Designed for the specific requirements of AI data centers, Supermicro X14 GPU-optimized systems provide maximum acceleration. In addition to support for next-generation GPUs in a range of form factors, these systems have been completely re-engineered to take advantage of the latest interconnect, memory, storage, and cooling technologies to ensure significant performance increases over prior generations.

Intel Xeon 6900 series processors with P-cores deliver the highest performance per-core and performance-core density of any Intel Xeon processor ever, providing unmatched compute power and throughput for the most intensive AI applications.

Supermicro X14 multi-node architectures leverage shared resources including cooling, power supplies, and networking to maximize energy efficiency, with compact node form factors that allow significantly increased compute and component densities compared to standard rackmounts. The 6U SuperBlade® offers up to 10 hot-swappable nodes in a single enclosure with optional direct-to-chip liquid cooling and GPU support, while the all-new FlexTwin has been purpose-built for HPC with front-accessible nodes and dual liquid-cooled processors.

The increased core counts of the new Intel Xeon 6900 series processors with P-cores combined with Supermicro’s innovative multi-node architectures significantly enhances rack density compared to previous generations, helping organizations to reduce not only energy consumption but also the data center’s physical footprint.

Supermicro’s performance-optmized rackmounts bring flagship performance and flexibility in industry-standard form factors. Built to take on demanding and mission-critical enterprise workloads, these systems feature storage and I/O flexibility that provide a custom fit for a wide range of application needs. With up to 8 PCIe 5.0 expansion slots in a 2U chassis that can accommodate up to 4 double-width GPUs, Hyper represents the ultimate in flexibility and configurability for tomorrow’s data centers.

The new Intel Xeon 6900 series processors with P-cores are the most powerful Intel Xeon processor ever, with more cores and PCIe lanes to provide even greater flexibility for X14 rackmount servers. Built-in Intel Accelerator Engines can help to enhance performance for common AI, networking, and analytics tasks, while future support for Intel Xeon 6900 series processors with E-cores in 1Q ’25 will further expand flexibility and workload optimization.

Supermicro X14 offers a range of flexible and scalable rackmount solutions optimized for cloud data center, scale-out, and enterprise workloads including cloud-native CDN, scale-out analytics, and cloud services. For maximum performance and flexibility, Hyper supports the highest TDP processors and allows multiple PCIe and storage configurations including all-flash NVMe, while the new CloudDC with DC-MHS is designed to simplify deployment and maintenance for large-scale cloud data center deployments. For general, enterprise and cloud compute needs, WIO provides a balance of compute and efficiency with flexible I/O configurations.

New Intel Xeon 6700 series processors with E-cores are optimized to deliver ultra-high-density compute in the most power-efficient manner. These processors are performance-per-watt optimized with high core density and high-throughput performance, enabling precise matching of CPU compute requirements with the highly flexible X14 rackmount server range for maximum workload optimization and efficiency.

Supermicro X14 multi-node architectures are designed to meet the high core density requirements of large-scale cloud computing, CDN, and scale-out storage applications, with new support for the industry-standard EDSFF storage form factors to provide higher density and throughput. The density-optimized, highly efficient SuperBlade supports up to 20 nodes in an 8U enclosure with shared power, cooling and ethernet switch, while the single-processor optimized GrandTwin features front accessibility and I/O to simplify cold-aisle servicing and maintenance.

The new Intel Xeon 6700 series processors with E-cores bring up to 2.5x higher core density per rack compared to 4th Gen Intel Xeon and improved performance per watt to enable Supermicro X14 multi-node solutions to deliver significantly more compute capacity in a smaller physical footprint.

Supermicro X14 edge and telco systems are optimized for remote and on-premise locations where power and space are at a premium. The flagship Hyper-E dual processor configuration facilitates maximum core density for edge data centers while also supporting multiple double-width GPUs for edge AI inferencing. X14 short-depth systems feature front I/O, optional DC power supplies, and NEBS compliance, enabling easy integration into existing telco and edge infrastructure.

Compared to previous generations, the new Intel Xeon 6 processors deliver higher performance-per-watt, enhanced on-board accelerators, and more cores in the same or lower power envelope. These improvements allow for heavier workloads in power-constrained environments, and result in more efficient systems optimized for edge and telco workloads.

The AI revolution is using and generating massive amounts of data and these workloads require application-specific architectures at every stage of the data pipeline. Supermicro’s flagship X14 Petascale storage platform offers the best architecture to drive large-scale, data-intensive AI and HPC workloads, offering industry-leading memory bandwidth using up to eight Type 3 CXL modules. With up to 24 E3.S drives in 2U and unprecedented end-to end PCIe Gen5 performance, new X14 Petascale systems can help organizations to reach their performance and capacity goals with greater rack density than ever before.

The new Intel Xeon 6 processors support the latest PCIe Gen 5 standard to handle the high throughput of a large number of NVMe drives and get the maximum performance out of the new Gen 5 E3.S drives, as well as CXL 2.0 on all device types to maximize memory capacity for in-memory database applications.