Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Ultra | Twin | FatTwin | DCO | WIO | GPU | Mainstream | Storage | Workstation | Max IO |


  SuperServer® SKUs -  | ALL | 1U | 2U | 3U/4U | UP | DP | MP | Socket P / H4 |

 Supermicro SuperServer®

Supermicro's X11 DP and UP SuperServer®, SuperWorkstation, SuperStorage, and SuperBlade® solutions offer numerous advantages and the highest levels of performance, efficiency, security and scalability in the industry. Supermicro X11 SuperServers support the latest 2nd generation Intel® Xeon® Scalable processors and offer up to 6TB DDR4-2933MHz memory in 24 DIMMs, Intel® Optane™ DC Persistent Memory, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe hot-swap HDD/SSD support, 10GBase-T/10G SFP+/56Gbps FDR InfiniBand networking options, redundant Titanium Level (96%+) Digital power supplies, and IPMI 2.0 plus KVM with dedicated LAN. The SuperWorkstation systems offer in addition 7.1 HD Audio, and up to 11 USB ports.

The Supermicro X11 DP and UP solutions are offered in the industry's broadest variety of form factors, including 1U, 2U, 3U/Mini-Tower, 4U/Tower, and 8U SuperBlade® addressing the widest array of product/market and application segments:

  • Data Center Optimized (DCO)
  • Application Optimized
  • I/O Optimized (WIO)
  • Twin
  • TwinPro™
  • FatTwin™
  • BigTwin™
  • GPU/Coprocessor
  • SuperWorkstation
  • SuperStorage
  • SuperBlade®
  • MicroBlade
  • MicroCloud
  • Max IO

The X11 platforms enable Supermicro to offer the most extensive and technologically advanced range of computing solutions for Data Center, Enterprise, Cloud, HPC, AI/ML, Hadoop/Big Data, Storage, and Embedded environments.

Power efficiency in high availability, mission-critical applications is increased with upgraded high speed cooling architectures including high-speed fans, high-efficiency redundant Titanium Level (96%+) Digital Switching power supplies, BBP® (Battery Backup Power) and integrated SuperCap (CacheVault) power supply technologies.

When combined with full Rack Integration Services, Hardware Maintenance Services, and Data Center Management Software that manages health, power, and maintenance of servers in large deployments, Supermicro X11 Serverboard, Chassis, SuperServer®, SuperWorkstation, SuperStorage, and SuperBlade® platforms provide the most complete, scalable computing solutions with maximum performance and the highest levels of efficiency and reliability.


BigTwin
BigTwin™
6 NVMe per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" NVMe drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 + 2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
  • 1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 +
2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SATA3 +
2 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
6 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3 +
8 SAS3 per Node


  • 2 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 (12Gbps) support via Broadcom 3216; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
TwinPro² (SIOM)
Flexible Storage Options

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 / 
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  • 4 DP nodes in 2U; depth 28.5" (2029TP) / 30.5" (6029TP), Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • Storage Drive Options:
    • SYS-2029TP-HTR - 6 Hot-swap 2.5" SATA3
    • SYS-2029TP-HC0R - 6 Hot-swap 2.5" SAS3 (Broadcom 3008)
    • SYS-2029TP-HC1R - 6 Hot-swap 2.5" SAS3 (Broadcom 3108)
    • SYS-6029TP-HTR - 3 Hot-swap 3.5" SATA3
    • SYS-6029TP-HC0R - 3 Hot-swap 3.5" SAS3 (Broadcom 3008)
    • SYS-6029TP-HC1R - 3 Hot-swap 3.5" SAS3 (Broadcom 3108)
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support for flexible networking options
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 2 SuperDOM
  • 4 Heavy duty 8cm fans with optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
8 2.5" + 8 2.5"
SAS3 via Broadcom 3108

 / 

  • Compute Intensive Application/Storage, Big Data Analytics, DB Application/Processing, Mission-critical Application, Simulation and Automation
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 2.5" SAS3 drives (via Broadcom 3108), 8 Hot-swap 2.5" SATA3 drives (via Intel C620 series chipset)
  • 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8 slots
  • 2x 10GBase-T (-C1RT) / 1GbE (-C1R), 1 Dedicated IPMI port
  • 1 Video, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
  • 3 Hot-swap 80mm PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Mainstream
Cost Effective

 / 

  • Cloud, Virtualization, Compute Intensive App, DB Processing/Storage, High Availability Storage, Hosting & Application Delivery
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 3.5" SATA3 drive bays, 2 Optional fixed NVMe drives
  • 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8 Low-profile slots
  • 2x 10GBase-T (-TRT) / 1GbE (-TR) ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
  • 3 heavy duty 80mm fans with PWM fan speed control
  • 1000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
20 NVMe support
24 DDR4 DIMM
2x 25G SFP28


  • Virtualization, Hyperconverge Storage, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 2.5" drive bays; 20 NVMe + 4 SAS3/SATA
  • 1 PCI-E 3.0 x8 (LP)
  • 2x 25G SFP28 Ethernet ports, 1 Dedicated IPMI port
  • 2 VGA, 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm fans
  • 1600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin


  • Virtualization, Hyperconverge Storage, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 2.5" drive bays; 20 SAS3 + 4 SAS3/NVMe
  • 1 PCI-E 3.0 x16 (FH, 10.5"L); 5 PCI-E 3.0 x8 (FH, 10.5"L); 1 PCI-E 3.0 x8 (LP); 1 PCI-E 3.0 x8 (internal LP)
  • 4 Gigabit Ethernet ports, 1 Dedicated IPMI port
  • 2 VGA, 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm fans
  • 1600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin


  • Virtualization, Hyperconverge Storage, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 12 Hot-swap 3.5" drive bays; Optional 8 SAS3 + 4 SAS3/NVMe
  • 1 PCI-E 3.0 x16 (FH, 10.5"L); 5 PCI-E 3.0 x8 (FH, 10.5"L); 1 PCI-E 3.0 x8 (LP); 1 PCI-E 3.0 x8 (internal LP)
  • 4 Gigabit Ethernet ports, 1 Dedicated IPMI port
  • 2 VGA, 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm fans
  • 1600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
24 NVMe support
4x 10GBase-T


  • Virtualization Hosting, Cloud Computing, Data Center
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 2.5" drive bays; 24 NVMe (4 hybrid ports - SAS3 via AOC), 2 rear Hot-swap 2.5" drive bays; 2 internal M.2 (1 SATA3, 1 NVMe)
  • 2 PCI-E 3.0 x16 (FH, 10.5" L), 1 PCI-E 3.0 x8 (LP)
  • 4x 10GBase-T ports, 1 Dedicated IPMI port
  • 2 VGA (1 rear, 1 onboard), 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm PWM fans
  • 1600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
24x 2.5" Drive Bays
Opt. 20 SAS3 + 4 NVMe/SAS3
Flexible Network Opt.

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 / 
 / 
 / 

  • Virtualization Hosting, Cloud Computing, Data Center
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 2.5" drive bays; 14 SATA (opt. 20 SAS3 + 4 NVMe/SAS3)
  • Expansion Slots:
    • 8 PCI-E Slots: 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8, 1 Internal PCI-E 3.0 x8
    • 7 PCI-E Slots (SYS-2029U-TR4T): 2 PCI-E 3.0 x16, 5 PCI-E 3.0 x8
  • Networking Options:
    • SYS-2029U-TR4 - 4x 1GbE ports
    • SYS-2029U-TR4T - 4x 10GBase-T ports
    • SYS-2029U-TRT - 2x 10GBase-T ports
    • SYS-2029U-TRTP - 2x 10G SFP+ ports
    • SYS-2029U-TR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
24x 2.5" SAS3 Opt. 4 NVMe
Flexible Network Opt.

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 / 
 / 
 / 

  • Virtualization Hosting, Cloud Computing, Data Center
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 2.5" drive bays; optional 20 SAS3 + 4 NVMe/SAS3, 2 rear Hot-swap 2.5" drive bays
  • Expansion Slots:
    • 8 PCI-E Slots: 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8, 1 Internal PCI-E 3.0 x8
    • 7 PCI-E Slots (SYS-2029U-E1CR4T): 2 PCI-E 3.0 x16, 5 PCI-E 3.0 x8
  • Networking Options:
    • SYS-2029U-E1CR4 - 4x 1GbE ports
    • SYS-2029U-E1CR4T - 4x 10GBase-T ports
    • SYS-2029U-E1CRT - 2x 10GBase-T ports
    • SYS-2029U-E1CRTP - 2x 10G SFP+ ports
    • SYS-2029U-E1CR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port
  • 2 VGA (1 rear, 1 onboard), 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
12x 3.5" SATA3 Opt. 4 NVMe
Flexible Network Opt.

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 / 
 / 
 / 

  • Virtualization, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 12 Hot-swap 3.5" drive bays; Optional 8 SAS3 + 4 SAS3/NVMe and 2 Rear Hot-swap 2.5" drive bays
  • Expansion Slots:
    • 8 PCI-E Slots: 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8, 1 Internal PCI-E 3.0 x8
    • 7 PCI-E Slots (SYS-6029U-TR4T): 2 PCI-E 3.0 x16, 5 PCI-E 3.0 x8
  • Networking Options:
    • SYS-6029U-TR4 - 4x 1GbE ports
    • SYS-6029U-TR4T - 4x 10GBase-T ports
    • SYS-6029U-TRT - 2x 10GBase-T ports
    • SYS-6029U-TRTP - 2x 10G SFP+ ports
    • SYS-6029U-TR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty fans w/ optimal fan speed control
  • 1000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
12x 3.5" SAS3 opt. 4 NVMe
Flexible Network Opt.

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 / 
 / 
 / 

  • Virtualization, Hyperconverge Storage, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 12 Hot-swap 3.5" drive bays; 12 SAS3 via opt. AOC (4 hybrid ports - 4 NVMe opt.)
  • Expansion Slots:
    • 8 PCI-E Slots: 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8, 1 Internal PCI-E 3.0 x8
    • 7 PCI-E Slots (SYS-6029U-E1CR4T): 2 PCI-E 3.0 x16, 5 PCI-E 3.0 x8
  • Networking Options:
    • SYS-6029U-E1CR4 - 4x 1GbE ports
    • SYS-6029U-E1CR4T - 4x 10GBase-T ports
    • SYS-6029U-E1CRT - 2x 10GBase-T ports
    • SYS-6029U-E1CRTP - 2x 10G SFP+ ports
    • SYS-6029U-E1CR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
WIO, Flexible I/O, UP
8 Hot-swap 3.5" bays


  • Database Processing and Storage, Connectivity/Storage Computer Nodes, Data Warehouse
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 8 Hot-swap 3.5" drive bays, 1 Slim DVD-ROM bay, M.2 mini-PCI-e support
  • 4 PCI-E 3.0 x8 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 3 Hot-swap 8cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O
12 Hot-swap 3.5" bays


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 12 Hot-swap 3.5" drive bays with SES2 and Mini-i-Pass: 8 SATA3 + 4 NVMe/SATA3 hybrid ports
  • 1 PCI-E 3.0 x16 (FHHL), 2 PCI-E 3.0 x8 (FHHL), 2 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 3 high-performance 8cm heavy duty PWM fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
WIO, Flexible I/O
8 Hot-swap 3.5" and
2 Fixed 3.5" bays


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 3.5" drive bays with SGPIO, 2 Fixed 3.5" drive bays
  • 4 PCI-E 3.0 x8 (FHHL), 2 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 3 high-performance 8cm heavy duty PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
11 PCI-E Slots
16 Hot-swap 2.5", 1 Peripheral 5.25"


  • 2U Max I/O Server - Expansion / Performance / Flexibility
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 2.5" drive bays and 1 peripheral 5.25" bay
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16 (HSSI), 2 PCI-E 3.0 x16 (or 4 PCI-E x8), 4 PCI-E 3.0 x8 , 1 PCI-E 3.0 x4 (in x8 slot)
  • 1 PCI-E 3.0 x4 M.2 2280 slot from PCH
  • 2 GbE, 1 Video, 2 COM, 2 USB 3.0 (rear), 4 USB 2.0 (rear), 1 Type A
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 4x 80mm 7K RPM middle fans
  • 1000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
24 Hot-swap 2.5" SAS3/SATA3

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-2029P-ACR24H - SAS3 via Broadcom 3108 AOC
    • SSG-2029P-ACR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
24 Hot-swap 2.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 2.5" SAS3/SATA3 drive bays
  • Storage Options:
    • SSG-2029P-E1CR24H - SAS3 via Broadcom 3108 AOC
    • SSG-2029P-E1CR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
24 Hot-swap 3.5" SAS3/SATA3 drive bays + 2 Hot-swap 2.5" drive bays (rear)

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Hot-swap 2.5" drive bays (rear)
  • Storage Options:
    • SSG-6029P-E1CR24H – SAS3 via Broadcom 3108 AOC
    • SSG-6029P-E1CR24L – SAS3 via Broadcom 3008 AOC
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 80mm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
12 Hot-swap 3.5" SAS3/SATA3
SAS3 via Broadcom 3108


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3 (via Broadcom 3108)/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
12 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6029P-E1CR12H - SAS3 via Broadcom 3108 AOC
    • SSG-6029P-E1CR12L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
16 Hot-swap 3.5" SAS3/SATA3
SAS3 via Broadcom 3108


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 3.5" SAS3 (via Broadcom 3108)/SATA3 drive bays
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
12 Hot-swap 3.5" SAS3/SATA3


  • Application and data serving, Connectivity/Storage Compute Nodes, High Availability Storage Appliance Platform
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 3 High-performance 80mm PWM fans
  • 800W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
2U Ultra 4-Way
112 Cores per System
48 DDR4 DIMMs


  • High End Enterprise Server, in-memory database, Business Intelligence, High Performance Computer Cluster, Virtualization, ERP, CRM
  • Quad Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 11 PCI-E 3.0 total: 5 PCI-E 3.0 x8 and 6 PCI-E 3.0 x16 slots
  • 48 DIMMs; up to 12TB 3DS ECC DDR4‑2399 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 2.5" drive bays: 4 U.2 NVMe + 20 SAS3 opt. via AOC
  • 4 GbE via AOC, 1 dedicated IPMI
  • 1 VGA, 1 COM, 2 USB 3.0 (rear)
  • 4 heavy duty 8cm PWM fans
  • 1600W (1+1) Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin


  • 2U 2-Node Mission critical storage server
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support for flexible networking options
  • Dual port 10GBase-T (Intel® X557-AT2), 1 Dedicated IPMI port.
  • 1 VGA, 2 USB 3.0, 1 Type A,1x TPM header
  • 5x 8cm high-performance PWM fans w/ optimal fan speed control.
  • Lowest latency:
    • 24 U.2 Hot-swap dual-port NVMe drive bays
    • Omni-Path SIOM support
  • Robust Data Availability:
    • Shared storage between redundant controllers
    • Node to node heartbeat/ NTB connectivity
    • Dual 10G private Ethernet between nodes
    • Redundant power supply and cooling system
  • Greener Storage:
    • Titanium Level (96%+) efficiency 2000W redundant power supplies
    • 90%+ VRM power efficiency

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
48 Hot-swap 2.5" SAS3/SATA3 drive bays + 2 Hot-swap 2.5" drive bays (rear)

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 48 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Hot-swap 2.5" drive bays (rear)
  • Storage Options:
    • SSG-2029P-E1CR48H – SAS3 via Broadcom 3108 AOC
    • SSG-2029P-E1CR48L – SAS3 via Broadcom 3008 AOC
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 80mm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
10 EDSFF (E1.S) per Node

 (Coming Soon)
  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4 2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 10 EDSFF (E1.S) drive bays and 2 SATA M.2 drive bays per node.
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 Heavy duty 8cm PWM fans w/ optimal fan speed control
  • 2600W Redundant Titanium Level (96%) Power Supplies

* Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
6 NVMe per Node
N+1 Cooling


  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" NVMe drive bays per node; 2 M.2 SATA3 or NVMe support
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 16 Heavy duty 40x56mm fans w/ optimal fan speed control (4 fans per node)
  • 2600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Up to 6 NVIDIA GPUs


  • GPU Server, Mission-critical app., enterprise server, oil & gas, large database, e-business, on-line transaction processing, medical
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 2.5" SAS/SATA drive bays, 2 Hot-swap 2.5" SAS/SATA/NVMe drive bays
  • 6 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 (in x16) slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (rear)
  • 5 heavy duty fans w/ optimal fan speed control
  • 2000W Redundant Platinum Level Power Supplies

*Contact your Supermicro sales rep for more info.

 
BigTwin
BigTwin™
3 NVMe/SAS3 + 3 SAS3 per Node


  • 2 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processor; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 NVMe/SAS3 + 3 SAS3 Hot-swap 3.5" drive bays per node, 2 Internal M.2 NVMe/SATA slots
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
BigTwin™
3 NVMe/SAS3 per Node


  • 4 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 Hot-swap NVMe/SAS3 drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin


  • 2 DP nodes in 2U; depth 28.5", Each Node (x2 nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz L/RDIMM
  • 2 PCI-E 3.0 x8 (FHHL) or 1 PCI-E 3.0 x8 (FHHL) + 1 PCI-E 3.0 x4 (FHHL) + 1 PCI-E 3.0 x4 (LP) (8/8/0 or 8/4/4)
  • 6 Hot-swap 3.5" SATA3 drive bays
  • 2x 1GbE LAN ports, 1 dedicated IPMI port
  • I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
  • 4 heavy duty fans w/ optimal fan speed control
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin


  • 4 DP nodes in 2U, depth 28.5", Each Node (x4 nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz L/RDIMM
  • 1 PCI-E 3.0 x16 (LP) slot
  • 3 Hot-swap 3.5" SATA3 drive bays
  • 2x 1GbE LAN ports, 1 dedicated IPMI port
  • I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
  • 4 heavy duty fans w/ optimal fan speed control
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2933MHz
  • Support for Intel® Optane™
    DCPMM
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

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