Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Ultra | Twin | FatTwin | DCO | WIO | GPU | Mainstream | Storage | Workstation | Max IO |


  SuperServer® SKUs -  | ALL | 1U | 2U | 3U/4U | UP | DP | MP | Socket P / H4 |

 Supermicro SuperServer®

Supermicro's X11 DP and UP SuperServer®, SuperWorkstation, SuperStorage, and SuperBlade® solutions offer numerous advantages and the highest levels of performance, efficiency, security and scalability in the industry. Supermicro X11 SuperServers support the latest 2nd generation Intel® Xeon® Scalable processors and offer up to 6TB DDR4-2933MHz memory in 24 DIMMs, Intel® Optane™ DC Persistent Memory, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe hot-swap HDD/SSD support, 10GBase-T/10G SFP+/56Gbps FDR InfiniBand networking options, redundant Titanium Level (96%+) Digital power supplies, and IPMI 2.0 plus KVM with dedicated LAN. The SuperWorkstation systems offer in addition 7.1 HD Audio, and up to 11 USB ports.

The Supermicro X11 DP and UP solutions are offered in the industry's broadest variety of form factors, including 1U, 2U, 3U/Mini-Tower, 4U/Tower, and 8U SuperBlade® addressing the widest array of product/market and application segments:

  • Data Center Optimized (DCO)
  • Application Optimized
  • I/O Optimized (WIO)
  • Twin
  • TwinPro™
  • FatTwin™
  • BigTwin™
  • GPU/Coprocessor
  • SuperWorkstation
  • SuperStorage
  • SuperBlade®
  • MicroBlade
  • MicroCloud
  • Max IO

The X11 platforms enable Supermicro to offer the most extensive and technologically advanced range of computing solutions for Data Center, Enterprise, Cloud, HPC, AI/ML, Hadoop/Big Data, Storage, and Embedded environments.

Power efficiency in high availability, mission-critical applications is increased with upgraded high speed cooling architectures including high-speed fans, high-efficiency redundant Titanium Level (96%+) Digital Switching power supplies, BBP® (Battery Backup Power) and integrated SuperCap (CacheVault) power supply technologies.

When combined with full Rack Integration Services, Hardware Maintenance Services, and Data Center Management Software that manages health, power, and maintenance of servers in large deployments, Supermicro X11 Serverboard, Chassis, SuperServer®, SuperWorkstation, SuperStorage, and SuperBlade® platforms provide the most complete, scalable computing solutions with maximum performance and the highest levels of efficiency and reliability.


BigTwin
Mainstream, UP


  • Web Hosting, VM, Application and Data Serving, DB Applications
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 4 Hot-swap 3.5" SATA3 drive bays, M.2 mini-PCI-e support
  • 1 PCI-E 3.0 x16 slot
  • 2x 10GBase-T ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4x 40mm mid-fan
  • 350W Platinum Level Power Supply
 
BigTwin
Mainstream, UP


  • Web Hosting, VM, Application and Data Serving, DB Applications, Mission-critical Applications
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 4 Hot-swap 3.5" SATA3 drive bays, M.2 mini-PCI-e support
  • 1 PCI-E 3.0 x16 slot
  • 2x 10GBase-T ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4x 40mm mid-fan
  • 400W Redundant Platinum Level Power Supplies
 
BigTwin
Mainstream, UP


  • Web Hosting, VM, Compact Network Appliance
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 Hot-swap 3.5" SATA3 drive bays, M.2 PCIe 3.0 x4
  • 1 PCI-E 3.0 x16 slot
  • 2x 1GbE ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4x 40mm mid-fan
  • 350W Platinum Level Power Supply

*Contact your Supermicro sales rep for more info.

 
BigTwin
Mainstream, UP


  • Web Hosting, VM, Compact Network Appliance
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 Hot-swap 3.5" SATA3 drive bays, M.2 PCIe 3.0 x4
  • 1 PCI-E 3.0 x16 slot
  • 2x 1GbE ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4x 40mm mid-fan
  • 400W Redundant Platinum Level Power Supply

*Contact your Supermicro sales rep for more info.

 
BigTwin
WIO, Flexible I/O, UP
10 Hot-swap 2.5" bays
2 NVMe w/ AOC opt.


  • Database Processing and Storage, Data Center Applications
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 10 Hot-swap 2.5" drive bays, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O, UP
4 Hot-swap 3.5" bays


  • Database Processing and Storage, Data Center / Firewall Applications
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 4 Hot-swap 3.5" drive bays, 1 slim DVD-ROM bay, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 600W Multi Output Platinum Level Power Supply
 
BigTwin
WIO, Flexible I/O, UP
4 Hot-swap 3.5" bays


  • Database Processing and Storage, Data Center / Firewall Applications
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 4 Hot-swap 3.5" drive bays, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O, UP
8 Hot-swap 3.5" bays


  • Database Processing and Storage, Connectivity/Storage Computer Nodes, Data Warehouse
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 8 Hot-swap 3.5" drive bays, 1 Slim DVD-ROM bay, M.2 mini-PCI-e support
  • 4 PCI-E 3.0 x8 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 3 Hot-swap 8cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
 
BigTwin
Up to 2 NVIDIA GPUs in 1U


  • HPC cluster computer nodes
  • Single Socket P (LGA 3647) supports: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" SAS/SATA drive bays
  • 2 PCI-E 3.0 x16 (right riser) and 1 PCI-E x16 (left riser) slots
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear)
  • 8 heavy duty 4cm counter-rotating fans with air shroud
  • 1400W Platinum Level (94%) Power Supply

*Contact your Supermicro sales rep for more info.

 
BigTwin
Up to 2 NVIDIA GPUs in 1U


  • HPC cluster computer nodes
  • Single Socket P (LGA 3647) supports: 2nd Gen. Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 Hot-swap 3.5" SAS/SATA drive bays
  • 1 slim DVD-ROM bay or 1 USB + COM port tray
  • 2 PCI-E 3.0 x16 (right riser) and 1 PCI-E x16 (left riser) slots
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear)
  • 8 heavy duty 4cm counter-rotating fans with air shroud
  • 1400W Platinum Level (94%) Power Supply

*Contact your Supermicro sales rep for more info.

 
BigTwin
12 Hot-swap 3.5" SAS3/SATA3


  • Application and data serving, Connectivity/Storage Compute Nodes, High Availability Storage Appliance Platform
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 3 High-performance 80mm PWM fans
  • 800W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
36 Hot-swap 3.5" SAS3/SATA3


  • Connectivity/Storage Compute Nodes, Database Processing & Storage Appliance Platform
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via Intel X722 + X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 7 High-performance 80mm PWM fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin

 / 

  • Backup Storage, Cold Storage; Database Applications; Data Warehousing, Archiving
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays (NVMe/SATA optional)
  • Storage Options:
    • SSG-5049P-E1CR45H – SAS3 via Broadcom 3108 AOC
    • SSG-5049P-E1CR45L – SAS3 via Broadcom 3008 AOC
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2 GbE LAN ports via Intel i210, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 5 Hot-swap 8cm redundant PWM fans
  • 1600W Redundant Platinum Level Power Supplies

*Contact your Supermicro sales rep for more info.

 
BigTwin


  • Designed for Content Creation, Engineering and  Scientific applications
  • Single socket R4 supports Intel® Xeon® processor W Family; Intel® C422 Chipset
  • 4 Fixed 3.5" drive bays; 2 optional 5.25" Peripheral drive bays
  • 3 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 slots, 2 U.2, 2 M.2 M key
  • Up to 512GB Registered ECC LRDIMMs, up to DDR4‑2666MHz; in 8 DIMM slots
  • Dual GbE LAN ports
  • 6 SATA3 ports via PCH; RAID 0, 1, 5, 10
  • 2 USB 3.1 (2 Type A), 6 USB 3.0 (4 rear, 2 headers), 6 USB 2.0 (2 rear, 4 headers)
  • ALC 1220 7.1 HD Audio
  • 1x 12cm front cooling fan
  • 900W High Efficiency Power Supply
 
BigTwin

 (Coming Soon)
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 3.5" SAS3/SATA3 drive bays (SATA3 by default) with SGPIO
  • 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16) slots
  • 1x 10GBase-T and 1x 1GbE port, 1 dedicated IPMI port
  • 1 VGA, 1 COM, 6 USB 3.1 Gen1, 4 USB 3.1 Gen2, M.2, 7.1 HD Audio
  • 2 Super quiet PWM fans and 1 Super quiet rear fan
  • 1200W Platinum Level Power Supply

*Contact your Supermicro sales rep for more info.

 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2933MHz
  • Support for Intel® Optane™
    DCPMM
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

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