SuperServer 5039MC-H12TRF

  Products  Systems   MicroCloud   [ 5039MC-H12TRF ]





Integrated Board
Super X11SCE-F

Views: | Angled View | Node View |
| Front View | Rear View |

Key Features (per node)
• Cloud Computing
• Web Cache
• Web Hosting, VM
• Social Networking
• Corporate-WINS, DNS, Print, Login

1. Single socket H4 (LGA 1151) supports
    Intel® Xeon® processor E-2100/E-2200,
    8th Gen. Intel® Core™ i3 Processors,
    Intel® Celeron®, Intel® Pentium®
2. Intel® C246 chipset
3. Up to 128GB unbuffered VLP ECC,
    up to DDR4-2666MHz; 4 DIMM slots
4. 1 Micro-LP slot (MicroLP upgradable)
5. 2x 3.5" SATA3 drives or
    4x 2.5" SATA3 drives or
    2x 2.5" NVMe + 2x 2.5" SATA3 drives or
    2x 2.5" NVMe + 1x 3.5" SATA3 drive
6. M.2 Interface: 1 PCI-E 3.0 x4 and SATA
    M.2 Form Factor: 2280, 22110
    M.2 Key: M-Key
7. 2 GbE LAN ports via Intel i350
8. Aspeed AST2500 graphics
9. 4x 9cm Heavy duty fans with optimal
    cooling zone (per system)
10. 2000W Redundant power supplies
    Titanium Level Certified (per system)


 Drivers & Utilities   BIOS   IPMI   Tested Memory  Tested M.2 List   NVMe Options   Manuals    OS Certification Matrix    Drive Options 

Product SKUs
SuperServer
  • SYS-5039MC-H12TRF (Black)
 
Motherboard
Super X11SCE-F
 
Processor (per Node)
CPU
  • Single Socket H4 (LGA 1151),
    CPU TDP support up to 95W
  • Support Intel® Xeon® processor E-2100 / E-2200 series, 8th Gen. Intel® Core™ i3 / Pentium® / Celeron® Processors
Cores
  • 8 cores max.
Note
  • BIOS 1.0b or above is required to support Intel® Xeon® processor E-2200 series
 
System Memory (per Node)
Memory Capacity
  • 4 DIMM slots
  • Up to 128GB Unbuffered ECC
  • Up to DDR4-2666MHz
Memory Type
  • 2666/2400/2133MHz ECC DDR4 SDRAM
DIMM Sizes
  • 32GB, 16GB, 8GB, 4GB
 
On-Board Devices (per node)
Chipset
  • Intel® C246 chipset
SATA
  • SATA3 (6Gbps) via Intel® C246 controller; RAID 0, 1, 5, 10
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM over LAN support
  • ASPEED AST2500 BMC
Network Controllers
  • Dual LAN with Intel® i350
Graphics
  • Aspeed AST2500 graphics
 
Input / Output (per node)
SATA
  • 2 SATA3 (6Gbps) ports
LAN
  • 2 RJ45 Gigabit Ethernet LAN ports
 
System BIOS
BIOS Type
  • UEFI 128Mb
BIOS Features
  • ACPI 1.0 / 2.0 / 3.0 / 4.0
  • APM 1.2
  • DMI 2.3
  • Hardware BIOS Virus protection
  • PCI 2.3
  • Plug and Play (PnP)
  • RTC (Real Time Clock) Wakeup
  • SMBIOS 2.7.1
  • UEFI 2.3.1
  • USB Keyboard support
 
Front Window (each node)
Switch
  • Power / UID
Chassis
Form Factor
  • 3U
Model
  • CSE-939HN-R2K04BP
 
Dimensions and Weight
Height
  • 5.21" (132.5 mm)
Width
  • 17.5" (444.5 mm)
Depth
  • 29.5" (749.3 mm)
Package
  • 16.1" (H) x 28.35" (W) x 42.36" (D)
Weight
  • Net Weight: 132lbs (59.87kg)
  • Gross Weight: 125lbs (56.70kg)
Color
  • Black
 
Expansion Slots (per Node)
Micro-LP
  • 1 Micro-LP slot (MicroLP upgradable)
M.2
  • M.2 Interface: 1 PCI-E 3.0 x4 and SATA
  • M.2 Form Factor: 2280, 22110
  • M.2 Key: M-Key
 
Drive Bays (per node)
Internal
  • 2x 3.5" SATA3 drives or
    4x 2.5" SATA3 drives or
    2x 2.5" NVMe + 2x 2.5" SATA3 drives or
    2x 2.5" NVMe + 1x 3.5" SATA3 drive
 
System Cooling
Fans
  • 4x 9cm Heavy duty fans with optimal cooling zone
 
Power Supply (76mm Width)
2000W Titanium Redundant Power Supplies with PMBus and Reverse Airflow
Total Output Power
  • 1000W: 100 – 127Vac
  • 1800W: 200 – 220Vac
  • 1980W: 220 – 230Vac
  • 2000W: 230 – 240Vac
  • 2000W: 200 – 240Vac (UL/CUL only)
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
Input
  • 1000W: 100-127 Vac / 12.5-9.5 A / 50-60 Hz
  • 1800W: 200-220 Vac / 10-9.5 A / 50-60 Hz
  • 1980W: 220-230 Vac / 10-9.8 A / 50-60 Hz
  • 2000W: 230-240 Vac / 10-9.8 A / 50-60 Hz
  • 2000W: 200-240 Vac / 11.8-9.8 A / 50-60 Hz (UL/cUL only)
+12V
  • Max: 83.3A / Min: 0A (100Vac-127Vac)
  • Max: 150A / Min: 0A (200Vac-220Vac)
  • Max: 165A / Min: 0A (220Vac-230Vac)
  • Max: 166.7A / Min: 0A (230Vac-240Vac)
  • Max: 166.7A / Min: 0A (200-240 Vac)
    (UL/cUL only)
+5Vsb
  • Max: 1A / Min: 0A
Output Type
  • 27 Pairs Gold Finger Connector
Certification Titanium Level96%    Titanium Level
    [ Test Report ]
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, +3.3V, +5V, +12V, +3.3V Standby, +5V Standby, VBAT, Memory, Chipset Voltages.
  • 3-Phase-switching voltage regulator with auto-sense from 0.5V-2.3V
FAN
  • Cooling zone
Temperature
  • Monitoring for CPU and chassis environment
 
Operating Environment / Compliance
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
See Parts List

Parts List - (Items Included)
 
Part Number
Qty
Description
Motherboard / Chassis MBD-X11SCE-F
CSE-939HN-R2K04BP
12
1
Super X11SCE-F Motherboard
3U Chassis
Add-on Card / Module AOM-BPN-MC12S-P 12 AOM-BPN-MC12S
Add-on Card / Module AOM-CGP-I2M-P 12 AOM-CGP-I2M-O-P
Add-on Card / Module AOM-GEM-001-P 1 [NR]AOM-GEM-001-O-P
Add-on Card / Module AOM-LAN-MC12S-P 1 [NR]AOM-LAN-MC12S-P
Add-on Card / Module AOM-PDB-MC12S-P 12 AOM-PDB-MC12S
Backplane BPN-SAS-939HS 1 12-port 3U (CSE-939HS) 12-node MicroCloud hot swappable midplane
Cable 1 CBL-0218L 1 USB/KVM/SUVI,36 PIN TO 9 PIN/15 PIN/2 USB CH,11.5CM,30/28AWG
Cable 2 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
Air Shroud MCP-310-93904-0N 12 Mylar air shroud for VLP 4 DIMM (short gap, quick install)
Heatsink / Retention SNK-P0047PSR 12 LP CPU Heat Sink for 12-node Micro Cloud Series Servers
Heatsink / Retention SNK-P0047PSRK 12 Low Profile CPU Heat Sink for MBI-6119G-C2 Micro Blade Server
* Power Supply PWS-2K04F-1R 2 AC-DC 2000W, Titanium Level, Redundancy, 1U, PMBus 1.2, 360x76x40 mm,HF,RoHS/REACH
* Power Distributor PDB-PT939-DSG 2 Adapter Board for SC939 special gold finger directly plug to BP.
* Cable 3 CBL-0355L 2 ETHERNET,CAT5E,RJ45 W/BOOT,GREEN,UTP,2FT (60CM),24AWG
* Cable 4 CBL-CDAT-0662 1 CBL,SGPIO,2X4F TO 2X4F,P2.54,ROUND CABLE,61.5CM,28AWG
* Cable 5 CBL-PWCD-0859 1 PWCD,US,IEC60320 C14 TO RA C13 w/SR for 939HS PSU1,3FT,14AWG
* Cable 6 CBL-PWCD-0860 1 PWCD,US,IEC60320 C14 TO RA C13 w/SR for 939HS PSU2,3FT,14AWG
* FAN 1 FAN-0195L4 4 92x92x76 mm Counter-rotating Cooling Fan for 3U12N Microclou
* Rail Set MCP-290-41803-0N 1 Fat twin F418 / F424 Static Rail set support 28-33.5 inch depth rail,RoHS/REACH,PBF
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.


Optional Parts List
  Part Number Qty Description
Network Card(s) AOM-CTG-i2SM-12
AOM-C25G-m1SM
AOM-C25G-i2SM-12
AOM-CTGS-i2TM
AOM-CTG-i1SM
-
-
-
-
MicroLP 2x 10GbE SFP+, PCI-E 3.0 x8, Intel 82599ES
MicroLP, 1x 25GbE SFP28, PCI-E 3.0 x8, Mellanox®
MicroLP module 2-Port 25G SFP28, Intel E810-XXVAM2, for MicroCloud 12node
MicroLP, 2x 10GbE Base-T, PCI-E 3.0 x4, Intel® X550
MicroLP, 1 x 10GbE SFP+, PCI-E 2.0 x8, Intel® 82599EN, ver 1.21 only
SATA DOM MEM-IDSAHM3A-032G
MEM-IDSAHM3A-064G
MEM-IDSAHM3A-128G
-
-
-
SATA3 ServerDOM MH 3ME 32GB MLC w/ Pin8 VCC Horizontal
SATA3 ServerDOM MH 3ME 64GB MLC w/ Pin8 VCC Horizontal
SATA3 DOM SH 3ME3 V2 128GB MLC w/ Pin8 VCC Horizontal
TPM security module AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller,
Vertical form factor
TPM security module AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller,
Vertical form factor
Add-on Card / Module AOM-BPN-MC12S4-P 12 4x NVMe U.2 connectors BPN for MicroCloud 12 node system,HF,RoHS
Bracket MCP-240-93912-0N 12 Bracket for 4NVMe MB tray with NVMe standoff
Global Services & Support OS4HR3/2/1
OSNBD3/2/1
-
-
3/2/1-year onsite 24x7x4 service
3/2/1-year onsite NBD service
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Hide Parts List

Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.