Super Micro Computer, Inc.
 

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NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Mainstream | WIO | DCO | GPU | Storage | Workstation | Twin | FatTwin | Ultra | Max IO |


Serverboards SKUs - Display  | ALL | UP | DP | MP | or Socket P / H4 |

 Max IO Serverboards

Supermicro provides innovative and first-to-market technologies that are the building blocks for today's resource optimized platforms. Rapid growth in the IoT markets and open standards are driving the need for higher levels of product integration and optimization through network connectivity, remote management, mobile communication, expanded I/O, and device to device communications using space and power efficient configurations

Supermicro's high-performance Max IO motherboards and optimized chassis offer the most extensive selection in the industry, utilizing a range of Intel® technologies from entry level Socket H4 to the high-performance enterprise level Socket P processors, which enable customers to meet the requirements of a diverse range of applications.



Motherboard
Embedded

 / 
 / 

  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C622 (X11SPM-TPF, X11SPM-TF) / C621 (X11SPM-F) chipset
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4; support 2242, 2280
  • 2x 10G SFP+ ports via Inphi CS4227 (X11SPM-TPF)
  • 2x 10GBase-T LAN ports via Intel® X557 (X11SPM-TF)
  • 2x 1GbE LAN ports via Marvell® 88E1512 (X11SPM-F)
  • IPMI 2.0 and KVM with dedicated LAN
  • 12 SATA3 (6Gbps) ports via C622/C621
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 6 USB 2.0 ports (2 rear, 4 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Support 12V DC power input
  • Form factor: Micro ATX, 9.6" x 9.6"

*Contact your Supermicro sales rep for more info.

 

Motherboard
I/O Intensive


  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x8 (in x16 slot), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
  • 2x 1GbE LAN ports via Intel® i210
  • IPMI 2.0 and KVM with dedicated LAN
  • 8 SATA3 (6Gbps) ports via C621
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 8 USB 2.0 ports (2 rear, 6 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 9.6"

*Contact your Supermicro sales rep for more info.

 

Motherboard
Max I/O (Embedded)


  • Dual Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors with 3 UPI
  • Intel® C621 chipset
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16,
    8 PCI-E 3.0 x8 or 4 PCI-E 3.0 x16 + 4 PCI-E 3.0 x8,
    1 PCI-3.0 x4 (in x8 slot)
  • M.2 Interface: PCI-E 3.0 x4; supports up to 22110
  • 2x 10GBase-T LAN ports via Intel® X550
  • 1 VGA, TPM 2.0 Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 via header, 2 via header, 1 Type A), 4 USB 2.0 (2 rear, 2 via header)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 15.12" x 13.2"

*Contact your Supermicro sales rep for more info.

 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2933MHz
  • Support for Intel® Optane™
    DCPMM
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries


Support Resources:

MBSA Tool
  • DP MB Selection Tool




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