Super Micro Computer, Inc.
 

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SuperServer®
Storage
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SuperWorkstation
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NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD




 

Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Ultra | Twin | FatTwin | DCO | WIO | GPU | Mainstream | Storage | Workstation | Max IO |


  SuperServer® SKUs -  | ALL | 1U | 2U | 3U/4U | UP | DP | MP | Socket P (E5) / H4 (E3) |

 FatTwin™ Server Solutions

The new generation X11 Supermicro FatTwin™ is a high-density 8/4 hot-plug node SuperServer® system available with a variety of memory capacities, HDD technologies, M.2 SSD NVMe, PCIe alternatives, and networking capabilities. The FatTwin™ supports up to: 1.5TB ECC RDIMM DDR4-2666MHz memory in 12 DIMM slots, 1 PCI-E 3.0 x16 and 1 SIOM flexible nework card 8 ports of Broadcom SAS 3.0 (12Gbps) HBA or HW RAID, 10 ports of SATA 3.0 (6Gbps) with Intel® C621 controller, redundant Titanium Level (96%) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN, and dual Intel® Xeon® Scalable processor families up to 26 cores and 165W TDP.

The Supermicro FatTwin™ represents a revolution in Green Computing and is highly efficient by design; this system supports customers' critical applications while reducing Data Center TCO in order to help preserve the environment, and extends the compute and storage capabilities of Supermicro's existing Twin SuperServer® systems to achieve increased performance and power efficiency. Due to its shared components, the FatTwin™ improves cost-effectiveness and reliability, while its modular architecture makes it flexible to configure and easy to maintain.

Versatile configurations allow the FatTwin™ to be optimized for many different environments including Enterprise, Data Center, Cloud Computing, HPC, Financial, Science and Engineering, File and Storage Servers.

  • NEW! Support for New Generation X11 Solutions with Dual Intel® Xeon® Scalable processors up to 165W per socket
  • 12 DIMM slots; Up to 1.5TB ECC RDIMM
  • Low-Profile PCI-E 3.0 x16 slot
  • SAS3/SATA3/NVMe support
  • Redundant 2200W/1200W Titanium (96%) Power Supplies

SuperServer
Rear I/O, 8-Node, Each:
6 Hot-swap 2.5" SAS3/SATA3/NVMe opt.

 / 
 / 
 / 

  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • Storage Options (all Hot-swap):
    • SYS-F619P2-RT – 6x 2.5" SATA3
    • SYS-F619P2-RTN – 6x 2.5" SATA3 or 2 SATA3 + 4 NVMe U.2
    • SYS-F619P2-RC0 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F619P2-RC1 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 3x 4cm 20k RPM middle fans
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
Rear I/O, 4-Node, Each:
8 Hot-swap 3.5" SAS3/SATA3/NVMe opt.

 / 
 / 
 / 

  • FatTwin™ Server; EACH NODE (x4 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • Storage Options (all Hot-swap):
    • SYS-F629P3-RTB – 8x 3.5" SATA3
    • SYS-F629P3-RTBN – 8x 3.5" SATA3 or 6 SATA3 + 2 NVMe U.2
    • SYS-F629P3-RC0B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F629P3-RC1B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 2x 8cm 14k RPM middle fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
Rear I/O, 8-Node, Each:
6 Hot-swap 2.5"

 / 
 / 

  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: 
  • Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • Storage Options (all Hot-swap):
    • SYS-F619P2-RTN – 6x 2.5" SATA3 or 2 SATA3 + 4 NVMe U.2
    • SYS-F619P2-RC0 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F619P2-RC1 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 3x 4cm 20k RPM middle fans
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
Rear I/O, 4-Node, Each:
8 Hot-swap 3.5"

 / 
 / 

  • FatTwin™ Server; EACH NODE (x4 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • Storage Options (all Hot-swap):
    • SYS-F629P3-RTBN – 8x 3.5" SATA3 or 6 SATA3 + 2 NVMe U.2
    • SYS-F629P3-RC0B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F629P3-RC1B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 2x 8cm 14k RPM middle fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2666MHz
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

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