X11SDC-8C

COM-HPC Server
Skylake-D
Carrier Board ODM
OEM only

Key Features


  1. Intel® Xeon® Processor D-2146NT, 8-Core, 16 Threads, 80W
  2. Up to 256GB Registered ECC RDIMM or 512GB ECC LRDIMM, DDR4-2400MHz in 4 DIMM slots
  3. Up to 44 PCIe Gen3 lanes (x16, x8, x4, x1) to Carrier Board
  4. Quad 10G BASE-KR ports (SoC) to Carrier Board
  5. Single 1G BASE-T port (Intel i210IT) to Carrier Board
  6. System on Chip
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Specifications Resources Parts List
Specifications
Product SKUs
MBD-X11SDC-8C
Physical Stats
Form Factor
  • COM-HPC
Dimension
  • 6.3" x 6.3" (16cm x 16cm)
Processor
CPU
  • Intel® Xeon® Processor D-2146NT
Core
  • Up to 8 cores, 16 threads / 11MB Cache
System Memory
Memory Capacity
  • 4 DIMM slots
  • Up to 512GB ECC LRDIMM, DDR4-2400MT/s; Up to 256GB ECC RDIMM, DDR4-2400MT/s
Memory Type
  • ECC DDR4 LRDIMM, RDIMM 2400
DIMM Sizes
  • LRDIMM: 16GB, 32GB, 64GB, 128GB
  • RDIMM: 4GB, 8GB, 16GB, 32GB, 64GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
Network Controllers
  • Quad LAN with 10GBase-KR ports (SoC) to Carrier Board
  • Single LAN with 1GBase-T port (Intel® i210-IT) to Carrier Board
Input / Output
TPM
  • 1 TPM Header
Expansion Slots
PCIe
  • Up to 44 PCIe Gen3 lanes (x16, x8, x4, x1) to Carrier Board
System BIOS
BIOS Type
  • AMI UEFI
BIOS Features
  • ACPI 6.2
  • UEFI 2.7
  • SMBIOS 2.8
  • SMBIOS 3.1
  • PCI FW 3.2
  • Plug and Play (PnP)
Operating Environment
Operating Temperature Range
  • 0°C - 60°C (32°F - 140°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Resources
Parts List

X11SDC-8C

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