SuperServer F627G2-FTPT+

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  Products   Systems   FatTwin™   [ F627G2-FTPT+ ]





Integrated Board
Super X9DRFF-iTG+
Key Features
4 Hot-plug System Nodes in 4U
Front I/O. Each node supports:


1. Dual socket R (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    and E5-2600 v2 family
2. Up to 1TB ECC DDR3, up to
    1866MHz; 16x DIMM slots
3. 3x PCI-E 3.0 x16 slots (support 3x
    Double-width GPU/Xeon Phi cards),
    2x PCI-E 3.0 x8 slots
4. Front I/O ports: Dual 10GBase-T,
    2x USB 2.0, and 1x VGA connector
5. Built-in Server management tool
    (IPMI 2.0, KVM/media over LAN) with
    dedicated LAN port
6. 6x 2.5" Hot-swap SATA HDDs
7. 1620W Redundant Power Supplies
    Platinum Level (94%+)

Available Colors: Black    

 Drivers & Utilities   BIOS   IPMI   Tested Memory  Manuals    OS Certification Matrix    Compatible GPU List  Quick-References Guide  Drive Options 

Product SKUs - Discontinued SKU (EOL). Please contact sales-rep for alternative options.
SYS-F627G2-FTPT+
  • SuperServer F627G2-FTPT+ (Black)
 
Motherboard

Super X9DRFF-iTG+
 
Processor/Cache
CPU
  • Dual Socket R (LGA 2011)
  • Intel® Xeon® processor E5-2600
        and E5-2600 v2 family
        (up to 130W TDP)
Note † BIOS version 3.0 or above is required
Cache
  • Up to 30MB
System Bus
  • QPI up to 8 GT/s
GPU/Xeon Phi Support
  • 3x Double-width GPU/Xeon Phi per node
    (total of 12x GPU/Xeon Phi cards in 4U)
  • Supports Intel Xeon Phi
  • Supports NVIDIA K80, K10/K20/K20X (Kepler), K1/K2, and M2090/M2075
 
System Memory (per node)
Memory Capacity
  • 16x 240-pin DDR3 DIMM slots
  • Up to 1TB DDR3 ECC LRDIMM
  • Up to 512GB DDR3 ECC Registered memory (RDIMM)
  • Up to 128GB DDR3 ECC Un-Buffered memory (UDIMM)
Memory Type
  • 1866/1600/1333/1066/800MHz ECC DDR3 SDRAM 72-bit, 240-pin gold-plated DIMMs
DIMM Sizes
  • 32GB, 16GB, 8GB, 4GB, 2GB, 1GB
Memory Voltage
  • 1.5 V, 1.35 V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
 
On-Board Devices
Chipset
  • Intel® C602 Chipset
AHCI SATA
  • SATA 2.0 3Gbps with RAID 0, 1, 5, 10
     SATA 3.0 6Gbps with RAID 0, 1
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • Nuvoton WPCM450 BMC
Network Controllers
  • Intel® X540 Dual Port 10GBase-T
  • Virtual Machine Device Queues reduce I/O overhead
  • Supports 10GBASE-T, 100BASE-TX, and 1000BASE-T, RJ45 output
  • 1x Realtek RTL8201F PHY (dedicated IPMI)
Graphics
  • Matrox G200eW
 
Input / Output (per node)
AHCI SATA
  • 2x SATA 3.0 ports (6Gbps)
  • 4x SATA 2.0 ports (3Gbps)
LAN
  • 2x RJ45 10GBase-T ports
  • 1x RJ45 Dedicated IPMI LAN port
USB
  • 2x USB 2.0 ports
VGA
  • 1x VGA port
Serial Port / Header
  • 1x Fast UART 16550 port
Chassis
Form Factor
  • 4U Rackmount
Model
  • CSE-F424BG-R1K62BP
 
Dimensions
Width
  • 17.63" (448mm)
Height
  • 6.96" (177mm)
Depth
  • 35" (889mm)
Package
  • 25.6" (W) x 11.8" (H) x 48.0" (D)
Weight
  • Net Weight: 105 lbs (47.63 kg)
  • Gross Weight: 150 lbs (68.04 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • System Overheat / Power Fail LED
  • UID LED
 
Expansion Slots (per node)
PCI-Express
  • 3x PCI-E 3.0 x16 slots
    (support 3x Double-width GPU/Xeon Phi)
  • 2x PCI-E 3.0 x8 slots
 
Drive Bays (per node)
Hot-swap
  • 6x 2.5" Hot-swap SATA HDD bays
 
System Cooling
Fans
  • 8x 8cm heavy duty fans with air shroud and PWM fan speed control
 
Power Supply
1620W high-efficiency redundant power supply w/ PMBus
AC Input
  • 1000W Output @ 100-120V, 12-10A, 50-60Hz
  • 1200W Output @ 120-140V, 12-10A, 50-60Hz
  • 1620W Output @ 180-240V, 10.5-8A, 50-60Hz
DC Output
  • 1000W: +12V/84A; +5Vsb/4A
  • 1200W: +12V/100A; +5Vsb/4A
  • 1620W: +12V/150A; +5Vsb/4A
Certification Platinum Level Certified94%+    Platinum Certified
  [ Test Report ]
 
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI BIOS
BIOS Features
  • Plug and Play (PnP)
  • APM 1.2
  • PCI 2.2
  • ACPI 1.0 / 2.0
  • USB Keyboard support
  • SMBIOS 2.3
  • UEFI
 
Operating Environment / Compliance
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
See Parts List

Parts List - (Items Included)
  Part Number Qty Description
Motherboard / Chassis MBD-X9DRFF-iTG+
CSE-F424BG-R1K62BP
4
1
Super X9DRFF-iTG+ Motherboard
4U Chassis
Backplane BPN-ADP-2UGPU 4 Backplan adapter card for 2UGPU
Backplane BPN-ADP-F418L 4 BPN;SASADP;SAS827-H8;H8DTT;cable req
Backplane BPN-SAS-F424-B6 4 6-port Fat Twin 6Gbps hot swappable HDD backplane, support up to 6x 2.5-inch SAS/SATA HDD
Cable 1 CBL-0157L-02 8 CBL,SGPIO,2X4F TO 2X4F,P2.54,RIBBON IN RND TUBE,27CM,28AWG
Cable 2 CBL-0473L 24 SATA,INT,ROUND,ST-ST,21CM,30AWG
Cable 3 CBL-0460L-02 4 8 pin Male to two 4 pin Male power cable, 10cm and 7cm. 18AWG
Riser Card RSC-R2UFF-2E16B 4 RSC-R2UFF-2E16B-O-P
Riser Card RSC-R2UFF-E16A 4 RSC-R2UFF-E16A
Heatsink / Retention SNK-P0047PSC 4 1U Passive Front CPU Heat Sink w/ a Side Air Channel for X9, X10 Systems Equipped with a Narrow ILM MB
Heatsink / Retention SNK-P0047PS 4 1U Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB
Mounting Rail MCP-290-41803-0N 1 Fat twin F418 / F424 Rail set support 28-33.5 inch depth rail,RoHS/REACH,PBF

Optional Parts List
  Part Number Qty Description
Bracket for Xeon Phi MCP-240-42408-0N-PACK 4 System default installed brackets for Nvidia GPUs. This bracket must be ordered if Xeon Phi (MIC) will be implemented
Internal Fan FAN-0150L4 8 Rear internal fan for cooling enhancement
UIO AOC bracket cover MCP-240-42412-0N 4 Front bracket cover for UIO Add-On-Card
Software SFT-OOB-LIC 4 OOB Management Package (per node license)
Software SFT-DCMS-Single 4 DataCenter Management Package (per node license)
Hide Parts List


Note:  Power redundancy is based on configuration. For more information, please refer to user manual.
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.