Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management

Supermicro Solutions based on Intel® Xeon® Processor E5 Family


NEW! With E5-2600 v4 Support
SuperServer®
Motherboard
SuperBlade®
MicroBlade™

DCO

  Serverboards SKUs - Display  |  All  |  UP  |  DP  | or Socket R3 (E5) / H3 (E3)  |

  Data Center Optimized Serverboards

The Supermicro Data Center Optimized serverboard product family supports up to: 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400MHz memory in 16 DIMM slots, 4 standard AOC slots and one SAS3 Mezzanine AOM, 10 SATA3 (6Gbps) ports via Intel® C612 controller, up to 2x GbE LAN, 4 NVMe ports, integrated IPMI 2.0 with KVM over dedicated LAN, and dual or single Intel® Xeon® processor E5-2600/1600 v4/v3 product families up to 22 cores and 145W TDP.

With an improved thermal design that utilizes power efficient components and offset processors that help eliminate CPU preheating to allow higher operating temperatures, the Supermicro Data Center Optimized serverboard product family delivers the best performance-per-watt to optimize data center Total Cost of Ownership (TCO). The Data Center Optimized product line perfectly complements modern energy efficient data center designs.

With best performance and energy efficiency, Supermicro Data Center Optimized serverboards are the best selection for Virtualized Hosting, Cloud Computing, and Database applications in data center environments where electric power must be minimized. Compatible Supermicro chassis include the SC801S, SC113, SC813LT, SC813T, SC815, SC823TQ, and SC825TQ.




NVMe port option
3x AOC in 1U
SAS3 AOM support
DDR3/4 memory option

X10DDW-i / X10DDW-iN
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 1x PCI-E 3.0 x24 Left riser slot, 1x PCI-E 3.0 x8 Right riserslot,
   1x PCI-E 3.0 x16 for Add-On-Module (AOM)
• Intel® i350 Dual port Gigabit Ethernet
• IPMI 2.0 and KVM with dedicated LAN
• 10x SATA3 (6Gbps) ports via C612
• 2x USB 3.0 ports (rear) + 1x Type A
• 4x USB 2.0 ports (2 rear + 2 via headers)
• 2x SuperDOM (Disk on Module) ports
• 4x Internal NVMe ports ("N" SKUs)
• Form factor: Proprietary WIO, 12.8" x 13.4"
 


Image: X10DRD-iNTP

X10DRD-i / X10DRD-iT / X10DRD-iTP / X10DRD-iNT / X10DRD-iNTP
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 8x DIMMs, up to 1TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 4x PCI-E 3.0 x8 slots
• 2x 10G SFP+ (-iTP, -iNTP), 2x 10GBase-T (-iT, -iNT), 2x GbE (-i)
• IPMI 2.0 and KVM with dedicated LAN
• 10x SATA3 ports via C612
• 7x USB 2.0 ports (4 rear + 2 via header + 1 Type A)
• 2x PCI-E 3.0 NVMExpress x4 internal ports (-iNTP, -iNT)
• 2x SuperDOM (Disk on Module) ports
• Form factor: E-ATX, 13.05" x 10.5"
 


Image: X10DRD-LTP

X10DRD-L / X10DRD-LT / X10DRD-LTP
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 8x DIMMs, up to 1TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 1x PCI-E 3.0 x8 slot
• 2x 10G SFP+ (-LTP), 2x 10GBase-T (-LT), 2x GbE (-L)
• IPMI 2.0 and KVM with dedicated LAN
• 6x SATA3 ports via C612
• 7x USB 2.0 ports (4 rear + 2 via header + 1 Type A)
• 2x SuperDOM (Disk on Module) ports
• Form factor: E-ATX, 13.05" x 10.5"
 



Solution Families:

  • SuperServer®
  • Ultra
  • Twin Server
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Xeon Phi™
  • Mainstream App.Optimized
  • SuperStorage
  • SuperWorkstation

  • SuperBlade®
  • MicroBlade™



Support Resources:

MBSA Tool
  • X10 DP MB Selection Tool
  • X10 Heat Sink Support



New Generation of
Computing Excellence:

  • 22 Cores CPU; 160W TDP
  • Up to 3TB ECC 3DS LRDIMM
    or RDIMM DDR4-2400MHz
  • Up to 30% performance gain
  • SAS 3.0 (12Gbps)
  • NVMe support
  • Quad 10GBase-T
  • 10G SFP+
  • FDR (56Gbps) InfiniBand
  • SuperDOM support
  • TPM Security Module support
  • Titanium Level (96%+) PS


New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

Click for Logo Guidelines
Investor Relations    |   Jobs    |   Site Map    |   Follow Us    |   Terms & Conditions    |   Privacy
Copyright © 2019 Super Micro Computer, Inc. Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.