Supermicro 解决方案基于特尔® 至强™-D 处理器

Supermicro 利用其在服务器技术方面的深厚专业知识, 为客户带来了第一个英特尔® 至强™ D 系统-芯片（SoC）系列解决方案、 具有服务器级的可靠性、可用性和可维护性（RAS）功能，可在超高密度和低功耗解决方案。至强 D 将英特尔® 至强™ 处理器的性能和高级智能集成到一个高密度、低功耗的系统芯片上。这些解决方案将能够为智能边缘网络设备、中端网络、冷和热存储环境（如存储和网络安全设备、SMB 存储服务器、Hadoop、web 主机）提供优化的计算和存储。控制器、专用计算节点和其他类似的应用程序。

这些先进的模组化构建式技术匹配英特尔® 至强™ 处理器 D 系列，提供了最佳的工作负载优化解决方案和的长期可用性, 包括:

  • 多达 16 内核, 可提供高达三倍的性能改进
  • 高达: 512GB ECC DDR4 LRDIMM 工作在 2666MHz
  • PCI-E 3.0 x16 和 PCI-E 3.0 x8 插槽, USB 3.0 I/O
  • 12 SATA 3.0 存储端口
  • 四倍 10 GbE plus 四倍 GbE LAN 网络
  • IPMI 2.0
  • 8-pin 12V DC 或ATX 电源
  • 7 年产品寿命

Resources

英特尔® 至强® 处理器 D
  • 低功耗、更高的物理密度
  • 集成 I/O 的单片 BGA 解决方案
  • 至强® 芯片、最佳性价比插座
SYS-1019D-FHN13TP
SYS-1019D-FHN13TP
  • Multi-Access Edge Computing (MEC), Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV), Artificial Intelligence (AI)
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Hot-swap 2.5" drive bays and 2 Internal 2.5" SSD bays
  • 3 M.2: M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 350W AC-DC Multi-output Platinum Level Power Supply
SYS-1019D-4C-FHN13TP
SYS-1019D-4C-FHN13TP
  • Multi-Access Edge Computing (MEC), Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV), Artificial Intelligence (AI)
  • Intel® Xeon® processor D-2123IT SoC, 4-Cores, 8 Threads, 60W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2666MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Hot-swap 2.5" drive bays and 2 Internal 2.5" SSD bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 350W AC-DC Multi-output Platinum Level Power Supply
SYS-1019D-16C-FHN13TP
SYS-1019D-16C-FHN13TP
  • Multi-Access Edge Computing (MEC), Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV), Artificial Intelligence (AI)
  • Intel® Xeon® processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Hot-swap 2.5" drive bays and 2 Internal 2.5" SSD bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 500W Multi-output Platinum Level Power Supply
SYS-1019D-14CN-FHN13TP
SYS-1019D-14CN-FHN13TP
  • Multi-Access Edge Computing (MEC), Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV), Artificial Intelligence (AI)
  • Intel® Xeon® processor D-2177NT SoC, 14-Cores, 28 Threads, 105W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2666MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Hot-swap 2.5" drive bays and 2 Internal 2.5" SSD bays
  • 3 M.2: M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 (FHFL) slots
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 500W Multi-output Platinum Level Power Supply
SSG-5019D8-TR12P
SSG-5019D8-TR12P
12x 3.5" SATA3 drive bays
  • Warm storage, CDN, Web or DB Server, Multi-access Edge Computing, VM and SMB Servers
  • Intel® Xeon® processor D-2146NT (8-Core)
  • 12x 3.5" SATA3 Drive Bays, SAS3 support by AOC
  • 4 DIMMs, up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM, DDR4-2133MHz memory
  • 1 PCI-E 3.0 x8 (FH), M.2: M Key and B Key
  • 2x 10GBase-T, 4x 1GbE, 2x 10G SFP+ ports, 1x dedicated IPMI LAN port
  • I/O ports: 1 VGA, 1 COM, 2 USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 6x 40mm 4-pin fans
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-FRN5TP
SYS-1019D-FRN5TP
  • Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV)
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2x 2.5” drive bays (one drive space shares with M.2), 2 EDSFF
  • 2 M.2: M-Key: 2280/22110, 1 M.2 E-Key: 2230, 1 M.2 B-Key: 3042
  • 4 PCI-E 3.0 x8 slots for optional AIOM
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-12C-FRN5TP
SYS-1019D-12C-FRN5TP
  • Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV)
  • Intel® Xeon® processor D-2163IT SoC, 12-Cores, 24 Threads, 75W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2x 2.5” drive bays (one drive space shares with M.2), 2 EDSFF
  • 2 M.2: M-Key: 2280/22110, 1 M.2 E-Key: 2230, 1 M.2 B-Key: 3042
  • 4 PCI-E 3.0 x8 slots for optional AIOM
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-14C-FRN5TP
SYS-1019D-14C-FRN5TP
  • Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV)
  • Intel® Xeon® processor D-2173IT SoC, 14-Cores, 28 Threads, 70W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2x 2.5” drive bays (one drive space shares with M.2), 2 EDSFF
  • 2 M.2: M-Key: 2280/22110, 1 M.2 E-Key: 2230, 1 M.2 B-Key: 3042
  • 4 PCI-E 3.0 x8 slots for optional AIOM
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-16C-FRN5TP
SYS-1019D-16C-FRN5TP
  • Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV)
  • Intel® Xeon® processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2x 2.5” drive bays (one drive space shares with M.2), 2 EDSFF
  • 2 M.2: M-Key: 2280/22110, 1 M.2 E-Key: 2230, 1 M.2 B-Key: 3042
  • 4 PCI-E 3.0 x8 slots for optional AIOM
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-FRN8TP
SYS-1019D-FRN8TP
  • Network Security Appliance, FireWall Applications, Virtualization, SD-WAN and vCPE/uCPE
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2666MHz in 4 DIMM slots
  • 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0 (front)
  • Up to 4 Internal fixed 2.5" drive bays
  • 1 M.2 M-Key for storage: 2242/2280, 1 M.2 B-Key for SSD & WAN: 2242
  • 2 USB 3.0 (front), 1 VGA (front)
  • 400W Redundant Platinum Level Power Supplies
SYS-5019D-FN8TP
SYS-5019D-FN8TP
  • Network Security Appliance, SDN-WAN, vCPE controller box, NFV Edge Computing Server, Virtualization Server, IoT Edge Computing / Gateway
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2666MHz in 4 DIMM slots
  • 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Internal 3.5" or 4 Internal 2.5" drive bays
  • 1 M.2 slot M key for SSD, 2242/8, 1 M.2 B Key for SSD/ WAN card,
    1 Mini-PCI-E with mSATA Support, 1 PCI-E 3.0 x8 slot
  • 2 USB 3.0, 1 VGA
  • 200W Low-noise AC-DC Power Supply
SYS-5019D-4C-FN8TP
SYS-5019D-4C-FN8TP
  • Network Security Appliance, SDN-WAN, vCPE controller box, NFV Edge Computing Server, Virtualization Server, IoT Edge Computing
  • Intel® Xeon® processor D-2123IT SoC, 4-Cores, 8 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2666MHz in 4 DIMM slots
  • 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Internal 3.5" or 4 Internal 2.5" drive bays
  • 1 M.2 slot M key for SSD, 2242/80, 1 M.2 B Key for SSD/ WAN card,
    1 Mini-PCI-E with mSATA Support, 1 PCI-E 3.0 x8 slot
  • 2 USB 3.0, 1 VGA
  • 200W Low-noise AC-DC Power Supply
SYS-E403-9D-4C-FN13TP
SYS-E403-9D-4C-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2123IT SoC, 4-Cores, 8 Threads, 60W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-8CN-FN13TP
SYS-E403-9D-8CN-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-12C-FN13TP
SYS-E403-9D-12C-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2163IT SoC, 12-Cores, 24 Threads, 75W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-14C-FN13TP
SYS-E403-9D-14C-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2173IT SoC, 14-Cores, 28 Threads, 70W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-14CN-FN13TP
SYS-E403-9D-14CN-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2177NT SoC, 14-Cores, 28 Threads, 105W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 2242/3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-16C-FN13TP
SYS-E403-9D-16C-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E300-9D
SYS-E300-9D
  • Network Security Appliance, SDN-WAN, vCPE controller box, NFV Edge Computing Server, Virtualization Server, IoT Edge Computing / Gateway
  • Intel® Xeon® processor D-2123IT SoC, 4-Cores, 8 Threads, 60W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2666MHz in 4 DIMM slots
  • 2x 10GBase-T LAN and 1 dedicated LAN for IPMI 2.0
  • 1 Internal 2.5" drive bay
  • 1 onboard OCuLink port (or 1 PCI-E 3.0 x4 NVMe), 1 PCI-E 3.0 x8 (LP) open slot
  • 2 USB 3.0, 1 VGA, 1 TPM 2.0 header
  • 120W Lockable DC Power Adapter
SYS-5039MD8-H8TNR
SYS-5039MD8-H8TNR
  • Cloud computing, dynamic web serving, dedicated hosting, content delivery network, memory caching, and corporate applications
  • 8 modular UP Nodes in 3U; EACH NODE:
  • Intel® Xeon® processor D-2141i SoC, 8-Cores, 16 Threads, 65W
  • Up to 512GB ECC LRDIMM, up to 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2 GbE LAN ports and 1 dedicated LAN supports IPMI 2.0
  • 2x 3.5" SATA3 or 2x 2.5" Hybrid SATA3/NVMe w/ optional kits
  • 1 PCI-E 3.0 x16, 1 Micro-LP, and 2 M.2
  • 1600W Redundant Titanium Level Power Supplies
SYS-5039MD18-H8TNR
SYS-5039MD18-H8TNR
  • Cloud computing, dynamic web serving, dedicated hosting, content delivery network, memory caching, and corporate applications
  • 8 modular UP Nodes in 3U; EACH NODE:
  • Intel® Xeon® processor D-2191 SoC, 18-Cores, 36 Threads, 86W
  • Up to 512GB ECC LRDIMM, up to 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2 GbE LAN ports and 1 dedicated LAN supports IPMI 2.0
  • 2x 3.5" SATA3 or 2x 2.5" Hybrid SATA3/NVMe w/ optional kits
  • 1 PCI-E 3.0 x16, 1 Micro-LP, and 2 M.2
  • 1600W Redundant Titanium Level Power Supplies
X11SDS-8C
X11SDS-8C
  • Intel® Xeon® Processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports, 2x 10G SFP+ ports, 1x Gigabit Ethernet LAN port (via AOM-SMF-TP4F), IPMI 2.0 by Shared LAN
  • 4 AIOM expansion slots supporting PCI-E x8 modules, 2 PCI-E EDSFF-Short Drive slots (shared with M.2 M-Keys)
  • M.2 Interface: 2 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280/22110; 1 M.2 E-Key PCI-E 3.0 x2, 2230; 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042
  • Up to 2 SATA3 (6Gbps) ports
  • 1 USB 3.0 port (Type A), 2 additional USB 3.0 ports via AOM-SMF-TP4F
  • 1 VGA header, TPM header and onboard
  • Form factor: Proprietary, 13.9" x 7.25"
X11SDS-12C
X11SDS-12C
  • Intel® Xeon® Processor D-2163IT SoC, 12-Cores, 24 Threads, 75W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports, 2x 10G SFP+ ports, 1x Gigabit Ethernet LAN port (via AOM-SMF-TP4F), IPMI 2.0 by Shared LAN
  • 4 AIOM expansion slots supporting PCI-E x8 modules, 2 PCI-E EDSFF-Short Drive slots (shared with M.2 M-Keys)
  • M.2 Interface: 2 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280/22110; 1 M.2 E-Key PCI-E 3.0 x2, 2230; 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042
  • Up to 2 SATA3 (6Gbps) ports
  • 1 USB 3.0 port (Type A), 2 additional USB 3.0 ports via AOM-SMF-TP4F
  • 1 VGA header, TPM header and onboard
  • Form factor: Proprietary, 13.9" x 7.25"
X11SDS-14C
X11SDS-14C
  • Intel® Xeon® Processor D-2173IT SoC, 14-Cores, 28 Threads, 70W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports, 2x 10G SFP+ ports, 1x Gigabit Ethernet LAN port (via AOM-SMF-TP4F), IPMI 2.0 by Shared LAN
  • 4 AIOM expansion slots supporting PCI-E x8 modules, 2 PCI-E EDSFF-Short Drive slots (shared with M.2 M-Keys)
  • M.2 Interface: 2 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280/22110; 1 M.2 E-Key PCI-E 3.0 x2, 2230; 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042
  • Up to 2 SATA3 (6Gbps) ports
  • 1 USB 3.0 port (Type A), 2 additional USB 3.0 ports via AOM-SMF-TP4F
  • 1 VGA header, TPM header and onboard
  • Form factor: Proprietary, 13.9" x 7.25"
X11SDS-16C
X11SDS-16C
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports, 2x 10G SFP+ ports, 1x Gigabit Ethernet LAN port (via AOM-SMF-TP4F), IPMI 2.0 by Shared LAN
  • 4 AIOM expansion slots supporting PCI-E x8 modules, 2 PCI-E EDSFF-Short Drive slots (shared with M.2 M-Keys)
  • M.2 Interface: 2 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280/22110; 1 M.2 E-Key PCI-E 3.0 x2, 2230; 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042
  • Up to 2 SATA3 (6Gbps) ports
  • 1 USB 3.0 port (Type A), 2 additional USB 3.0 ports via AOM-SMF-TP4F
  • 1 VGA header, TPM header and onboard
  • Form factor: Proprietary, 13.9" x 7.25"
X11SDV-4C-TP8F
X11SDV-4C-TP8F
Passive Heatsink
  • Intel® Xeon® Processor D-2123IT SoC, 4-Cores, 8 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 4x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8 and 1 PCI-E 3.0 x16, and
    • M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2, 2242/2280 form, M-Key, B-Key
    • U.2 Interface: 2 PCI-E 3.0 x4, 2 PCI-E 3.0 NVMe x4 Internal Ports
  • 12 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 COM port (header), 1 SuperDOM
  • Form factor: Flex ATX, 9" x 7.25"
X11SDV-4C-TLN2F
X11SDV-4C-TLN2F
Passive Heatsink
  • Intel® Xeon® Processor D-2123IT, 4-Cores, 8 Threads, 60W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-8C-TLN2F
X11SDV-8C-TLN2F
Passive Heatsink
  • Intel® Xeon® Processor D-2141I SoC, 8-Cores, 16 Threads, 65W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-12C-TLN2F
X11SDV-12C-TLN2F
Passive Heatsink
  • Intel® Xeon® Processor D-2166NT SoC, 12-Cores, 24 Threads, 85W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-16C-TLN2F
X11SDV-16C-TLN2F
Passive Heatsink
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-8C+-TLN2F
X11SDV-8C+-TLN2F
Active Heatsink
  • Intel® Xeon® Processor D-2141I SoC, 8-Cores, 16 Threads, 65W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-16C+-TLN2F
X11SDV-16C+-TLN2F
Active Heatsink
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-8C-TP8F
X11SDV-8C-TP8F
Passive Heatsink
  • Intel® Xeon® Processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 4x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8 and 1 PCI-E 3.0 x16, and
    • M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2, 2242/2280 form, M-Key, B-Key
    • U.2 Interface: 2 PCI-E 3.0 x4, option via mini-SAS HD port
  • 12 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.0 ports (rear), 4 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 COM port (header), 1 SuperDOM
  • Form factor: Flex ATX, 9" x 7.25"
X11SDV-12C-TP8F
X11SDV-12C-TP8F
Passive Heatsink
  • Intel® Xeon® Processor D-2166NT SoC, 12-Cores, 24 Threads, 85W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 4x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8 or 1 PCI-E 3.0 x16,
    • M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2, 2242/2280 form, M-Key, B-Key
    • U.2 Interface: 2 PCI-E 3.0 x4, 2 PCI-E 3.0 NVMe x4 internal ports
  • 12 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 4 USB 3.0 ports (2 rear + 2 headers), 3 USB 2.0 port (2 headers + 1 Type A)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 COM port (header), 1 SuperDOM
  • Form factor: Flex ATX, 9" x 7.25"
X11SDV-16C-TP8F
X11SDV-16C-TP8F
Passive Heatsink
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 4x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8 or 1 PCI-E 3.0 x16,
    • M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2, 2242/2280 form, M-Key, B-Key
    • U.2 Interface: 2 PCI-E 3.0 x4, 2 PCI-E 3.0 NVMe x4 internal ports
  • 12 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 4 USB 3.0 ports (2 rear + 2 headers), 3 USB 2.0 port (2 headers + 1 Type A)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 COM port (header), 1 SuperDOM
  • Form factor: Flex ATX, 9" x 7.25"
X11SDW-12C-TP13F
X11SDW-12C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2163IT SoC, 12-Cores, 24 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 10"
X11SDW-14C-TP13F
X11SDW-14C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2173IT SoC, 14-Cores, 28 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 10"
X11SDW-14CNT-TP13F
X11SDW-14CNT-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2177NT SoC, 14-Cores, 28 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242/3042
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 9.6"
X11SDW-16C-TP13F
X11SDW-16C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 ports (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 10"
X11SDW-4C-TP13F
X11SDW-4C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2123IT SoC, 4-Cores, 8 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
  • 1 M.2 E-Key PCI-E 3.0 x1, 2230
  • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 ports (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 10"
X11SDW-8C-TP13F
X11SDW-8C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2146NT SoC, 8-Cores, 16 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 ports (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 9.6"