2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
1 PCIe 3.0 x16 Left Riser Slot, 1 PCIe 3.0 x16 Right Riser Slot, 1 PCIe 3.0 x16 connector for SMC add-on cards 1 PCIe 3.0 x16 SIOM LAN Networking Slot M.2 Interface: PCIe 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 4 NVMe Internal Port(s)
Intel® C621 controller for SATA3 (6 Gbps) ports; RAID 0,1,5,10
1 VGA port
Single LAN with Networking options provided via SIOM module
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP, Dual UPI up to 10.4 GT/s
Core
Up to 28 cores
Note
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
Memory Capacity
12 DIMM slots
Up to 2TB Intel® Optane™ Persistent Memory 200 Series, DDR4-2666MHz
Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor
