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Special Features

Global SKU (25)

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X12DPL-NT6

Key Features

3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
4 PCI-E 4.0 x16,
1 PCI-E 4.0 NVMe x8 Internal Port(s)
M.2 Interface: 2 PCI-E 4.0 x4
M.2 Form Factor: 2280/22110, 2280
M.2 Key: M-Key
1 VGA port
Intel® C621A controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with Intel® X550 10GBase-T Ethernet Controller

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X12DPL-i6

Key Features

3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s
Intel® C621A
Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
4 PCI-E 4.0 x16
M.2 Interface: 2 PCI-E 4.0 x4
M.2 Form Factor: 2280/22110, 2280
M.2 Key: M-Key
1 VGA port
Intel® C621A controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with Intel® i210 Gigabit Ethernet Controller

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X12DPi-NT6

Key Features

3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A
Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 series only.
2 PCI-E 4.0 x8,
4 PCI-E 4.0 x16,
2 PCI-E 4.0 NVMe x8 Internal Port(s)
M.2 Interface: 1 PCI-E 4.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Key
2 VGA (1 rear bezel, 1 front panel) ports
Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with 10GBase-T with Intel® X550

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X12DPi-N6

Key Features

3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A
Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only.
2 PCI-E 4.0 x8,
4 PCI-E 4.0 x16,
2 PCI-E 4.0 NVMe x8 Internal Port(s)
M.2 Interface: 1 PCI-E 4.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Key
2 VGA (1 rear bezel, 1 front panel) ports
Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with Intel® i350 Gigabit Ethernet Controller

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X12DPG-U6

Key Features

3rd Gen Intel® Xeon® Scalable processors.
Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A
Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 8GB Unbufferred ECC Intel® Optane™ Persistent Memory, DDR4-2933MHz, in 32 DIMM slots
8 PCI-E 4.0 x16
M.2 Interface: 2 PCI-E 4.0 x4, RAID 0 & 1
M.2 Form Factor: 2280/22110
1 VGA D-Sub Connector port
Intel® C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10

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X12DPG-QT6

Key Features

3rd Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A
Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 6TB Intel® Optane™ Persistent Memory 200 Series, in 16 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
6 PCI-E 4.0 x16,
1 PCI-E 4.0 x8
M.2 Interface: 2 PCI-E 4.0 x4, RAID 0 & 1
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key
Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog
Dual LAN with Intel® X550 10GBase-T Ethernet Controller
Integrated IPMI 2.0 and KVM with Dedicated LAN
5 USB 3.0 ports, 4 USB 2.0 ports
HD Audio with optical S/PDIF

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X12DPFR-AN6

Key Features

3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 165W TDP, 3 UPI up to 10.4 GT/s
Intel® C621A
Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 16 DIMM slots
1 PCI-E 4.0 x16 Right Riser Slot,
1 PCI-E 4.0 x8 connector for SMC add-on cards,
3 PCI-E 4.0 NVMe x8 Internal Port(s)
1 PCI-E 4.0 x16, OCP 3.0 compliant
1 VGA port
Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Single LAN with
Networking options provided via AIOM module

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X12DDW-A6

Key Features

3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A
Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB LRDIMM, DDR4-3200MHz
Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz (OC), in 16 DIMM slots
1 PCI-E 4.0 x16 Left Riser Slot,
1 PCI-E 4.0 x16 Right Riser Slot,
2 PCI-E 4.0 x16 Center Right Hand Slot,
8 PCI-E 4.0 NVMe Internal Port(s)
M.2 Interface: 2 PCI-E 2.0 x1
M.2 Form Factor: 2260/2280
M.2 Key: M-Key
2 PCI-E 4.0 x16, AIOM slots Superset of OCP 3.0 Expansion
1 VGA D-Sub Connector port
Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
AIOM for LAN

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X12DAi-N6

Key Features

3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Intel® C621A
Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 6TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots;
Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode.
5 PCI-E 4.0 x16,
1 PCI-E 4.0 x8,
4 PCI-E 4.0 NVMe x4 Internal Port(s)
M.2 Interface: 2 PCI-E 4.0 x4, RAID 0 & 1
M.2 Form Factor: 2280/22110
M.2 Key: M-Key
1 VGA D-Sub Connector port
Intel® C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with Intel® i210 Gigabit Ethernet Controller

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X12STN-L-WOHS

Key Features

Intel® 11th Generation Core™ i3-1115GRE Processor
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS)
High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion
Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2
Accelerated AI inferencing and computer vision in parallel without extra hardware
100% wide temp grade design and components applied
12-24V (10% tolerance) wide range power input support
Without heatsink for customers flexible thermal design

Add to compare

X12STN-L

Key Features

Intel® 11th Generation Core™ i3-1115GRE Processor
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS)
High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion
Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2
Accelerated AI inferencing and computer vision in parallel without extra hardware
100% wide temp grade design and components applied
12-24V (10% tolerance) wide range power input support

Add to compare

X12STN-H-WOHS

Key Features

Intel® 11th Generation Core™ i7-1185GRE Processor
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS)
High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion
Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2
Accelerated AI inferencing and computer vision in parallel without extra hardware
100% wide temp grade design and components applied
12-24V (10% tolerance) wide range power input support
Without heatsink for customers flexible thermal design

Add to compare

X12STN-H

Key Features

Intel® 11th Generation Core™ i7-1185GRE Processor
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS)
High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion
Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2
Accelerated AI inferencing and computer vision in parallel without extra hardware
100% wide temp grade design and components applied
12-24V (10% tolerance) wide range power input support

Add to compare

X12STN-E-WOHS

Key Features

Intel® 11th Generation Core™ i5-1145GRE Processor
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS)
High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion
Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2
Accelerated AI inferencing and computer vision in parallel without extra hardware
100% wide temp grade design and components applied
12-24V (10% tolerance) wide range power input support
Without heatsink for customers flexible thermal design

Add to compare

X12STN-E

Key Features

Intel® 11th Generation Core™ i5-1145GRE Processor
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS)
High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion
Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2
Accelerated AI inferencing and computer vision in parallel without extra hardware
100% wide temp grade design and components applied
12-24V (10% tolerance) wide range power input support

Add to compare

X12STN-C-WOHS

Key Features

Intel® Celeron® 6305E Processor
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS)
High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion
Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2
Accelerated AI inferencing and computer vision in parallel without extra hardware
100% wide temp grade design and components applied
12-24V (10% tolerance) wide range power input support
Without heatsink for customers flexible thermal design

Add to compare

X12STN-C

Key Features

Intel® Celeron® 6305E Processor
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS)
High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion
Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2
Accelerated AI inferencing and computer vision in parallel without extra hardware
100% wide temp grade design and components applied
12-24V (10% tolerance) wide range power input support

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X12SPZ-SPLN6F

Key Features

3rd Gen Intel® Xeon® Scalable Processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Intel® C621A
Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots
2 PCI-E 4.0 x16
1 PCI-E 4.0 NVMe x8 SlimSAS Internal Port
1 PCI-E 4.0 NVMe x4 SlimSAS Internal Port
1 OCuLink Connector (4 SATA/PCI-E 3.0 x4)
1 M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4)
Quad 1G RJ45 with Intel® I350-AM4
Dual 25G SFP28 with Broadcom BCM57414
4 USB 3.2 Gen 1 (2 Rear, 2 via Header),
4 USB 2.0 (Headers)
Supports 12V DC power input

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