X13OEI-CPU

Key Features


  1. 4th Gen Intel® Xeon® Scalable processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP (4 CPU module in one 8 Way System)
  2. Intel C741® Chipset (On PCH Module)
  3. Up to 8TB 3DS RDIMM/RDIMM DDR5 (288-pin) ECC memory with speeds up to 4800MHs (max.) in 32 DIMMs. Up to 8TB PMem 300 Series Memory
  4. PCI Slot Located on PCIe Module
  5. USB & Display Port on PCH Module
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X13OEI-CPU
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 10.11" x 16.79" (256.79cm x 426.47cm)
Processor
CPU
Core
  • Up to 64 cores
System Memory
Memory Capacity
  • 32 DIMM slots
  • Up to 32TB 3DS ECC RDIMM, DDR5-4800MHz
Memory Type
  • 4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4400MT/s (2DPC)
DIMM Sizes
  • 16GB, 32GB, 64GB, 128GB, 256GB
  • RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C741
Network Controllers
  • N/A
Expansion Slots
PCIe
  • N/A
System BIOS
BIOS Type
  • AMI 64MB AMI UEFI
BIOS Features
  • ACPI 6.4
  • SMBIOS 2.8/3.5
  • UEFI 2.8A
  • Plug and Play (PnP)
  • PCI FW 3.2
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • PCH temperature, Memory temperature, CPU temperature, Peripheral temperature, Platform Environment Control Interface (PECI)/(TSI), Fan speed control
FAN
  • 10x 4-pin fan headers (up to 10 fans)
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Resources
Parts List
X13OEI-CPU (For SuperServer Only)
  1. Products
  2. Motherboards
  3. X13OEI-CPU