Key Features
- Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
- 1 PCIe 5.0 x8 (WIO-R),
2 PCIe 5.0 x16 (WIO-L),
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 2280, 22110, M-Key) - 4 PCIe 5.0 X8 via MCIO connectors
- Dual LAN with 10GBase-T with Intel®X550
- Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
- 4 USB 3.2 Gen1(2 rear, 2 via header), 8 SATA3 (via SlimSAS x8)
Key Features
- Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
- 1 PCIe 5.0 x8 (WIO-R),
2 PCIe 5.0 x16 (WIO-L),
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 2280, 22110, M-Key) - 4 PCIe 5.0 X8 via MCIO connectors
- Dual LAN with 1GbE with Intel®I210
- Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
- 4 USB 3.2 Gen1 (2 rear, 2 via header), 8 SATA3 (via SlimSAS x8)
Key Features
- Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 512GB MRDIMM with speeds up to 8000 MT/s (1DPC) or 4TB of RDIMM(3DS) with speeds up to 6400 MT/s (1DPC) or 5200 MT/s (2DPC) in 16 DIMM slots
- 1 PCIe 5.0 x8,
3 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 4.0 x2 via SAS3808n (Form Factor: 2280, 22110, M-Key) - Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
- I/O: 1 COM, TPM header, 1 VGA
