Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Mainstream | WIO | DCO | GPU | Storage | Workstation | Twin | FatTwin | Ultra | Max IO |


Serverboards SKUs - Display  | ALL | UP | DP | MP | or Socket P / H4 |

 Data Center Optimized Serverboards

The Supermicro Data Center Optimized serverboard product family is designed deliver the best performance-per-watt and per-dollar to the modern data center. The serverboards in this range include an improved thermal design that utilizes power efficient components and offset processor placement to help eliminate CPU preheating; as a result, higher operating temperatures can be achieved to optimize data center Total Cost of Ownership (TCO).

The new generation X11 Supermicro server boards support up to: 2TB ECC DDR4-2933MHz memory in 8 DIMM slots with support for Intel® Optane™ DC Persistent Memory, 1 standard PCI-E 3.0 slot, 8 SATA 3.0 (6Gbps) ports with Intel® C620 controller, and up to 2x 1GbE, integrated IPMI 2.0 with KVM over dedicated LAN and dual or single Intel® Xeon® Scalable processors up to 28 cores and 140W TDP.

With best performance and energy efficiency, Supermicro Data Center Optimized serverboards are the best selection for Virtualized Hosting, Cloud Computing, and Database applications in data center environments where electric power must be minimized. Compatible Supermicro chassis include the SC801S, SC113, SC813LT, SC813T, SC815, SC823TQ, and SC825TQ.

  • 28 Cores per CPU
  • 2TB ECC 3DS LRDIMM DDR4-2933MHz
  • 140W per socket
  • 1 PCI-E 3.0 x16 (FHHL) slot
  • Redundant 600W high efficiency power supplies


Motherboard
DCO


  • Dual Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz L/RDIMM
  • 2 PCI-E 3.0 x16 slots, 3 PCI-E 3.0 x8 slots, 1 PCI-E 3.0 x4 (in x8) slot
  • M.2 Interface: SATA/PCI-E 3.0 x4; support 2260, 2280
  • 2x 1GbE LAN ports via Marvell® 88E1512
  • 1 VGA, TPM 2.0 Header, 1 COM port (header)
  • 3 USB 3.0 (2 via header, 1 Type A), 4 USB 2.0 ports (2 rear, 2 via header)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 10"
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2933MHz
  • Support for Intel® Optane™
    DCPMM
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries


Support Resources:

MBSA Tool
  • DP MB Selection Tool




Click for Logo Guidelines
Investor Relations    |   Jobs    |   Site Map    |   Follow Us    |   Terms & Conditions    |   Privacy
Copyright © 2019 Super Micro Computer, Inc. Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.