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Server Management

Supermicro UP Solutions based on Intel® Xeon® processors E3 Series


[   Introduction   |   Server   |   Workstation/Desktop   |   Motherboards   ]



  Supermicro® UP Servers - Best Power & Performance with Improved I/O

With energy and expansion costs rising worldwide, Data Centers and Cloud service providers need server and storage solutions that offer greater savings in operating efficiency and capacity. To achieve these goals Supermicro leverages its deep expertise in server technology to bring customers its newest, X10 series of server solutions. These advanced technology servers offer the best processing performance with the latest Intel® Xeon® E3-1200 v3/v4 CPUs and up to 4 DIMMs operating at 1600MHz, with enhanced I/O performance provided by USB 3.0, PCI-E 3.0, SAS 2.0 or SATA 3.0 (6Gbps) HDDs, and quad Gigabit Ethernet LAN technologies. Power efficiency is improved with DDR3L (1.5v) support, LV CPU SKUs, Gold Level high-efficiency power supplies, and application optimized cooling. Supermicro on-board IPMI 2.0 provides cost-effective remote management for latest generation, high-performance SuperServer® solutions.

  Server Solutions - |  All  |  1U  |  3U (MicroCloud)  |


X10SLL-F +
SC512F-350B

SYS-5018D-MF
• Client nodes, firewalls, web, email, file servers, e-business,
   clustering, NAS storage, and other space constrained applications
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th Gen
   Core i3/Pentium/Celeron processor; Socket H3 (LGA 1150)
• Intel® C222 PCH Express Chipset
• 2x Internal 3.5" HDD bays (2.5" option)
• 1x PCI-E 3.0 x8 (in x16) Expansion Slot
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• Dual GbE LAN ports (1x Intel® i217LM + 1x Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN
• 2x SATA3 (6Gbps, RAID 0, 1), 4x SATA2 (3Gbps, RAID 0, 1, 10, 5)
• 2x USB 3.0 (1 Type-A, 1 via header)
• 6x USB 2.0 (4 rear, 2 via header)
• SATA DOM power connector
• 350W Gold Level High-efficiency Power Supply
 


X10SLM-F +
SC813MTQ-350CB

SYS-5018D-MTF
• Density-optimized, ideal for hosting appliances, HPC and datacenters
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th Gen
   Core i3/Pentium/Celeron processor; Socket H3 (LGA 1150)
• Intel® C224 PCH Express Chipset
• 4x 3.5" Hot-swap SATA3 HDD bays
• 1x PCI-E 3.0 x8 (in x16) Expansion Slot
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• Dual GbE LAN ports (1x Intel® i217LM + 1x Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN
• 4x SATA3 (6Gbps, RAID 0, 1, 10, 5), 2x SATA2 (3Gbps, RAID 0, 1)
• 4x USB 3.0 (1 Type-A, 2+1 via header)
• 6x USB 2.0 (4 rear, 2 via header)
• SATA DOM power connector
• 350W Gold Level High-efficiency Power Supply
 


X10SLM-F +
SC813MTQ-R400B

SYS-5018D-MTRF
• Density-optimized, ideal for hosting appliances, HPC and datacenters
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th Gen
   Core i3/Pentium/Celeron processor; Socket H3 (LGA 1150)
• Intel® C224 PCH Express Chipset
• 4x 3.5" Hot-swap SATA3 HDD bays
• 1x PCI-E 3.0 x8 (in x16) Expansion Slot
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• Dual GbE LAN ports (1x Intel® i217LM + 1x Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN
• 4x SATA3 (6Gbps, RAID 0, 1, 10, 5), 2x SATA2 (3Gbps, RAID 0, 1)
• 4x USB 3.0 (1 Type-A, 2+1 via header)
• 6x USB 2.0 (4 rear, 2 via header)
• SATA DOM power connector
• 400W Redundant Gold Level Short-Depth Power Supplies
   (with BBP® option)
 


X10SLM+-LN4F +
SC813MTQ-350CB

SYS-5018D-MTLN4F
• Density-optimized, ideal for cloud/network appliances, HPC and datacenters, storage controllers
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th Gen
   Core i3/Pentium/Celeron processor; Socket H3 (LGA 1150)
• Intel® C224 PCH Express Chipset
• 4x 3.5" Hot-swap SATA3 HDD bays
• 1x PCI-E 3.0 x16 Expansion Slot
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• Quad GbE LAN ports (4x Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN
• 4x SATA3 (6Gbps, RAID 0, 1, 10, 5), 2x SATA2 (3Gbps, RAID 0, 1)
• 4x USB 3.0 (2 rear, 1 Type-A, 1 via header)
• 6x USB 2.0 (2 rear, 4 via header)
• SATA DOM power connector
• 350W Gold Level High-efficiency Power Supply
 


X10SL7-F +
SC113MTQ-330B

SYS-1018D-73MTF
• Density-optimized, ideal for storage appliances, HPC and datacenters
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th Gen
   Core i3/Pentium/Celeron processor; Socket H3 (LGA 1150)
• Intel® C222 PCH Express Chipset
• 8x 2.5" Hot-swap SAS2/SATA3 HDD bays
• 1x PCI-E 3.0 x8 (in x16) Expansion Slot
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• Dual GbE LAN ports (2x Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN
• Broadcom 2308 SAS2 (6Gbps) controller (RAID 0, 1, 10)
• 2x USB 3.0 (1 Type-A, 1 via header)
• 6x USB 2.0 (4 rear, 2 via header)
• SATA DOM power connector
• 330W Gold Level Power Supply
 

X10SLE-F
+ SC939H-R1K63B

SYS-5038ML-H12TRF
• Cloud computing, data center, web hosting, and virtualization
• 12x modular UP Nodes in 3U, EACH NODE:
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th/5th Gen
   Core™ processor family; socket H3 (LGA 1150) from 13W to 80W
• Intel® C224 PCH Chipset
• Up to 32GB DDR3 VLP ECC UDIMM 1600/1333MHz memory support
• 2x 3.5" SATA3 HDDs; optional kit for 4x 2.5" SATA HDDs
• Dual GbE LAN ports (2x via Intel® i350); Dedicated LAN supports
   IPMI 2.0, Virtual Media over LAN, KVM over LAN
• Integrated Aspeed AST2400 Graphics controllers - 1x VGA port
• 2x USB 2.0 ports, 1x USB 3.0 (Type-A), 1x SATA DOM
• 4x 9cm heavy-duty PWM fans with optimal cooling zone
• 1620W Redundant Platinum Level Power Supplies
 


X10SLD-F +
SC938BH-R1620B

SYS-5038ML-H8TRF
• Cloud computing, data center, web hosting, and virtualization
• 8 modular UP Nodes in 3U; EACH NODE:
• Intel® Xeon® processor E3-1200 v3/v4 family, Intel® 4th/5th Gen
   Core™ processor family; socket H3 (LGA 1150) from 13W to 84W
• Intel® C224 PCH chipset
• Up to 32GB DDR3 ECC UDIMM 1600/1333MHz memory support
• 2x 3.5" hot-swap SAS/SATA HDDs (SW/HW RAID 0,1 depends on
   RAID card config.)
• Dual GbE LAN ports (2x via Intel® i350); Dedicated LAN supports
   IPMI 2.0, Virtual Media over LAN, and KVM over LAN
• Integrated Aspeed AST2400 Graphics controllers - 1x VGA port
• 2x USB 2.0 ports, 1x USB 3.0 (Type-A), 1x SATA DOM
• Low-profile PCI-E x8 expansion support
• 4x 8cm heavy-duty PWM fans with optimal cooling zone
• 1620W Redundant Platinum Level Power Supplies
 


X10SLL-F +
SC731i-300B

SYS-5038D-I
• Application and data serving, CAD/CAM/CAE, Medical Applications,
   Oil & Gas, SOHO Entry-Level Server
• Intel® Xeon® processor E3-1200 v3 family, Intel® 4th Gen Core
   i3 processor (formerly codename Haswell); Socket H3 (LGA 1150)
• Intel® C222 PCH Express Chipset
• 4x 3.5" Tool-less HDD trays, 2x 5.25" drive bays
• 1x PCI-E 3.0 x8 (in x16), 1x PCI-E 3.0 x8, 1x PCI-E 2.0 x4 (in x8) slots
• Up to 32GB DDR3 1600MHz ECC UDIMMs in 4 sockets
• Dual GbE LAN ports (1x via Intel® i217LM + 1x via Intel® i210AT)
• Integrated IPMI 2.0 with KVM and Dedicated LAN
• 2x SATA3 (6Gbps, RAID 0, 1), 4x SATA2 (3Gbps, RAID 0, 1, 10, 5)
• 2x USB 3.0 (1 Type-A, 1 via header)
• 6x USB 2.0 (4 rear, 2 via header)
• Video: Aspeed AST2400 BMC
• 300W High-efficiency Power Supply
 





New Generation of
Computing Excellence:

  • 22nm Process Technology
    - Improved CPU Performance
    - Integrated VR

  • Graphics w/ DX11.1 & OCL1.2
    - Performance Increase
    - Digital Display Repartition
    - 1 VGA + 2 Digital Displays

  • 2013/4 Platform Compatibility
    - LGA 1150 Socket
    - 2 Channel DDR3L
      (up to 4 DIMMs at 1600MHz)
    - 95W / 80W / 45W / 13W
      Thermal Solutions

  • C220 PCH Express Chipset
    - Feature Rich PCH
    - Lowest Cost, Lowest Power

  • I/O Flexibility
    - Up to 8 PCIe Ports, 6 USB 3.0
       or 6 SATA3 Ports
    - Improved I/O Bandwidth
    - Lower Power
    - TPM Support

  • Faster SMLink
    - For LAN integration


New Generation of Computing Excellence



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