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Key Features
- Compute Intensive Application
- HPC, Data Center, Enterprise
Server
- Hyperscale / Hyperconverged
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 1 PCI-E 3.0 x16 (LP) slot; 1
SIOM
card support (flexible networking)
Note: must bundle with Network card
4. 6 SAS3 or 4 NVMe + 2 SAS3
Hot-swap 2.5" drive bays;
2 M.2 SATA3 or NVMe support
5. SAS3 support via Broadcom 3108;
RAID 0, 1, 5, 6, 10, 50, 60
6. 1 Carrier Card slot (M.2 support)
7. IPMI 2.0 + KVM with dedicated LAN
8. Video via Aspeed AST2500 BMC
9. 4 Heavy duty 8cm PWM fans with
air shroud
10. 2200W Redundant Power Supplies
Titanium Level (96%)
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Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system
(with minimum 2 CPUs, 2 DIMMs, 1 HDD/NVMe and 1 SIOM card per node).
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| SYS-2029BT-HNC1R |
- SuperServer 2029BT-HNC1R (Black)
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CPU |
- Dual Socket P (LGA 3647)
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
Dual UPI up to 10.4GT/s
- Support CPU TDP 70-205W*
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Cores |
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Note |
* 200W/205W CPUs are supported under certain configurations. Please contact Supermicro Technical Support for additional information about specialized system optimization
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Note |
‡
BIOS version 3.2
or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R). Extended thermal solutions may be required to support CPUs higher than 165W TDP, please contact Supermicro Technical Support for additional information. |
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Memory Capacity |
- 24 DIMM slots
- Up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM††
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Memory Type |
- 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
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Note |
† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro †† Cascade Lake only. Contact your Supermicro sales rep for more info.
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Chipset |
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SAS |
- SAS3 (12Gbps) via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
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Network |
- Must bundle with at least one
SIOM
network card
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IPMI |
- Support for Intelligent Platform Management Interface v.2.0
- IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
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Video |
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LAN |
- 1 RJ45 Dedicated IPMI LAN port
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USB |
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Video |
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DOM |
- 1 SuperDOM (Disk on Module) port
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Others |
- M.2 and SATA DOM for boot drive only
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BIOS Type |
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Software |
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Power Configurations |
- ACPI / APM Power Management
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CPU |
- Monitors for CPU Cores, Chipset Voltages, Memory.
- 4+1 Phase-switching voltage regulator
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FAN |
- Fans with tachometer monitoring
- Status monitor for speed control
- Pulse Width Modulated (PWM) fan connectors
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Temperature |
- Monitoring for CPU and chassis environment
- Thermal Control for fan connectors
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| Form Factor |
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Model |
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| Width |
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Height |
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Depth |
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Package |
- 24.65" (H) x 9.76" (W) x 45.28" (D)
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Weight |
- Gross Weight: 85 lbs (38.6kg)
- Net Weight: 54.5 lbs (24.7 kg)
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Available Colors |
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| Buttons |
- Power On/Off button
- UID button
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LEDs |
- Power status LED
- HDD activity LED
- Network activity LEDs
- Universal Information (UID) LED
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PCI-Express |
- 1 PCI-E 3.0 (x16) Low-profile slot
- 1
SIOM
card support
(must bundle with network card)
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| Hot-swap |
- 6 Hot-swap 2.5" SAS3 drive bays or
4 NVMe + 2 SAS3 Hot-swap 2.5"
Please contact Supermicro Technical Support for additional information about HDD and SSD if mixed. Some restrictions and configuration rules that apply to SSD are different from HDD.
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M.2 |
- 2 M.2 NVMe or SATA (2240/2260/2280) via optional AOC-SMG3-2H8M2-B
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| Fans |
- 4 Heavy duty 8cm PWM fans with air shroud
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2200W Redundant Power Supplies with PMBus |
Total Output Power |
- 1200W/1800W/1980W/2090/2200W
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Dimension (W x H x L) |
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Input |
- 1200W: 100-127Vac / 50-60Hz
- 1800W: 200-220Vac / 50-60Hz
- 1980W: 220-230Vac / 50-60Hz
- 2090W: 230-240Vac / 50-60Hz
- 2090W: 180-220Vac (for UL/cUL only)
- 2200W: 220-240Vac (for UL/cUL only)
- 2090W: 230-240Vdc (for CCC only)
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+12V |
- Max: 100A / Min: 0A (100-127Vac)
- Max: 150A / Min: 0A (200-220Vac)
- Max: 165A / Min: 0A (220-230Vac)
- Max: 174.17A / Min: 0A (230-240Vac)
- Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
- Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)
- Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
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12Vsb |
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Output Type |
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Certification |
Titanium Level [ Test Report ]
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| RoHS |
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Environmental Spec. |
- Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
- Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
- Operating Relative Humidity:
8% to 90% (non-condensing)
- Non-operating Relative Humidity:
5% to 95% (non-condensing)
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See Parts List
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Part Number
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Qty
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Description
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Motherboard / Chassis |
MBD-X11DPT-B
CSE-217BHQ+-R2K22BP2 |
4 1 |
Super X11DPT-B Motherboard
2U Chassis |
Add-on Card / Module
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AOC-S3108L-H8IR-16DD-P |
4
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AOC-S3108L-H8iR-16DD |
Backplane
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BPN-ADP-4TNS6-1UB |
4
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for Big Twin only |
Backplane
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BPN-SAS3-217BHQ-N4 |
1
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2U 4-Node 24-Port Backplane Supports 2x2.5\" SATA3/SAS3 SSD/HDD and 4x2.5\" SATA3/SAS3/NVMe storage Media per Node |
Cable 1
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CBL-PWCD-0578 |
2
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PWCD,US,IEC60320 C14 TO C13,3FT,14AWG |
Cable 2
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CBL-SAST-0846-1 |
4
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SLIMLINE SAS to MiniSAS HD 2X,INT,48CM, SB |
Drive Tray(s)
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MCP-220-00141-0B-BULK |
8
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Black Gen3 hot-swap 2.5 inch HDD tray with lock improved EMI |
Drive Tray(s)
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MCP-220-00144-0B-BULK |
16
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Black Gen3 hot-swap 2.5 inch HDD tray with lock, orange tab |
Parts
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MCP-240-21730-0N |
1
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217B BigTwin type I (Impact) BPN retention bkt w/ foam assy |
Air Shroud
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MCP-310-21718-0B |
4
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Bigtwin air box for X11DPT-B(4pcs/set) |
Air Shroud
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MCP-310-21724-0B |
4
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Bigtwin 2U4N plastic air shroud (2pcs) for Cascade lake MB |
Manual
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MNL-1948-QRG |
1
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2029BT-H(N/T/NC0)R Quick Reference Guide |
Riser Card
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RSC-P-6 |
4
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RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
Riser Card
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RSC-R1UTP-E16R |
4
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1U RHS TwinPro Riser card with one PCI-E x16 slot |
Heatsink / Retention
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SNK-P0067PS |
4
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1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
Heatsink / Retention
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SNK-P0067PSM |
4
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1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
Fan
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FAN-0183L4 |
4
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80x80x38 mm, 16.5K RPM, Non-hot-swappable Middle Cooling Fan |
Power Supply
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PWS-2K22A-1R |
2
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1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48 |
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Part Number |
Qty |
Description |
TPM security module |
AOM-TPM-9670H-S |
1 |
SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor |
TPM security module |
AOM-TPM-9671H-S |
1 |
SPI Capable TPM 1.2 Provisioned for Server, Horizontal Form Factor |
Intel VROC RAID Key |
AOC-VROCINTMOD AOC-VROCSTNMOD AOC-VROCPREMOD |
1 1 1 |
Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only) Intel VROC Standard, RAID 0, 1, 10 Intel VROC Premium, RAID 0, 1, 5, 10 |
Global Services & Support |
OS4HR3/2/1 OSNBD3/2/1 |
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3/2/1-year onsite 24x7x4 service 3/2/1-year onsite NBD service |
Software |
SFT-OOB-LIC • |
1 |
OOB Management Package (per node license) |
Software |
SFT-DCMS-Single |
1 |
DataCenter Management Package (per node license) |
SuperDOM |
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Supermicro SATA DOM Solutions [Details] |
Network Card(s) |
AOC-S40G-i2Q
AOC-SGP-i2
AOC-SGP-i4
AOC-STG-b4S
AOC-STGN-i2S
AOC-STGN-i1S
AOC-STG-i2T
AOC-STG-i2 |
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Standard LP 2-port 40GbE controller, based on Intel Fortville XL710
Standard LP, 2x GbE RJ45, PCI-E x4, Intel i350AM2
Standard LP, 4x GbE RJ45, PCI-E x4, Intel i350
Standard LP, 4x 10GbE SFP+, PCI-E x8, Broadcom BCM57840S
Standard LP, 2x 10GbE SFP+, PCI-E x8, Intel 82599ES
Standard LP, 1x 10GbE SFP+, PCI-E x8, Intel 82599EN
Standard LP, 2x 10GbE RJ45, PCI-E x8, Intel X540
Standard LP, 2x 10GbE CX4, PCI-E x8, Intel 82598EB |
Carrier Card(s) |
AOC-SMG3-2H8M2-B
AOC-SMG2-2TM2 |
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2x Hybrid NVMe/SATA M.2 carrier for BigTwin,HF,RoHS
2x SATA M.2 RAID 1 adapter for BigTwin,HF,RoHS |
Cache Protection for RAID Card |
BTR-TFM8G-LSICVM02 & BKT-BBU-BRACKET-05 |
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CacheVault for Broadcom 3108; Supercap mounting bracket for PCI-E location [Details] |
Hide Parts List
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