Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Mainstream | WIO | DCO | GPU | Storage | Workstation | Twin | FatTwin | Ultra | Max IO |


Serverboards SKUs - Display  | ALL | UP | DP | MP | or Socket P / H4 |



 Supermicro Serverboards

Supermicro's new generation X11 DP and UP serverboards offer the highest levels of performance, efficiency, security and scalability in the industry with up to: 6TB DDR4-2933MHz memory in 24 DIMM slots per node with support for Intel® Optane™ DC Persistent Memory, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe hot-swap HDD/SSD support, 10GBase-T/10G SFP+/56Gbps FDR InfiniBand networking options, SATA Disk-on-Module (DOM), and IPMI 2.0 plus KVM with dedicated LAN. The SuperWorkstation boards offer in addition 7.1 HD Audio, and up to 11 USB ports.

The Supermicro X11 DP and UP Serverboards and SuperWorkstation boards support the 2nd generation Intel® Xeon® Scalable processors for exceptional performance. They are offered in a variety of form factors, including ATX, E. ATX, E.E. ATX, and several proprietary versions supporting the broadest array of market segments:

  • Data Center Optimized (DCO)
  • Application Optimized
  • Resource Optimized
  • I/O Optimized (WIO)
  • Twin
  • TwinPro™
  • FatTwin™
  • GPU/Coprocessor
  • SuperWorkstation
  • SuperStorage
  • SuperBlade®
  • MicroBlade
  • MicroCloud
  • Max IO

With these New Generation X11 Serverboard and SuperWorkstation Platforms, Supermicro offers the most extensive range of computing solutions for Data Center, Enterprise, Cloud, HPC, Hadoop/Big Data, Storage, and Embedded environments.



BigTwin
For Server SKUs only
MP, 4-Way


  • Quad Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 48 DIMMs; up to 12TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 1 PCI-E 3.0 x32 (rear left), 1 PCI-E 3.0 x40 (rear right), 1 PCI-E 3.0 x8 (in x16, rear middle), 1 PCI-E 3.0 (x32 for 2U or x48 + x8 for 4U) on front for NVMe/Internal card support. 1 PCI-E 3.0 (x32 for 2U or x48 for 4U) on front for NVMe/Internal card support
  • IPMI 2.0 and KVM with dedicated LAN
  • 12 SATA3 (6Gbps) ports
  • 1 VGA, 1 TPM Header, 1 COM (rear), 2 USB 3.0 (rear)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 16.8" x 20.5"

*Contact your Supermicro sales rep for more info.

 

BigTwin
For Server SKUs only
MP, 8-Way


  • For use in X11 8-way system (sold as a complete system only)
  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 96 DIMMs; up to 24TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM using 8x X11OPi-CPU modules
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0, M.2 Interface: 4 PCI-E 3.0 x4, 4 NVMe
  • Quad LAN with Lewisburg (on PCH board)
  • I/O: USB, Video, TPM (on PCH board)
  • Form factor: Proprietary, 11" x 14.33"

*Contact your Supermicro sales rep for more info.

 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2933MHz
  • Support for Intel® Optane™
    DCPMM
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries


Support Resources:

MBSA Tool
  • DP MB Selection Tool




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