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Processor Blade SBA-7141A-T

Supermicro, Inc.

   

  Products   SuperBlade   Processor Blade   [ SBA-7141A-T ]





Integrated Board
Super BHQIE

Key Features
1. Four Six-Core / Quad-Core
    AMD Opteron™ 8000 Series (Socket
    F) support; HT3.0 Link support
2. Up to 128GB Registered ECC DDR2
    800/667/533 SDRAM in 16 DIMM
3. Intel® 82576 controllers,
    Dual-Port Gigabit Ethernet
4. 1x 2.5" Internal SATA Drive Support
5. Integrated Matrox G200eW with
    16MB graphics








 
 Drivers & Utilities  BIOS / IPMI  Manuals  Tested Memory  Tested HDD

 

Product SKUs - Discontinued SKU. Please contact sales-rep for possible OEM production quantities. MOQ may apply
SBA-7141A-T
  • Processor Blade SBA-7141A-T (Black)
 
Motherboard

Super BHQIE
 
Processor/Chipset
CPU
  • Quad 1207-pin Socket F
  • Supports up to four Six-Core / Quad-Core / Dual-Core AMD Opteron™ 8000 Series processors
  • HT3.0 Link support ^
Chipset
  • AMD SR5670 +SP5100 Chipset
 
System Memory
Memory Capacity
  • Sixteen 240-pin DIMM sockets
  • Support up to 128GB memory
  • Dual channel memory bus; Single or Dual (recommended) channel memory support
  • For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
Memory Type
  • DDR2 800/667/533 MHz Registered ECC SDRAM 72-bit, 240-pin gold-plated DIMMs
DIMM Sizes
  • 256 MB, 512 MB, 1GB, 2GB, 4GB, 8GB
Memory Voltage
  • 1.8V only
 
On-Board Devices
Infiniband Support
  • 4x QDR(40Gb/s) / DDR(20Gb/s) Infiniband mezzanine HCA (Optional)
SATA
  • AMD SP5100
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM over LAN support
  • Winbond® WPCM450 BMC
Network Controllers
  • Intel® 82576 controller, Dual-Port
      Gigabit Ethernet
  • 10/100/1000BASE-T support
VGA
  • Matrox G200eW 16MB DDR2 graphics
Super I/O
  • Winbond® 83527HG chip
 
System BIOS
BIOS Type
  • 16Mb SPI Flash ROM with AMI® BIOS
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 2.0
  • USB Keyboard Support
  • SMBIOS 2.3
Dimensions
Height
  • 11.32" (288 mm)
Width
  • 1.67" (42.4 mm)
Depth
  • 18.5" (470mm)
Weight
  • 8.6 lbs (3.9 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • KVM button
LEDs
  • Power LED
  • UID / KVM LED
  • Network Activity LED
  • Fault LED
Connector
  • SUV (Serial/USB/Video) & KVM Connector
 
Hard Drive Support
Internal
  • 1x 2.5" Fixed SATA Hard Drive Support
 
Input / Output
KVM
  • 1 Front Connector for Supermicro KVM Card
 
Operating Environment / Compliance
Environmental Spec.
  • Operating Temperature: 10°to 35°C (50°to 95°F)
  • Non-operating Temperature: -40°to 70°C (-40°to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5 to 95% (non-condensing)
 
Electromagnetic Compatibility (EMC)
United States / Canada
  • FCC- Emissions (US) Verification
Europe
  • EN55022 - Emissions
  • EN55024 - Immunity
  • EN61000-3-2 - Harmonics
  • EN61000-3-3 - Voltage Flicker
  • CE - EMC Directive 89/336/EEC
Germany
  • TUV
 
Safety Compliance
United States / Canada
  • UL60950-1 - CSA/CUL 60950-1
Europe
  • EN60950-1, CE - Low Voltage Directive 73/23/EEE
Parts List - (Items Included)
  Part Number Qty Descriptin
Motherboard / Chassis MBD-BHQIE-O-P
CSE-161M-000B
1
1
Super BHQIE Motherboard
Black Front Blade Chassis (B = Black)
Front Panel Control MCP-280-KVM2 1 Power & KVM buttons, LED, KVM connector
Optional Parts List
  Part Number Qty Description
Heatsink / Retention SNK-P0031P 4 Heatsink for AMD CPU
Networking AOC-XEH-iN2
 
AOC-IBH-XDD
 
AOC-IBH-XQD
 
AOC-IBH-XQS
 
AOC-IBH-XDS
 
AOC-IBH-002
 
1
 
1
 
1
 
1
 
1
Dual Port 10G Ethernet AOC for Blade
 
InfiniBand Dual-Port 4x DDR 20Gbps Mezzanine HCA
(Mellanox ConnectX chip)
InfiniBand Dual-Port 4x QDR 40Gbps Mezzanine HCA
(Mellanox ConnectX-2 chip)
InfiniBand Single port 4x QDR 40Gbps Mezzanine HCA
(Mellanox ConnectX chip)
InfiniBand Single port 4x DDR 20Gbps Mezzanine HCA
(Mellanox ConnectX chip)
InfiniBand Single port 4x DDR 20Gbps Mezzanine HCA
(Mellanox ConnectX chip)
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.