Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s - Intel® C621
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only). - 2 PCI-E 3.0 x16,
8 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8 slot) Or 4 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 and 1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: 1 PCI-E 3.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key - 1 VGA D-Sub Connector port
- Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with Intel® X550 10GBase-T Ethernet Controller
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s - Intel® C621
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
- 2 PCI-E 3.0 x16,
3 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: 1 SATA/PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280
M.2 Key: M-Key - 1 VGA port
- Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with Lewisburg
Marvell 88E1512 PHY
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s - Intel® C622
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
- 4 PCI-E 3.0 x16,
2 PCI-E 3.0 x8
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key,
2 PCI-E 3.0 NVMe x4 Internal Port(s) - 1 VGA port
- Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10GBase-T with Intel® X722 + X557
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s - Intel® C621
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
- 4 PCI-E 3.0 x16,
2 PCI-E 3.0 x8
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key,
2 PCI-E 3.0 NVMe x4 Internal Port(s) - 1 VGA port
- Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 1GbE LAN with Intel® X722
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s - Intel® C627
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
- 3 PCI-E 3.0 x16,
3 PCI-E 3.0 x8
M.2 Interface: 2 PCI-E 3.0 x4
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key (RAID 0,1 support) - 1 VGA port
- Intel® C627 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10GBase-T with Intel® X722 + X557
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s - Intel® C622
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
- 3 PCI-E 3.0 x16,
4 PCI-E 3.0 x8
M.2 Interface: 2 PCI-E 3.0 x4
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key (RAID 0,1 support) - 1 VGA port
- Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10GBase-T with Intel® X722 + X557
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s - Intel® C621
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
- 3 PCI-E 3.0 x16,
4 PCI-E 3.0 x8
M.2 Interface: 2 PCI-E 3.0 x4
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key (RAID 0,1 support) - 1 VGA port
- Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
- Intel® C621
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only). - 6 PCI-E 3.0 x16,
1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key - Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog
- Dual LAN with Intel® X550 10GBase-T Ethernet Controller
- Integrated IPMI 2.0 and KVM with Dedicated LAN
- 5 USB 3.0 ports, 4 USB 2.0 ports
- HD Audio with optical S/PDIF
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s - Intel® C621
- Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only) - 4 PCI-E 3.0 x16,
1 PCI-E 3.0 x32 Riser Slot
M.2 Interface: 1 PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280
M.2 Key: M-Key
M.2 type: SATA and NVMe - Intel® C621 controller for 4 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10GBase-T with Intel® X540 10GbE Controller
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s - Intel® C622
- Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only). - 1 PCI-E 3.0 x32 Left Riser Slot,
1 PCI-E 3.0 x16 Right Riser Slot,
1 PCI-E 3.0 x16 for Add-On-Module (AOM)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
U.2 Interface: PCI-E 3.0 x4,
4 PCI-E 3.0 NVMe x4 Internal Port(s) - 1 VGA port
- Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10Gbase-T
from C622
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s - Intel® C621
- Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only) - 1 PCI-E 3.0 x32 Left Riser Slot,
1 PCI-E 3.0 x16 Right Riser Slot,
1 PCI-E 3.0 x16 for Add-On-Module (AOM)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key - 1 VGA port
- Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with GbE
from C621
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s - Intel® C621
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only). - 4 PCI-E 3.0 x16,
2 PCI-E 3.0 x8
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key,
2 PCI-E 3.0 NVMe x4 Internal Port(s) - 1 VGA port
- Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with GbE from C621
Key Features
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s - Intel® C621
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots
- 3 PCI-E 3.0 x16 (in x16 slot),
3 PCI-E 3.0 x8 - 1 VGA D-Sub Connector port
- Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with GbE from C621
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