Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Mainstream | WIO | DCO | GPU | Storage | Workstation | Twin | FatTwin | Ultra | Max IO |


Serverboards SKUs - Display  | ALL | UP | DP | MP | or Socket P / H4 |



 Supermicro Serverboards

Supermicro's new generation X11 DP and UP serverboards offer the highest levels of performance, efficiency, security and scalability in the industry with up to: 6TB DDR4-2933MHz memory in 24 DIMM slots per node with support for Intel® Optane™ DC Persistent Memory, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe hot-swap HDD/SSD support, 10GBase-T/10G SFP+/56Gbps FDR InfiniBand networking options, SATA Disk-on-Module (DOM), and IPMI 2.0 plus KVM with dedicated LAN. The SuperWorkstation boards offer in addition 7.1 HD Audio, and up to 11 USB ports.

The Supermicro X11 DP and UP Serverboards and SuperWorkstation boards support the 2nd generation Intel® Xeon® Scalable processors for exceptional performance. They are offered in a variety of form factors, including ATX, E. ATX, E.E. ATX, and several proprietary versions supporting the broadest array of market segments:

  • Data Center Optimized (DCO)
  • Application Optimized
  • Resource Optimized
  • I/O Optimized (WIO)
  • Twin
  • TwinPro™
  • FatTwin™
  • GPU/Coprocessor
  • SuperWorkstation
  • SuperStorage
  • SuperBlade®
  • MicroBlade
  • MicroCloud
  • Max IO

With these New Generation X11 Serverboard and SuperWorkstation Platforms, Supermicro offers the most extensive range of computing solutions for Data Center, Enterprise, Cloud, HPC, Hadoop/Big Data, Storage, and Embedded environments.



BigTwin
Mainstream


  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C622 chipset
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 or x8), 1 PCI-E 3.0 x8 (x0 or x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
  • 2x 10GBase-T LAN ports via Intel® X557
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C622
  • TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A) 6 USB 2.0 ports (2 rear, 4 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 9.6"
 

BigTwin
WIO

 / 

  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C622 chipset
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x32 Left Riser Slot
  • M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
  • 2x 10GBase-T LAN ports via Intel® X557
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C622
  • 4 SAS3 (12Gbps) ports via Broadcom 3008 (X11SPW-CTF)
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 7 USB 2.0 ports (2 rear, 5 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary WIO, 8.15" x 13.05"
 

BigTwin
Embedded

 / 
 / 

  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C622 (X11SPM-TPF, X11SPM-TF) / C621 (X11SPM-F) chipset
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • M.2 Interface: PCI-E 3.0 x4; support 2242, 2280
  • 2x 10G SFP+ ports via Inphi CS4227 (X11SPM-TPF)
  • 2x 10GBase-T LAN ports via Intel® X557 (X11SPM-TF)
  • 2x 1GbE LAN ports via Marvell® 88E1512 (X11SPM-F)
  • IPMI 2.0 and KVM with dedicated LAN
  • 12 SATA3 (6Gbps) ports via C622/C621
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 6 USB 2.0 ports (2 rear, 4 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Support 12V DC power input
  • Form factor: Micro ATX, 9.6" x 9.6"

*Contact your Supermicro sales rep for more info.

 

BigTwin
Cost Optimized Storage

 / 

  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C622 chipset
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 1 PCI-E 3.0 x16 (x16 or x8), 1 PCI-E 3.0 x8 (x0 or x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
  • 2 PCI-E 3.0 NVMExpress x4 Internal Ports
  • M.2 Interface: PCI-E 3.0 x4 and SATA
  • 2x 10G SFP+ ports via Inphi CS4227 (X11SPH-nCTPF)
  • 2x 10GBase-T LAN ports via Intel® X557 (X11SPH-nCTF)
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C622
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 8 USB 2.0 ports (2 rear, 6 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 9.6"

*Contact your Supermicro sales rep for more info.

 

BigTwin
I/O Intensive


  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x8 (in x16 slot), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
  • M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
  • 2x 1GbE LAN ports via Intel® i210
  • IPMI 2.0 and KVM with dedicated LAN
  • 8 SATA3 (6Gbps) ports via C621
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 8 USB 2.0 ports (2 rear, 6 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: ATX, 12" x 9.6"

*Contact your Supermicro sales rep for more info.

 

BigTwin
GPU


  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x16 Center Right slot, 1 PCI-E 3.0 x16 Left Riser slot, 1 PCI-E 3.0 x16 Right Riser Slot
  • M.2 Interface: PCI-E 3.0 x4 and SATA
  • 2x 10GBase-T LAN ports via Intel® X550
  • IPMI 2.0 and KVM with dedicated LAN
  • 6 SATA3 (6Gbps) ports via C621
  • 1 VGA, TPM Header, 1 COM (header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 4 USB 2.0 ports (2 rear, 2 via header)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary, 7.71" x 16.64"
 

BigTwin
Workstation


  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16)
  • M.2 Interface: 4 PCI-E 3.0 x4, M-Key, support 2242/2260/2280/22110
  • 1x 10GBase-T LAN port, 1x Gigabit Ethernet LAN port
  • IPMI 2.0 and KVM with dedicated LAN
  • 8 SATA3 (6Gbps) ports via C621
  • TPM Header, 2 COM ports (1 rear, 1 header)
  • 6 USB 3.1 Gen1 ports (2 via header, 4 Type A), 2 USB 2.0 ports (2 via headers)
  • Form factor: E-ATX, 12" x 13"
 

BigTwin
Workstation


  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16)
  • M.2 Interface: 4 PCI-E 3.0 x4, M-Key, support 2242/2260/2280/22110
  • 1x 10GBase-T LAN port, 1x Gigabit Ethernet LAN port
  • IPMI 2.0 and KVM with dedicated LAN
  • 8 SATA3 (6Gbps) ports via C621
  • TPM Header, 2 COM ports (1 rear, 1 header)
  • 6 USB 3.1 Gen1 ports (2 via header, 4 Type A), 2 USB 2.0 ports (2 via headers)
  • Form factor: E-ATX, 12" x 13"

*Contact your Supermicro sales rep for more info.

 

BigTwin
MicroCloud


  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C621 chipset
  • 4 DIMMs; up to 512GB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x8 (Micro LP), 1 PCI-E 3.0 x16 Slot
  • M.2 Interface: 2 SATA/PCI-E 3.0 x4
  • IPMI 2.0 and KVM with dedicated LAN
  • 2 SATA3 (6Gbps) ports via C621
  • 1 VGA, TPM Header, 1 COM port
  • 2 USB 2.0 ports (2 rear Type A)
  • Form factor: Proprietary, 4.66" x 18.5"
     
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2933MHz
  • Support for Intel® Optane™
    DCPMM
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries


Support Resources:

MBSA Tool
  • DP MB Selection Tool




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