System Specifications

Dual Socket BR (LGA-7529)

Intel® Xeon® 6900 series processors with P-cores, up to 128 cores/256 threads, up to 504 MB cache, up to 500 W TDP (air cooled).

System on Chip

AMI 32 MB SPI Flash EEPROM

24 DIMM slots

Max Memory (1DPC): Up to 6 TB, ECC DDR5 RDIMM 6400 MT/s or ECC DDR5 MRDIMM 8800 MT/s

Internal Storage: Two M.2 NVMe slots (M-key)

Drive Bay Options:

Option A: Eight front hot-swappable E3.S 1T PCIe 5.0 x4 NVMe drive bays

Option B: Eight front hot-swappable E3.L 1T PCIe 5.0 x4 NVMe drive bays

Option C: Eight front hot-swappable 2.5" PCIe 5.0 x4 NVMe drive bays

13 PCIe 5.0 x16 FHFL slots (default)

Two M.2 PCIe 5.0 x4 NVMe slots (B+M-key)

LAN: Two RJ45 10 GbE LAN ports (Intel® X710-AT2)

USB: Two USB 3.2 Type-A ports (Rear)

Video: One VGA port

TPM: One TPM header

MBD-X14DBG-AP

CSE-418G3TS-R000NFP 4U Rackmount, 17.2" x 7" x 29" (437 x 178 x 737 mm) (W x H x D)

Fans: Ten 8-cm heavy-duty fans with optimal fan speed control

Air Shroud: One primary, up to five optional (depending on add-on cards)

Four 3200 W Redundant (3 + 1) Titanium Level (96%) power supplies

Input:

1400 W: 100–127 VAC / 50-60 Hz / 16–15.4 A

3200 W: 219.1–240 VAC / 50-60 Hz / 16–14.8 A

Operating Temperature: 10°C to 35°C (50°F to 95°F)

Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)

Operating Relative Humidity: 8% to 90% (non-condensing)

Non-operating Relative Humidity: 5% to 95% (non-condensing)

FCC, ICES, CE, UKCA, VCCI, RCM, NRTL, CB

Compliant with UL or CSA: 418G3-Q32X14; 481G3-32

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. Perchlorate Material-special handling may apply. See https://www.dtsc.ca.gov/hazardouswaste/perchlorate