Integrated Board
Key Features
1. 120 CPUs (+120 GPUs/Xeon Phi) per
42U Rack: support Xeon Phi, K10,
K20M, GRID K2K20X (Kepler)
2. Dual socket R (LGA 2011) supports
Intel® Xeon® processor E5-2600
and E5-2600 v2 family†
3. Intel® C602 Chipset
4. 1x SSD or 1x SATA-DOM supported
5. Up to 256GB RDIMM or 64GB UDIMM;
8x DIMM slots
6. Intel® i350 Dual port Gigabit Ethernet
7. FDR-10/QDR InfiniBand, 10GbE/FCoE
8. IPMI 2.0, KVM over IP, Virtual Media
9. Integrated Matrox G200eW Graphics
SBI-7127RG-E
GPU/Xeon Phi SuperBlade SBI-7127RG-E
(Black)
Super B9DRG-E
CPU
Dual Socket R (LGA 2011)
Intel® Xeon® processor E5-2600
and E5-2600 v2 family†
Note
† BIOS version 3.0 or above is required
Cache
System Bus
Memory Capacity
8x 240-pin DDR3 DIMM slots
Supports up to 256GB DDR3 ECC Registered memory (RDIMM)
Supports up to 64GB DDR3 ECC Unbuffered memory (UDIMM)
Memory Type
1866/1600/1333/1066/800MHz ECC DDR3 SDRAM 72-bit, 240-pin gold-plated DIMMs
DIMM Sizes
32GB, 16GB, 8GB, 4GB, 2GB, 1GB
Memory Voltage
Error Detection
Corrects single-bit errors
Detects double-bit errors (using ECC memory)
Supports Intel® x4 and x8 Single Device Data Correction (SDDC)
Chipset
InfiniBand Support
4x FDR-10 (40Gbps) InfiniBand or 10GbE mezzanine HCA (Optional)
IPMI
Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM)
Network Controllers
Intel® I350 Dual port Gigabit Ethernet
Intel® I/OAT 3 support for fast, scaleable, and reliable networking
VMDq support for better performance of virtualization
Super I/O
BIOS Type
64Mb SPI Flash EEPROM with AMI® BIOS
BIOS Features
Plug and Play (PnP)
PCI 2.2
ACPI up to 3.0
USB Keyboard support
Height
Width
Depth
Weight
Available Colors
Buttons
Power On/Off button
KVM button
LEDs
Power LED
UID / KVM LED
Network Activity LED
Fault LED
Connector
SUV (Serial/USB/Video) & KVM Connector
PCI-Express
SSD
1x SSD or 1x SATA-DOM supported
KVM
1 Front Connector for Supermicro KVM Card
Environmental Spec.
Operating Temperature:
10°C to 35°C (50°F to 95°F)*
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)
United States / Canada
FCC- Emissions (US) Verification
Europe
EN55022 - Emissions
EN55024 - Immunity
EN61000-3-2 - Harmonics
EN61000-3-3 - Voltage Flicker
CE - EMC Directive 89/336/EEC
United States / Canada
UL60950-1 - CSA/CUL 60950-1
Europe
EN60950-1, CE - Low Voltage Directive 73/23/EEE
Germany
Part Number
Qty
Description
Motherboard / Chassis
MBD-B9DRG-E-O-P
CSE-710M-00GB2
1
1
GPU/Xeon Phi Blade with Intel Xeon processor E5-2600 family
GPU/Xeon Phi blade front chassis supporting 2x GPU/Xeon Phi or 1x GPU/Xeon Phi with 4x 2.5
Front Panel Control
MCP-280-KVMG-O-P
1
Power & KVM buttons, LED, KVM connector
Riser Card
RSC-BLG-E16G-O-P
RSC-BLG-E16GR-O-P
1
1
Riser Cards
Part Number
Qty
Description
Heatsink / Retention
SNK-P0047PS
2
Heatsink for Intel CPU
SDD Drive Bracket
MCP-620-00141-0N
1
SDD Drive Bracket for SBI-7127RG-E
Networking
AOC-XEH-iN2
AOC-IBH-X3QD
AOC-IBH-X3QS
AOC-IBH-XDD
AOC-IBH-XQD
AOC-IBH-XQS
AOC-IBH-XDS
1
1
1
1
1
1
1
Dual Port 10G Ethernet AOC for Blade
InfiniBand Dual Port FDR AOC
InfiniBand Single Port FDR AOC
InfiniBand Dual-Port 4x DDR 20Gbps Mezzanine HCA (Mellanox ConnectX chip)
InfiniBand Dual-Port 4x QDR 40Gbps Mezzanine HCA (Mellanox ConnectX-2 chip)
InfiniBand Single port 4x QDR 40Gbps Mezzanine HCA (Mellanox ConnectX chip)
InfiniBand Single port 4x DDR 20Gbps Mezzanine HCA (Mellanox ConnectX chip)