Super Micro Computer, Inc.
 

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Storage
Motherboards
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WIO
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MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management

Supermicro UP Solutions based on Intel® Xeon® processors E3 Series


[   Introduction   |   Server   |   Workstation/Desktop   |   Motherboards   ]


  Supermicro® UP Motherboards - Best Power & Performance with Improved I/O

Supermicro leverages its deep expertise in server technology to bring customers the newest generation in UP server solutions with the X10 series of serverboards. These advanced technology building blocks offer the best server performance with the latest Intel® Xeon® E3-1200 v3/v4 CPUs, up to 4 DIMMs operating at 1600MHz, USB 3.0, onboard SAS 2.0 or SATA 3.0 (6Gbps) HDDs, onboard IPMI, and advanced options such as quad Gigabit Ethernet LAN. Power efficiency is not sacrificed due to DDR3L (1.5v) support, LV CPU SKUs, digital platinum level high-efficiency power supplies, and application optimized cooling.

The best technologies require the best management tools and support. Supermicro customer services include 3-year limited warranty, 4-hour and 24-hour repair service options, Rack Solution and Integration Services, Global Logistics, and highest-availability Global SKUs. Advanced management tools such as onboard IPMI 2.0 remote management support and advanced power management tools make the Supermicro customer experience more efficient and cost-effective.

With best performance, leadership I/O, focus on energy efficiency, and continued advancements in customer support and services, Supermicro new generation server solutions are the optimal solution for SMB, Enterprise, and Public Sector Cloud Computing, Hadoop, Big Data, Data Centers, HPC, Storage, and General Server needs.


  Serverboard Solutions - |  All  |  DCO  |  MicroCloud  |  Embedded  |  HPC  |  Workstation  |


Cost Optimized
 
MBD-X10SLM-F
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th Gen Core i3
   processor (formerly codenamed Haswell); Socket H3 (LGA 1150)
• Intel® C224 PCH Express Chipset
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• 4 SATA3 (6Gbps, RAID 0, 1, 5, 10) and 2 SATA2 (3Gbps, RAID 0, 1)
• 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x8, 1 PCI-E 2.0 x4 (in x8) slots
• Video: Aspeed AST2400 BMC
• 4x USB 3.0 (1 Type-A, 3 via header)
• 6x USB 2.0 (4 rear, 2 via header)
• Dual GbE LAN ports (1x via Intel® i217LM + 1x via Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN (X10SLM-F)
SATA DOM power connector support; TPM 1.2 header
• Form factor: uATX, 9.6" x 9.6"
 


Cost Optimized
 
MBD-X10SLM+-F
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th Gen Core i3
   processor (formerly codenamed Haswell); Socket H3 (LGA 1150)
• Intel® C224 PCH Express Chipset
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• 4 SATA3 (6Gbps, RAID 0, 1) and 2 SATA2 (3Gbps, RAID 0, 1, 10, 5)
• 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x8, 1 PCI-E 2.0 x4 (in x8) slots
• Video: Aspeed AST2400 BMC
• 4x USB 3.0 (2 rear, 1 Type-A, 1 via header)
• 6x USB 2.0 (2 rear, 4 via header)
• Dual GbE LAN ports (2x via Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN
SATA DOM power connector support; TPM 1.2 header
• Form factor: uATX, 9.6" x 9.6"
 


Quad GbE LAN ports onboard
 
MBD-X10SLM+-LN4F
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th Gen Core i3
   processor (formerly codenamed Haswell); Socket H3 (LGA 1150)
• Intel® C224 PCH Express Chipset
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• 4 SATA3 (6Gbps, RAID 0, 1) and 2 SATA2 (3Gbps, RAID 0, 1, 10, 5)
• 1 PCI-E 3.0 x16 and 1 PCI-E 2.0 x2 (in x8) slots
• Video: Aspeed AST2400 BMC
• 4x USB 3.0 (2 rear, 1 Type-A, 1 via header)
• 6x USB 2.0 (2 rear, 4 via header)
• Quad GbE LAN ports (4x via Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN
SATA DOM power connector support; TPM 1.2 header
• Form factor: uATX, 9.6" x 9.6"
 





New Generation of
Computing Excellence:

  • 22nm Process Technology
    - Improved CPU Performance
    - Integrated VR

  • Graphics w/ DX11.1 & OCL1.2
    - Performance Increase
    - Digital Display Repartition
    - 1 VGA + 2 Digital Displays

  • 2013/4 Platform Compatibility
    - LGA 1150 Socket
    - 2 Channel DDR3L
      (up to 4 DIMMs at 1600MHz)
    - 95W / 80W / 45W / 13W
      Thermal Solutions

  • C220 PCH Express Chipset
    - Feature Rich PCH
    - Lowest Cost, Lowest Power

  • I/O Flexibility
    - Up to 8 PCIe Ports, 6 USB 3.0
       or 6 SATA3 Ports
    - Improved I/O Bandwidth
    - Lower Power
    - TPM Support

  • Faster SMLink
    - For LAN integration


New Generation of Computing Excellence



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