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• Arm AGI CPU is designed for maximum efficiency in agentic AI workload orchestration
• Supermicro rack-scale Arm AGI CPU designs increase agentic AI compute performance density within any power envelope
• Supermicro’s DCBBS capabilities and global manufacturing footprint reduce time-to-online (TTO) for large-scale AI infrastructure deployments

• Next –generation Supermicro AMD Helios platform to be showcased at Computex
• Rack-scale DCBBS architecture enables rapid deployment and seamless scaling from single racks to hyperscale AI clusters
• 72-GPU double-width Helios rack powered by AMD Instinct™ MI455X GPUs delivers exceptional performance for large-scale AI training and inference workloads

• End-to-End Blueprint Scalable from a 5MW to 1GW Power Envelope with full facility-side infrastructure for either single-tenant or multi-tenant deployments

• 12 new systems across Hyper, SuperBlade®, FlexTwin™, and GrandTwin® families offer industry-leading core density with up to 576 efficiency cores per server
• Breakthrough performance-per-watt and energy efficiency designed to lower TCO and reduce power consumption in high-density cloud and enterprise environments
• Optimized for cloud-native, virtualization, 5G analytics, content delivery, and throughput-intensive workloads

SAN JOSE, Calif., May 28, 2026 -- Super Micro Computer, Inc.