Key Applications / Features
- Mission-critical applications
- High Availability Storage Appliance Platform
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
3. 2 PCI-E 3.0 x16 slots4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN5. 4 Hot-swap 2.5" SAS3 drive bays6. Broadcom 3108 SAS3 controller;
RAID 0, 1, 5, 6, 10, 50, 60 with
SuperCap option7. 2 SuperDOM onboard8. Up to 1000W Redundant Power Supplies Titanium Level (96%)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡, Dual UPI up to 10.4GT/s
Support CPU TDP 70-145W (Consult with SYS PM for higher CPU TDP Supports)
Cores
Up to 28 Cores
Note
*Processors ending N or S are optimized for networking and storage applications. Customer need POC their application and observe any thermal throttling before large deployment.
Note
‡
BIOS version 3.2
or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
(per Node)
Memory Capacity
16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Memory Type
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note
† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
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