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Desktop / Gaming Boards

Supermicro 的自主研发团队能为您的运算需求量身设计

1993 年以来技术先进的主板设计
始终如一的高质量设计、部件和专业生产制造
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有竞争力的性价比
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Intel® Xeon® W-3400/W-2400 Processors(2)

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DDR5-MHz(1)
DDR5-5200MHz (OC)(2)
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DDR5-4800MHz(58)
DDR5-4400MHz(8)
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DDR4-3866+MHz (OC)(3)
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DDR4-2666MHz(50)
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DDR4-2133MHz(61)
DDR4-1866MHz(7)
DDR3-1866MHz(15)
DDR3-1600MHz(25)
DDR3-1333MHz(3)
DDR3 1600/1333/1066 MHz(1)

Special Features

Global SKU(24)

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X13SWA-TF

Key Features

Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, Up to 350W TDP
Intel® W790
Up to 4TB(W-3400)/2TB(W-2400) 3DS ECC RDIMM, 1TB(W-3400)/512GB(W-2400) ECC RDIMM; DDR5-4800MT/s(1DPC)/ 4400MT/s(2DPC), in 16 DIMM slots
M.2 Interface: 4 PCIe 5.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Socket (w/o heat sink)
2 U.2 PCIe 3.0 for NVMe 2.5" SSD drives (U.2-1, U.2-2)
Xeon® W-3400 Series Processors: 6 PCIe 5.0 x16 Slots, support up to 6 Single Width/4 Double Width/2 Triple Width GPU cards Xeon® W-2400 Series Processors:3 PCIe 5.0 x16 Slots, support up to 3 Single Width/3 Double Width/2 Triple Width GPU cards (slot 3/5/7)
1GbE LAN port with Intel® Ethernet Controller I210-AT
10GbE LAN with Marvell AQC113C
8 SATA 3 (6Gb, RAID 0, 1, 5, 10)
IPMI Supported
Overclocking Supported (optional)

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X13SRN-H-WOHS

Key Features

Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2

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X13SRN-H

Key Features

Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
12-24V wide range power with RVP and TVS
Hailo-8™ powerful and efficient Edge AI solution integration ready
100% wide temp grade design and components applied
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2

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X13SRN-E-WOHS

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2

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X13SRN-E

Key Features

Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2

Add to compare

X13SRA-TF

Key Features

Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, TDP up to 350W
Intel® W790
Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Socket (w/o heat sink)
3 PCIe 5.0 x16 Slots, support up to 3 Single Width/2 Double Width/2 Triple Width GPU cards
1 PCIe 4.0 x4 Slots
1GbE LAN port with Intel® Ethernet Controller I210-AT
10GbE LAN with Marvell AQC113
6 SATA 3 (6Gb, RAID 0, 1, 5, 10)
Overclocking Supported (optional)
IPMI Supported

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X13SEW-TF

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
1 PCIe 5.0 x8 ( in x16)
1 PCIe 5.0 x32
M.2 Interface: 1 PCIe 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Dual LAN with 10GBase-T with Intel® X550
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
I/O: 1 VGA, 2 COM, 1 TPM header
2 SuperDOM with built-in power

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X13SEW-F

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
1 PCIe 5.0 x8 ( in x16)
1 PCIe 5.0 x32
M.2 Interface: 1 PCIe 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Dual LAN with 1GbE with Intel® I210
2 SuperDOM with built-in power
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
I/O: 1 VGA, 2 COM, 1 TPM header

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X13SET-GC

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
4 PCIe 5.0 X8 via MCIO connectors
2 PCIe 5.0 x16 via Molex Impleplus connectors
Boardcom 3808 controller for 6 SAS3 drives
I/O: 1 COM, TPM header
M.2 Interface: 2 PCIe 3.0x4&SATA M.2 Form Factor: 2280 M.2 Key: M-Key

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X13SET-G

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
4 PCIe 5.0 X8 via MCIO connectors
2 PCIe 5.0 x16 via Molex Impleplus connectors
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
M.2 Interface: 2 PCIe 3.0x4&SATA M.2 Form Factor: 2280 M.2 Key: M-Key
I/O: 1 COM, TPM header

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X13SEM-TF

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x16,
4 PCIe 5.0 x8 MCIO connectors
M.2 Interface: 2 PCIe 4.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
8 NVMe ports PCI-E 5.0 x4 via 4 MCIO connectors
Dual LAN with 10GBase-T with Intel® X550
5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCI-E 3.0 x4 NVMe + 2 SATA3 ports; RAID (SATA) 0,1,5,10

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X13SEM-F

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x16,
4 PCIe 5.0 x8 MCIO connectors
M.2 Interface: 2 PCIe 4.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
8 NVMe ports PCI-E 5.0 x4 via 4 MCIO connectors
Dual LAN with 1GbE with Intel® I350
Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCI-E 3.0 x4 NVMe + 2 SATA3 ports; RAID (SATA) 0,1,5,10
5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

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X13SEI-TF

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
3 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
Dual LAN with 10GbE with Intel® X550
4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear)
Intel® C741 controller for 10 SATA3 (6 Gbps) ports

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X13SEI-F

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots
3 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
Dual LAN with 1GbE with Intel® I210
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear)

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X13SEFR-A

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
1 PCIe 5.0 x16 AIOM slot
1 PCIe 5.0 x16
5 PCIe 5.0 x8 via MCIO connectors
AIOM for LAN
I/O: 1 VGA, 1 COM, TPM header
M.2 Interface: 2 PCIe 3.0x2&SATA M.2 Form Factor: 2280,22110 M.2 Key: M-Key

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X13SEED-SF

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB ECC RDIMM/RDIMM 3DS, DDR5-4800MT/s in 8 DIMM slots
1 PCIe 5.0 x16 Right Riser Slot, support LP PCIe card
2 PCIe 5.0 x16 Left Riser Slot, support FHHL PCIe card
1 SFP for Gigabit Ethernet and IPMI shared LAN with Intel® Ethernet Controller I210-IS
1 VGA Port; 2 USB 2.0 Ports; 1 Serial Port via KVM Connector.
M.2 Interface: 2 PCI-E 5.0 x4, M.2 Form Factor: 2280/22110

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X13SEED-F

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB ECC RDIMM/RDIMM 3DS, DDR5-4800MT/s in 8 DIMM slots
1 PCIe 5.0 x16 Right Riser Slot, support LP PCIe card
2 PCIe 5.0 x16 Left Riser Slot, support FHHL PCIe card
1 RJ45 for Gigabit Ethernet and IPMI shared LAN with Intel® Ethernet Controller I210-AT
1 VGA Port; 2 USB 2.0 Ports; 1 Serial Port via KVM Connector.
M.2 Interface: 2 PCI-E 5.0 x4, M.2 Form Factor: 2280/22110

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X13SEDW-F

Key Features

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
8 MCIO PCI-E 5.0 x4 connectors
1 MCIO PCI-E 5.0 x8 connectors
2 PCIe 5.0 x16 4C
1 PCIe 5.0 x8 AIOM
1 PCIe 5.0 x0 AIOM
M.2 Interface: 2 PCIe 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
AIOM for LAN
Intel® C741 controller for 12 SATA3 (6 Gbps) ports
I/O: 1 VGA, 1 COM, 1 TPM header, 1 NC-SI header

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