (12Gbps) via Broadcom 3008 controller ("C0"); SW RAID 0, 1, 10 support
  • 8x 8cm heavy duty 11K fans with air shroud and PWM fan speed control
  • 2000W Redundant Titanium Level (96%) High-efficiency Digital Power Supplies
Titanium Level

SYS-F628G2-FT+

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  • Up to 6 Hot-swap 2.5" SATA (-FT+/-FTPT+) or SAS3 (-FC0+/-FC0PT+) HDDs per U
  • Outstanding high-density compute performance for Engineering and Scientific Research, Modeling, Simulation and HPC applications
  • 4 Hot-plug System Nodes in 4U, each Node:
  • Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family; QPI up to 9.6GT/s
  • 16 DIMM slots; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
  • 3 PCI-E 3.0 x16 support 3 Double-width GPU/Xeon Phi™; and 2 PCI-E 3.0 x8 Low-profile slots
  • I/O ports: 2 GbE/10GBase-T ("PT"), 1 Video, 2 USB 3.0
  • Server Management with Onboard IPMI 2.0 through Dedicated LAN Port
  • SAS3 (12Gbps) via Broadcom 3008 controller ("C0"); SW RAID 0, 1, 10 support
  • 8x 8cm heavy duty 11K fans with air shroud and PWM fan speed control
  • 2000W Redundant Titanium Level (96%) High-efficiency Digital Power Supplies
Titanium Level

SYS-F648G2-FT+
12 GPU/Coprocessor, Front I/O

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  • Outstanding high-density compute performance for Engineering and Scientific Research, Modeling, Simulation and HPC applications
  • 2 Hot-plug System Nodes in 4U supporting 12 double-width GPU/Coprocessor, each Node:
  • Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor E5-2600 v4/v3 family
  • 8 Hot-swap 2.5" SATA3 (-FT+/-FTPT+) or SAS3 (-FC0+/-FC0PT+) HDDs; SAS3 via Broadcom 3008
  • 16 DIMM slots; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4‑2400MHz
  • 6 PCI-E 3.0 x16 support 6 Double-width GPU/Coprocessor ; and 2 PCI-E 3.0 x8 FHHL slots
  • I/O ports: 2x GbE (-FT+/-FC0+)/10GBase-T (-FTPT+/-FC0PT+), 1x Video, 2x USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 8 heavy duty rear fans, optional rear fan w/ Optimal Fan Speed Control
  • 2000W Redundant Titanium Level (96%) High-efficiency Digital Power Supplies
Titanium Level


Add-on Card Compatibility Matrices

FatTwin: AOC Compatibility Matrix • SIOM Networking Compatibility Matrix




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