Supermicro's extremely popular BigTwin® and TwinPro multi-node servers are now even better with 3rd Gen Intel® Xeon® Scalable processors and PCIe Gen 4. In this TECHTalk, we will highlight the range of CPU, memory, storage, and networkining options available on these highly versatile systems.

In this TECHTalk, we introduce our CloudDC scalable systems, the building blocks of new cloud data centers. These X12-generation systems take advantage of Supermicro's innovative hardware design and the capabilities of 3rd Gen Intel® Xeon® Scalable processors.

Ultra is one of Supermicro's flagship product lines, with high processing performance and innovative riser cards that can support a variety of networking and expansion options. This TECH Talk will outline how Ultra is even better with 3rd Gen Intel® Xeon® Scalable processors.

FatTwin® is Supermicro's high-density 4U multi-node system, supporting a variety of processor and storage configurations, plus AIOM and riser card networking options. This TECHTalk will show how FatTwin's capabilities are enhanced even more with 3rd Gen Intel® Xeon® Scalable processors and PCIe Gen 4.

Ultra-E brings the performance and networking flexibility of Supermicro's Ultra product line to the Edge. This TECH Talk will demonstrate how this system has been specifically adapted to bring data center-class performance to the Edge.

SuperBlade systems enable data centers with the highest compute density for cloud-based applications. In this TechTalk, we show how the latest SuperBlade systems leverage the latest 3rd Gen Intel® Xeon® Scalable processors and high-speed networking technologies to provide unlimited data center configurability.

New Edge applications and 5G networks demand high-performance processors and a variety of hardware accelerator. In this TECHTalk, we will show how the revolutionary Hyper-E server supports 3rd Gen Intel® Xeon® Scalable processors and up to seven accelerator cards wile still offering front I/O, DC and AC power options, sort system depth, and NEBS Level 3 certification.

New cloud-based services generate massive amounts of new data and require extreme reliability. This TECHTalk will demonstrate how Supermicro's new Top-Loading storage systems support high drive denisty per rack with effortless tool-less serviceabilty.

Our newest data center system packs the highest density of advanced NVIDIA Ampere GPUs with fast GPU-GPU interconnect and 3rd Gen Intel® Xeon® Scalable processors. In this TECHTalk, we will show how we enable unparalleled AI performance in a 4U rack height package.

5G networks and new applications are driving the need for optimized processing power at the Edge. In this TECHTalk, we show how our new 210P short-depth server brings the latest 3rd Gen Intel® Xeon® Scalable processor and targeted accelerator cards to telecom central offices and micro data centers.