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Supermicro Solutions based on Intel® Xeon® Processor E5 Family


NEW! With E5-2600 v4 Support
SuperServer®
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FatTwin

  Serverboards SKUs - Display  |  All  |  UP  |  DP  | or Socket R3 (E5) / H3 (E3)  |

  FatTwin™ Server Solutions

The Supermicro FatTwin™ is a high-density 8/4/2 hot-plug node SuperServer® system available with a variety of memory capacities, HDD technologies, PCIe alternatives, networking capabilities, and GPU support options. The FatTwin™ serverboards are the key to this flexible system and support up to: 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400MHz memory in 16 DIMM slots, 1 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 Micro LP card , 8 ports of Broadcom 3008 SAS 3.0 (12Gbps) with Software RAID, 10 ports of SATA 3.0 (6Gbps) with Intel® C612 controller, dual 10GBase-T or dual Gigabit Ethernet ports, integrated IPMI 2.0 with KVM over dedicated LAN, and dual Intel® Xeon® processor E5-2600 v4/v3 product families up to 22 cores and 145W TDP.

The Supermicro FatTwin™ represents a revolution in Green Computing designed to support customers' critical applications and also reduce Data Center TCO to help preserve the environment. The FatTwin™ extends the compute and storage capabilities of Supermicro's existing Twin SuperServer® systems to achieve increased performance and power efficiency. Due to its shared components the FatTwin™ improves cost-effectiveness and reliability, while its modular architecture makes it flexible to configure and easy to maintain.

Versatile configurations allow the FatTwin™ to be optimized for many different environments including Enterprise, Data Center, Cloud Computing, HPC, Financial, Science and Engineering, File and Storage Servers.




For Server SKU only
FatTwin™

X10DRFR-N / X10DRFR-NT / X10DRFR
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 1x PCI-E 3.0 x16 (LP), 1x PCI-E 3.0 x8 for SMCI add-on cards
   and 1x PCI-E 3.0 x8 (Micro LP) slots
• Flexible network via Ultra Riser Cards
• IPMI 2.0 and KVM with dedicated LAN
• 2x Internal NVMe ports (PCI-E 3.0 x4) (X10DRFR-N, X10DRFR-NT)
• 10x SATA3 (6Gbps) ports via C612
• 2x USB 3.0 ports (rear) + 1x Type A
• 2x SuperDOM (Disk on Module) ports
• Form factor: Proprietary Twin, 6.8" x 19.46"
 


For Server SKU only
FatTwin™

X10DRFF-CG / X10DRFF-CTG / X10DRFF-iG / X10DRFF-iTG
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 16x DIMMs, up to 2TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 1x PCI-E 3.0 x32 right riser slot, 1x PCI-E 3.0 x16, 2x PCI-E 3.0 x8,
   1x PCI-E 2.0 x4 (in x8)
• Intel® i350 Dual port Gigabit Ethernet (X10DRFF-CG, X10DRFF-iG)
• Intel® X540 Dual port 10GBase-T (X10DRFF-CTG/iTG)
• IPMI 2.0 and KVM with dedicated LAN
• 8x SAS3 (12Gbps) ports via Broadcom 3008; SW RAID 0, 1, 10
   (X10DRFF-CG, X10DRFF-CTG); JBOD support (IT Mode)
• 10x SATA3 (6Gbps) ports via C612
• 2x USB 3.0 ports (rear)
• 2x SuperDOM (Disk on Module) ports
• Form factor: Proprietary Twin, 8.54" x 18.72"
 


For Server SKU only
FatTwin™

X10DRFF / X10DRFF-C
• Dual Socket R3 (LGA 2011) support: Intel® Xeon® processor
   E5-2600 v4/v3 family; QPI up to 9.6GT/s
• Intel® C612 Express chipset
• 8x DIMMs, up to 1TB ECC 3DS LRDIMM or RDIMM DDR4-2400
• 2x PCI-E 3.0 x16 (LP) slots
• Intel® i210 Dual port Gigabit Ethernet
• IPMI 2.0 and KVM with dedicated LAN
• 8x SAS3 (12Gbps) ports via Broadcom 3008; SW RAID 0, 1, 10 (X10DRFF-C);
   JBOD support (IT Mode)
• 10x SATA3 (6Gbps) ports via C612
• 2x USB 3.0 ports (rear) + 1x Type A
• 2x SuperDOM (Disk on Module) ports
• Form factor: Proprietary Twin, 8.54" x 18.72"
 



Solution Families:

  • SuperServer®
  • Ultra
  • Twin Server
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Xeon Phi™
  • Mainstream App.Optimized
  • SuperStorage
  • SuperWorkstation

  • SuperBlade®
  • MicroBlade™



Support Resources:

MBSA Tool
  • X10 DP MB Selection Tool
  • X10 Heat Sink Support



New Generation of
Computing Excellence:

  • 22 Cores CPU; 160W TDP
  • Up to 3TB ECC 3DS LRDIMM
    or RDIMM DDR4-2400MHz
  • Up to 30% performance gain
  • SAS 3.0 (12Gbps)
  • NVMe support
  • Quad 10GBase-T
  • 10G SFP+
  • FDR (56Gbps) InfiniBand
  • SuperDOM support
  • TPM Security Module support
  • Titanium Level (96%+) PS


New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

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