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SuperServer 2029BT-HNR (Complete System Only)

Super Micro Computer, Inc.
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  Products   Systems   BigTwin   [ 2029BT-HNR ]





Integrated Board
Super X11DPT-B

Views: | Angled View | Node View |
| Front View | Rear View |

Key Features
  - Compute Intensive Application
  - HPC, Data Center, Enterprise
    Server
  - Hyperscale / Hyperconverged

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors
2. Up to 3TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 24 DIMM slots
3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM
    card support (flexible networking)
    Note: must bundle with Network card
4. 6 Hot-swap 2.5" NVMe drive bays;
    2 M.2 SATA3 or NVMe support
5. 1 Carrier Card slot (M.2 support)
6. IPMI 2.0 + KVM with dedicated LAN
7. Video via Aspeed AST2500 BMC
8. 4 Heavy duty 8cm PWM fans with
    air shroud
9. 2200W Redundant Power Supplies
    Titanium Level (96%)
    Supermicro X11 BigTwin

Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 1 NVMe and 1 SIOM card per node). Please contact your Supermicro sales rep for special requirements.

 Drivers & Utilities   BIOS   IPMI   Tested Memory
 Tested M.2 List   NVMe Options   Manuals    OS Certification Matrix    Quick-References Guide  Tested SIOM  Tested Network Card (AOC)

Product SKUs
SYS-2029BT-HNR
  • SuperServer 2029BT-HNR (Black)
 
Motherboard

Super X11DPT-B
 
Processor/Cache (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • Intel® Xeon® Scalable Processors ,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-205W*
Cores
  • Up to 28 Cores with Intel® HT Technology
Note * 200W/205W CPUs are supported under certain configurations. Please contact Supermicro Technical Support for additional information about specialized system optimization
 
System Memory (per Node)
Memory Capacity
  • 24 DIMM slots
  • Up to 3TB 3DS ECC L/RDIMM, up to DDR4-2666MHz
Memory Type
  • 2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
 
On-Board Devices
Chipset
  • Intel® C621 chipset
Network
  • Must bundle with at least one SIOM network card
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video
  • ASPEED AST2500 BMC
 
Input / Output (per Node)
LAN
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
Video
  • 1 VGA port
DOM
  • 1 SuperDOM (Disk on Module) port
Others
  • M.2 and SATA DOM for boot drive only
 
System BIOS
BIOS Type
  • AMI 32Mb SPI Flash ROM
 
Management
Software
Power Configurations
  • ACPI / APM Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-217BHQ+-R2K22BP2
 
Dimensions and Weight
Width
  • 17.6" (447mm)
Height
  • 3.47" (88mm)
Depth
  • 28.75" (730mm)
Package
  • 24.65" (H) x 9.76" (W) x 45.28" (D)
Weight
  • Gross Weight: 85 lbs (38.6kg)
  • Net Weight: 54.5 lbs (24.7 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
 
Expansion Slots (per Node)
PCI-Express
  • 2 PCI-E 3.0 (x16) Low-profile slots
  • 1 SIOM card support
    (must bundle with network card)
 
Drive Bays / Storage (per Node)
Hot-swap
  • 6 Hot-swap 2.5" NVMe drive bays
M.2
  • 2 M.2 NVMe or SATA (2240/2260/2280) via optional AOC-SMG3-2H8M2-B
 
System Cooling
Fans
  • 4 Heavy duty 8cm PWM fans with air shroud
 
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power
  • 1200W/1800W/1980W/2090/2200W
Dimension
(W x H x L)
  • 45 x 40 x 480 mm
Input
  • 1200W: 100-127Vac / 50-60Hz
  • 1800W: 200-220Vac / 50-60Hz
  • 1980W: 220-230Vac / 50-60Hz
  • 2090W: 230-240Vac / 50-60Hz
  • 2090W: 180-220Vac (for UL/cUL only)
  • 2200W: 220-240Vac (for UL/cUL only)
  • 2090W: 230-240Vdc (for CCC only)
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
  • Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)
  • Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
12Vsb
  • Max: 2.1A / Min: 0A
Output Type
  • Gold Finger
Certification Titanium Level96%  UL/cUL/CB/BSMI/CE/CCC
  Titanium Level
  [ Cert. in progress ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

See Parts List

Parts List - (Items Included)
 
Part Number
Qty
Description
Motherboard / Chassis MBD-X11DPT-B
CSE-217BHQ+-R2K22BP2
4
1
Super X11DPT-B Motherboard
2U Chassis
Backplane BPN-ADP-6NVME3-1UB 4 6x NVMe ports and 50A power sourcing daughter card for Big Twin
Backplane BPN-NVME3-217BHQ 1 2U 24-Port 4-Node NVMe Backplane Support 6x2.5
Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
Drive Tray(s) MCP-220-00127-0B-BULK 24 Black gen3 Hotswap 2.5 NVMe drive tray, Orange tab/Lock/Bulk
Parts MCP-240-21721-0N 1 217B BigTwin type I (Impact) BPN retention bkt assy
Air Shroud MCP-310-21712-0B 4 SC217B/827B BigTwin air box for X11DRT-B+
Air Shroud MCP-310-21718-0B 4 Bigtwin air box for X11DPT-B(4pcs/set)
Manual MNL-1948-QRG 1 2029BT-H(N/T/NC0)R Quick Reference Guide
Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention SNK-P0067PS 4 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0067PSM 4 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply PWS-2K22A-1R 2 1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48


Optional Parts List
  Part Number Qty Description
TPM security module AOM-TPM-9670H 1 SPI capable TPM 2.0 with Infineon 9670 controller,
Horizontal form factor
TPM security module AOM-TPM-9671H 1 SPI capable TPM 1.2 with Infineon 9670 controller,
Horizontal form factor
Intel VROC RAID Key AOC-VROCINTMOD
AOC-VROCSTNMOD
AOC-VROCPREMOD
1
1
1
Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only)
Intel VROC Standard, RAID 0, 1, 10
Intel VROC Premium, RAID 0, 1, 5, 10
Global Services & Support OS4HR3/2/1
OSNBD3/2/1
-
-
3/2/1-year onsite 24x7x4 service
3/2/1-year onsite NBD service
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
SuperDOM - - Supermicro SATA DOM Solutions [Details]
Network Card(s) AOC-S40G-i2Q
AOC-SGP-i2
AOC-SGP-i4
AOC-STG-b4S
AOC-STGN-i2S
AOC-STGN-i1S
AOC-STG-i2T
AOC-STG-i2
-
-
-
-
-
-
-
-
Standard LP 2-port 40GbE controller, based on Intel Fortville XL710
Standard LP, 2x GbE RJ45, PCI-E x4, Intel i350AM2
Standard LP, 4x GbE RJ45, PCI-E x4, Intel i350
Standard LP, 4x 10GbE SFP+, PCI-E x8, Broadcom BCM57840S
Standard LP, 2x 10GbE SFP+, PCI-E x8, Intel 82599ES
Standard LP, 1x 10GbE SFP+, PCI-E x8, Intel 82599EN
Standard LP, 2x 10GbE RJ45, PCI-E x8, Intel X540
Standard LP, 2x 10GbE CX4, PCI-E x8, Intel 82598EB
Carrier Card AOC-SMG3-2H8M2-B
AOC-SMG2-2TM2
- 2 Hybrid NVMe/SATA M.2 carrier for Big Twin,HF,RoHS
2 SATA M.2 RAID adapter for Big Twin,HF,RoHS
Hide Parts List

Information in this document is subject to change without notice.
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