Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Ultra | Twin | FatTwin | DCO | WIO | GPU | Mainstream | Storage | Workstation | Max IO |


  SuperServer® SKUs -  | ALL | 1U | 2U | 3U/4U | UP | DP | MP | Socket P (E5) / H4 (E3) |

2U 48 NVMe Simply Double 45-Bay Top-Loading Storage
 SuperStorage Solutions

New generation X11 Supermicro SuperStorage systems support node based deployment strategies where CPU and HDD capacity scale together, or deployments can be expanded using JBODs for improved economy. Low-latency SSD applications, large media files requiring massive capacity and enterprise workloads looking for the highest performance will benefit from Supermicro's SAS 3.0 (12Gbps) support which provides low-latency and maximum data bandwidth. The Supermicro SuperStorage systems offer a no compromise storage platform with flexible market entry points from 2U, 3U, and 4U form factors using 2.5" or 3.5" SSDs/HDDs. SuperStorage servers support up to: 1TB 3DS ECC LRDIMM or 256GB ECC RDIMM memory, PCI-E 3.0 slots, NVMe, flexible networking options such as 10G SFP+, 10GBase-T LAN ports and IPMI 2.0 and KVM with dedicated LAN, and have support for the latest Intel® Xeon® Scalable processors.

Supermicro SuperStorage solutions present a number of key benefits to customers working with CPU Intensive Storage, Virtual Storage, Single Instance Storage and Data Deduplication, Data Replication and Business Continuity, and Virtual Tape Library customer environments.

Key Benefits:

  • Complete Portfolio of open industry standard storage offerings optimized for Microsoft, VMWare, RedHat and Software Defined Storage solutions
  • Maximum Performance – Full NVMe support, in hybrid expander and direct attach storage backplane with up to 20 GB/s throughput
  • Maximum Efficiency – High capacity 2U, 3U and 4U form factors with industry leading density. Highest efficiency platinum rated power supplies (95% power efficient)
  • Mission Critical Reliability – Fully redundant, fault-tolerant architecture with hot swappable drive bays, power supplies and cooling fans. The active-active capable JBOD hardware is perfect for mission critical applications

SuperServer
12 Hot-swap 3.5"
SAS3/SATA3 + 4 Hot-
swap 2.5" NVMe/SATA


  • High Density Storage, Object Storage 1U, Ceph / Hadoop, Scale-out Storage, Big Data Analytics
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 4 Hot-swap 2.5" NVMe/SATA drive bays
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0, 1 TPM header
  • 6x 4cm 20.5K RPM cooling fans
  • 600W Redundant Platinum Level Power Supplies
 
SuperServer
24 Hot-swap 2.5" SAS3/SATA3

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-2029P-ACR24H - SAS3 via Broadcom 3108 AOC
    • SSG-2029P-ACR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
24 Hot-swap 2.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 2.5" SAS3/SATA3 drive bays
  • Storage Options:
    • SSG-2029P-E1CR24H - SAS3 via Broadcom 3108 AOC
    • SSG-2029P-E1CR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
24 Hot-swap 3.5" SAS3/SATA3 drive bays + 2 Hot-swap 2.5" drive bays (rear)

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Hot-swap 2.5" drive bays (rear)
  • Storage Options:
    • SSG-6029P-E1CR24H – SAS3 via Broadcom 3108 AOC
    • SSG-6029P-E1CR24L – SAS3 via Broadcom 3008 AOC
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4 2400MHz
  • 2 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 80mm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
12 Hot-swap 3.5" SAS3/SATA3
SAS3 via Broadcom 3108


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3 (via Broadcom 3108)/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
12 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6029P-E1CR12H - SAS3 via Broadcom 3108 AOC
    • SSG-6029P-E1CR12L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
16 Hot-swap 3.5" SAS3/SATA3
SAS3 via Broadcom 3108


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 3.5" SAS3 (via Broadcom 3108)/SATA3 drive bays
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
16 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6039P-E1CR16H - SAS3 via Broadcom 3108 AOC
    • SSG-6039P-E1CR16L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
24 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24" Hot-swap 3.5 SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6049P-E1CR24H - SAS3 via Broadcom 3108 AOC
    • SSG-6049P-E1CR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
36 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6049P-E1CR36H - SAS3 via Broadcom 3108 AOC
    • SSG-6049P-E1CR36L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
12 Hot-swap 3.5" SAS3/SATA3


  • Application and data serving, Connectivity/Storage Compute Nodes, High Availability Storage Appliance Platform
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 3 High-performance 80mm PWM fans
  • 800W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer
36 Hot-swap 3.5" SAS3/SATA3


  • Connectivity/Storage Compute Nodes, Database Processing & Storage Appliance Platform
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via Intel X722 + X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 7 High-performance 80mm PWM fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer


  • IOPS Intensive Storage App., DB App. (MySQL, Casandra), Hyperconverged Infrastructure / Scale-out Architectures
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 32 Hot-swap NF1 drive bays, 4 hybrid PCI-E NF1 or SATA3 M.2 drive bays
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0, 1 TPM header
  • 8x 4cm counter-rotating cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer


  • 2U 2-Node Mission critical storage server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 DIMMs; Up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz;
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support for flexible networking options
  • Dual port 10GBase-T (Intel® X557-AT2), 1 Dedicated IPMI port.
  • 1 VGA, 2 USB 3.0, 1 Type A,1x TPM header
  • 5x 8cm high-performance PWM fans w/ optimal fan speed control.
  • Lowest latency:
    • 24 U.2 Hot-swap dual-port NVMe drive bays
    • Omni-Path SIOM support
  • Robust Data Availability:
    • Shared storage between redundant controllers
    • Node to node heartbeat/ NTB connectivity
    • Dual 10G private Ethernet between nodes
    • Redundant power supply and cooling system
  • Greener Storage:
    • Titanium Level (96%+) efficiency 2000W redundant power supplies
    • 90%+ VRM power efficiency
Titanium Level
 
SuperServer
48 Hot-swap 2.5" SAS3/SATA3 drive bays + 2 Hot-swap 2.5" drive bays (rear)

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 48 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Hot-swap 2.5" drive bays (rear)
  • Storage Options:
    • SSG-2029P-E1CR48H – SAS3 via Broadcom 3108 AOC
    • SSG-2029P-E1CR48L – SAS3 via Broadcom 3008 AOC
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4 2400MHz
  • 2 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 80mm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer

 / 

  • Backup Storage, Cold Storage; Database Applications; Data Warehousing, Archiving
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays (NVMe/SATA optional)
  • Storage Options:
    • SSG-5049P-E1CR45H – SAS3 via Broadcom 3108 AOC
    • SSG-5049P-E1CR45L – SAS3 via Broadcom 3008 AOC
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2 GbE LAN ports via Intel i210, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 5 Hot-swap 8cm redundant PWM fans
  • 1600W Redundant Platinum Level Power Supplies
 
SuperServer

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays, 6 optional NVMe bays
  • Storage Options:
    • SSG-6049P-E1CR45H – SAS3 via Broadcom 3108 AOM
    • SSG-6049P-E1CR45L – SAS3 via Broadcom 3008 AOM
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card slot
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 1600W Redundant Platinum Level Power Supplies
 
SuperServer


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays, 6 optional NVMe bays
  • Storage Options:
    • SSG-6049P-E1CR45L+ – SAS3 via Broadcom 3616 AOM
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card slot
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 1600W Redundant Platinum Level Power Supplies
 
SuperServer

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 60 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays
  • Storage Options:
    • SSG-6049P-E1CR60H – SAS3 via Broadcom 3108 AOM
    • SSG-6049P-E1CR60L – SAS3 via Broadcom 3008 AOM
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 2000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
SuperServer


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 60 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays
  • Storage Options:
    • SSG-6049P-E1CR60L+ – SAS3 via Broadcom 3616 AOM
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 2000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2666MHz
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

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