Memory List
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Module Vendor Module Part # Chip
Vendor
Chip Part # PCB
Module
Buffered
Chips
Buffered
Chips Part #
ATP Electronics AG64L72T8SQC4S Samsung K4H560838D-TCC4 9 x 2
ECC
0 -
Buffalo Technology DD4344-512/SD
PC3200U-30440-B1
Samsung K4H560838D-TCC4 8 x 2
0 -
Smart Modular Technologies SM6472DDR2N1-1 Qimonda / Infineon HYB25D256800BT-5B 9 x 2
ECC
0 -
Smart Modular Technologies SM6472DDR2N1-S
M381L6423DTM-CC4
Samsung K4H560838D-TCC4 9 x 2
ECC
0 -
Super Talent Electronics, Inc. D32PB12C2 Winbond V58C2256804SA-T5B 8 x 2
0 -
Low-Profile Modules
ATP Electronics AG64L64T8SQC4S Samsung K4H560838D-TCC4 8 x 2
Low-Profile
0 -
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.