Supermicro AS -2117GT7-DNF | 2U GrandTwin Server

A 2U 2-node GrandTwin® server featuring a single AMD EPYC™ 9006 processor with up to 256 cores and up to 4TB DDR5 memory per node, as well as front I/O and double-width GPU support — purpose-built for HPC, manufacturing, telco, 3D rendering, cloud, virtualization, web hosting, streaming, and scale-out object storage workloads.

Integrated Board: H15SPT-G
さらに詳しく

Key Applications

  • IoT Gateway
  • Deep Learning/AI/Machine Learning Development
  • Scale-Out Object Storage
  • Cloud Gaming
  • Telco Edge
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • High Performance Computing (HPC)
  • Cluster Node
  • GPU Virtualization (VDI)
  • HPC cluster computer nodes

Key Features

Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Single Socket AMD EPYC™ 9006 SP7 Series Processors up to 256 cores
  2. Support for up to 1 double-width or 2 single-width GPU accelerator cards
  3. Supports up to 2 PCIe 6.0 x16 FHHL slots or 1 PCIe 6.0 x16 FH/10.5"L Double Width slot
  4. Supports up to 16 DDR5 RDIMMs/MRDIMMs
  5. Flexible networking with 1 AIOM slot (OCP 3.0 SFF compliant)
  6. Up to 8 front hot-swap 2.5"/E1.S/E3.S NVMe drive bays
  7. Dual Redundant Titanium Level power supplies (Power supply full redundancy based on configuration and application load)
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AS-2117GT7-DNF
Specifications Free Remote Testing Resources & Downloads Parts List
Specifications
Product SKUs
AS -2117GT7-DNF
Motherboard
Super H15SPT-G
Processor (per Node)
CPU
  • Single processor(s)
  • AMD EPYC™ 9006 SP7 Series Processors
Core Count
  • Up to 256C/512T
Note
  • Supports up to 600W TDP CPUs (Air Cooled)
GPU (per Node)
Max GPU Count
  • Up to 1 double-width or 2 single-width GPUs
System Memory (per Node)
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (1DPC): Up to 4TB 8000MT/s ECC DDR5 RDIMM/3DS RDIMM
  • Max Memory (1DPC): Up to 4TB 12800MT/s ECC DDR5 MRDIMM
Memory Voltage
  • 1.1V
On-Board Devices (per Node)
Network Connectivity
  • Via IO Module
Input / Output (per Node)
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 USB 3.0 ports
Video
  • 1 VGA port
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 64MB Flash ROM
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
Fan
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
Voltage
  • +12V, +12V standby, +3.3V, +3.3V standby, +5V, +5V standby, 1.8V standby, VBAT
Certifications
Operating Systems
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-GT222DF-000NDTFP
Dimensions and Weight
Height
  • 3.46" (88 mm)
Width
  • 17.67" (449 mm)
Depth
  • 31.8" (807.7 mm)
Package
  • 13.46" (H) x 29.13" (W) x 46.46" (D)
Weight
  • Gross Weight: 84.2 lbs (38.2 kg)
  • Net Weight: 64.2 lbs (29.1 kg)
Available Color
  • Silver
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
  • Option A*
    • 2 PCIe 6.0 x16 FHHL slots
    • 1 PCIe 6.0 x16 AIOM slot (OCP 3.0 compatible)
  • Option B*
    • 1 PCIe 6.0 x16 AIOM slot (OCP 3.0 compatible)
  • Option C*
    • 1 PCIe 6.0 x16 FH/10.5"L double-width slot
    • 1 PCIe 6.0 x16 AIOM slot (OCP 3.0 compatible)
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
CXL Support
  • Up to 2 CXL 3.1 x16 devices
Drive Bays / Storage (per Node)
Drive Bays Configuration
  • Default: Total 4 bays
    • 4 front hot-swap 2.5" PCIe 5.0 NVMe* drive bays
  • Option A: Total 8 bays
    • 8 front hot-swap 2.5" PCIe 5.0 NVMe* drive bays
  • Option B: Total 8 bays
    • 8 front hot-swap E1.S PCIe 6.0 NVMe* drive bays
  • Option C: Total 8 bays
    • 8 front hot-swap E3.S 1T PCIe 6.0 NVMe* drive bays
  • (*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)
M.2
  • 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110; Optional Configuration)
System Cooling
Fans
  • 2x 18.7K RPM Heavy Duty 8cm Fan(s)
  • 2x 17.6K RPM Heavy Duty 8cm Fan(s)
Power Supply
2x 2200W
2x 2200W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 106.5 x 84 x 245.3 mm
Input 1200W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2090W: 230-240Vac / 50-60Hz (for TUV/CB)
2090W: 180-220Vac / 50-60Hz (For UL/cUL Only)
2090W: 230-240Vdc / 50-60Hz (for CQC only)
2200W: 220-240Vac / 50-60Hz (For UL/cUL Only)
+12V Max: 100A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 174.17A / Min: 0A (180Vac-220Vac) (For UL/cUL Only)
Max: 174.17A / Min: 0A (180Vdc-220Vdc) (For UL/cUL only)
Max: 174.17A (230Vac-240Vac)
Max: 183.3A / Min: 0A (220Vac-240Vac)
Max: 183.3A / Min: 0A (220Vac-240Vac) (For UL/cUL only)
12V SB Max: 2A / Min: 0A
Output Type Backplanes (gold finger)
2x 3000W
2x 3000W Redundant (1 + 1) Titanium (certification pending) Level (96%) power supplies
Dimension (WxHxL) 106.5 x 84 x 245.3 mm
Input 2880W: 240-240Vdc / 50-60Hz (for CQC only)
3000W: 200-240Vac / 50-60Hz
+12V Max: 240A / Min: 0A (240Vdc-240Vdc) (for CQC safety rating only)
Max: 250A / Min: 0A (200Vac-240Vac)
12V SB Max: 3A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
Free Remote Testing

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アクセスのスケジュール
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
4 U.2 NVMe Option (Per Node) AOM-GT222DF-EXT-P 1 Front IO Extension board for H15/X15 GrandTwin, Gen Z 4C x8 support,RoHS
BPN-NVME6-826N-B2B 2 2-Slot 2.5" PCIe Gen 6 NVMe Storage Backplane
CBL-MCIO-1545M6PF 1 MCIO x8 (Prefold to STR),45cm,30AWG,RoHS
CBL-MCIO-1550M6PF 1 MCIO x8 (Prefold to STR),50cm,30AWG,RoHS
CBL-PWEX-1136YB-25 • 1 MicroHi(2x4 to 2x2Y),PH3.0,25/25cm,8.5A/p,18AWG,RoHS
MCP-220-00167-0B • 4 Gen 3 2.5-inch Tool-less NVMe drive tray (clip design),RoHS
MCP-220-22208-0N 1 GT222DF GrandTwin 2U2N 4xU.2 FIO MB tray for bulk packing,RoHS
MCP-220-22214-0N 2 GT222DF FIO 2.5" HDD cage (2x 2.5" HDD),RoHS
6 U.2 NVMe Option (Per Node) AOM-GT222DF-EXT-P 1 Front IO Extension board for H15/X15 GrandTwin, Gen Z 4C x8 support,RoHS
BPN-NVME6-826N-B2B 3 2-Slot 2.5" PCIe Gen 6 NVMe Storage Backplane
CBL-MCIO-1545M6PF 2 MCIO x8 (Prefold to STR),45cm,30AWG,RoHS
CBL-MCIO-1550M6PF 1 MCIO x8 (Prefold to STR),50cm,30AWG,RoHS
CBL-PWEX-1136YB-25 • 1 MicroHi(2x4 to 2x2Y),PH3.0,25/25cm,8.5A/p,18AWG,RoHS
MCP-220-00167-0B • 6 Gen 3 2.5-inch Tool-less NVMe drive tray (clip design),RoHS
MCP-220-22208-0N 1 GT222DF GrandTwin 2U2N 4xU.2 FIO MB tray for bulk packing,RoHS
MCP-220-22214-0N 3 GT222DF FIO 2.5" HDD cage (2x 2.5" HDD),RoHS
8 E1.S NVMe Option (Per Node) AOM-GT222DF-EXT-P 1 Front IO Extension board for H15/X15 GrandTwin, Gen Z 4C x8 support,RoHS
BPN-E1Q5-GT214N 2 1U 4-slot PCle GEN5 E1.S Storage backplane
CBL-MCIO-1545M6PF 3 MCIO x8 (Prefold to STR),45cm,30AWG,RoHS
CBL-MCIO-1550M6PF 1 MCIO x8 (Prefold to STR),50cm,30AWG,RoHS
CBL-PWEX-1136YB-25 • 1 MicroHi(2x4 to 2x2Y),PH3.0,25/25cm,8.5A/p,18AWG,RoHS
MCP-220-12603-0B 8 E1.S_FRONT_LATCH_ASM with Tray (33.75mm height x15mm W)
MCP-220-22209-0N 1 GT222DF GrandTwin 2U2N 8xE1.S FIO MB tray for bulk packing,RoHS
8 E3.S 1T NVMe Option (Per Node) AOM-GT222DF-IO-P 1 Front IO Board; For GrandTwin; 1xBMC dedicated LAN, 2x USB3.0, 1xVGA support Narrow GrandTwin FIO,RoHS
BPN-E3Q5-146E32N 2 Backplane for 1U EDSFF short form 16x NVMe dense storage
CBL-MCIO-1545LFO6Y 2 MCIOx8,Prefold to 2 E3.S-1016 1C,45cm,30#,G6,RoHS
CBL-MCIO-1549RFO6Y 1 MCIOx8,Prefold to 2 E3.S-1016 1C,49cm,30#,G6,RoHS
CBL-MCIO-1555O6Y 1 MCIO x8 to 2 E3.S-1016 1C, Gen 6, 55cm, 30AWG, RoHS
CBL-PWEX-1136YB-25 • 1 MicroHi(2x4 to 2x2Y),PH3.0,25/25cm,8.5A/p,18AWG,RoHS
MCP-220-22210-0N 1 GT222DF GrandTwin 2U2N 8xE3.S MB tray for bulk packing,RoHS
MCP-220-23601-0B 8 E3.S 1T EDSFF tool-less tray (76mm W x 7.5mm T x 112.75mm L)
8 U.2 NVMe Option (Per Node) AOM-GT222DF-EXT-P 1 Front IO Extension board for H15/X15 GrandTwin, Gen Z 4C x8 support,RoHS
BPN-NVME6-826N-B2B 4 2-Slot 2.5" PCIe Gen 6 NVMe Storage Backplane
CBL-MCIO-1520M6-G 4 MCIO x8 (STR to STR),20cm,32AWG,Gen6,RoHS
CBL-PWEX-1136YB-25 • 2 MicroHi(2x4 to 2x2Y),PH3.0,25/25cm,8.5A/p,18AWG,RoHS
MCP-220-00167-0B • 8 Gen 3 2.5-inch Tool-less NVMe drive tray (clip design),RoHS
MCP-220-22208-0N 1 GT222DF GrandTwin 2U2N 4xU.2 FIO MB tray for bulk packing,RoHS
MCP-220-22214-0N 4 GT222DF FIO 2.5" HDD cage (2x 2.5" HDD),RoHS
Air Shroud (Per Node) MCP-310-22210-0B 1 GT222DF GrandTwin 2U2N H15 plastic air shroud for EVAC H/S,RoHS
MCP-310-22211-0B 1 GT222DF GrandTwin 2U2N H15 plastic air shroud for 2U H/S,RoH
Fan FAN-0231L4-3N 2 80x80x56mm, Counter Rotating Fan Module for GrandTwin FIO
FAN-0251L4-8N 2 80x80x80mm, 18.7K-15.1K RPM, Counter-Rotating Fan, Rear Access
Front AIOM Option (Per Node) AOM-AIOM-HS102-P 1 AIOM slot extension board,RoHS
CBL-LCIO-1545RM6PF 2 MCIOx8 (RA LP to STR PF),45cm,30AWG,Gen6,RoHS
CBL-OTHR-0795PF-25 1 FLAT,IDC 2X11F/P1.27 at both ends, NCSI,25CM,W/PF,30AWG,RoHS
CBL-OTHR-1115 1 2x15 to 2x15,18cm,28AWG,1A/pin,RoHS
CBL-PWEX-1131-20 1 MicroHi (2x2 to 2x2), PH3.0, 20cm, 9.5A/p, 18AWG, RoHS
GPU Option (Per Node) AOM-PDB-GT222DF-P 1 X15/H15 GrandTwin 2U2N, GPU PDB board, RoHS
CBL-CDAT-1116-14 1 NCSI, (2x8F to 2x8F), PH1.0, 14cm,30AWG, RoHS,RoHS
CBL-PWEX-1316-31 1 12V-2x6 H++,12P+4S/(STR to STR), 31cm,8.33A/p,16AWG,RoHS
MCP-240-22205-0N 1 GT222DF GrandTwin 2U2N riser bracket kits for DW GPU,RoHS
SNK-P0103PV 1 2U Passive CPU Heat Sink for AMD Socket SP7 Processors
GrandTwin I/O Module (Per Node) AOC-G200G-B1C-P 1 Grand Twin I/O card 1-Port 200GbE QSFP56, Broadcom Thor2
AOC-G25G-M2SN-P 1 Grand Twin I/O card 2-Port 25GbE SFP28, Mellanox CX-4 Lx, with N-SKU Bracket
AOC-GTG-B2T-P 1 Grand Twin I/O card 2-Port 10GbE RJ45, Broadcom BCM57416
AOC-GTG-i2TN-P 1 Grand Twin I/O card 2-Port 10GbE RJ45, Intel X710-AT2
Heat Sink (Per Node) SNK-P0103PV 1 2U Passive CPU Heat Sink for AMD Socket SP7 Processors
SNK-P2103PV 1 2U Passive EVAC CPU HS for H15 GrandTwin,RoHS
Power Supply PWS-2K21A-BR • 2 2200W MicroBlade redundant Power Supply, Titanium Level
PWS-3K01A-BR • 2 Blade 3000W Redundant Titanium w/PMBus power supply, W106.5xH84xL245.3mm, C20 inlet

AS -2117GT7-DNF | 2U GrandTwin Server

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