SuperServer SYS-621BT-HNC8R (Complete System Only)

SYS-621BT-HNC8R Main SYS-621BT-HNC8R Angle SYS-621BT-HNC8R Node SYS-621BT-HNC8R Front SYS-621BT-HNC8R Rear SYS-621BT-HNC8R Opt1
Integrated Board: X13DET-B
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Key Applications

  • Hyperconverged Infrastructure
  • Scale-Out File Storage
  • Container Storage

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Socket E (LGA 4677) support 4th Gen Intel® Xeon® Scalable processors
  2. Intel® C741
  3. Up to 16 DIMMs ECC DDR5 Slots
  4. 2 PCIe 5.0 x16 (LP) slot;
    Tool-less support
    Internal PCIe 4.0 x8 for 2 M.2 NVMe support onboard
    Optional M.2 NVMe Boot Controller via SCC-A2NM2241G3-B1
  5. Network connectivity via AIOM (OCP 3.0 compliant)
  6. 3 hot-swap 3.5" drive bays (2x PCIe 5.0 NVMe/SAS and 1x PCIe 4.0 NVMe/SAS)
    Built-in SAS3 Support via Broadcom 3808; IT Mode
  7. 4 cooling fans per 2U enclosure, 14.9K RPM; Shared Cooling Design
    Liquid Cooling Support
  8. 3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
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Specifications Resources Parts List
Specifications
Product SKUs
SuperServer SYS-621BT-HNC8R (Black front & silver body)
Motherboard
Super X13DET-B
Processor (per Node)
CPU
Core Count
  • Up to 32C/64T; Up to 82.5MB Cache per CPU
Note
  • Supports up to 185W TDP CPUs (Air Cooled)*
  • Supports up to 350W TDP CPUs (Liquid Cooled)​
  • *Air Cooled CPUs with TDP over 185W only supported under specific conditions. Contact a Supermicro representative for details.​
System Memory (per Node)
Memory
  • Memory Capacity: 16 DIMM slots
  • Up to 4TB: 16x 256 GB DRAM
  • Memory Type: 4800MHz ECC DDR5 RDIMM
On-Board Devices (per Node)
SAS
  • SAS3 (12Gbps) via Broadcom® 3808 (IT mode)
Chipset
  • Intel® C741
Network Connectivity
  • Via AIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN
  • 1 RJ45 Dedicated BMC LAN port
USB
  • 2 USB 3.1 port(s) (2 rear)
Video
  • 1 VGA port(s)
Others
  • 2x M.2 for boot drive or caching  
    M.2 form factor: NVMe double-sided 22x110mm
    Note: Enterprise-grade M.2 only for caching application
System BIOS
BIOS Type
  • AMI 32MB Flash ROM
Management
Software
Power Configurations
  • ACPI / APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 8+4 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory.
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-827BQ2-R3K04P
Dimensions and Weight
Height
  • 3.47" (88mm)
Width
  • 17.68" (449mm)
Depth
  • 30.5" (774mm)
Package
  • 9.76" (H) x 24.65" (W) x 45.28" (D)
Weight
  • Net Weight: 66.1 lbs (30 kg)
  • Gross Weight: 96.6 lbs (43.8 kg)
Available Color
  • Black front & silver body
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • HDD activity LED
  • Network activity LEDs
  • Power status LED
  • Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express (PCIe)
  • 2 PCIe 5.0 x16 LP slot(s)
Drive Bays / Storage (per Node)
Hot-swap
  • 3x 3.5" hot-swap NVMe/SAS drive bays (2x PCI-E 5.0 NVMe/SAS and 1x PCI-E 4.0 NVMe/SAS)
M.2
  • 2 M.2 NVMe
System Cooling
Fans
  • 4x 14.9K RPM Heavy Duty 8cm Fan(s)
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
3000W Redundant Titanium Level power supplies
Dimension

(W x H x L)
  • 45 x 40 x 480 mm
AC Input
  • 1400W: 100-127Vac / 50-60Hz
  • 2880W: 200-207Vac / 50-60Hz
  • 3000W: 208-240Vac / 50-60Hz
  • 3000W: 240-240Vdc / 50-60Hz (for CQC only)
+12V
  • Max: 116A / Min: 0A (100Vac-127Vac)
  • Max: 240A / Min: 0A (200Vac-207Vac)
  • Max: 250A / Min: 0A (208Vac-240Vac)
  • Max: 250A / Min: 0A (240Vdc-240Vdc) (for CQC safety rating only)
12V SB
  • Max: 4.5A / Min: 0A
Output Type
  • Backplanes (connector)
Certification Titanium Level94%+   Titanium Level

 

  [ Test Report ]
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (Non-Condensing)
  • Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)


Resources
Component Options
AIOM MatrixCPU ListCompatible GPU ListDrive OptionsNVMe OptionsTested AOC ListTested M.2 ListTested Memory
Documentation
Manuals
Software
BIOS DownloadBMC DownloadDrivers & UtilitiesOS Certification
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X13DET-B

CSE-827BQ2-R3K04P 		4

1 		Super X13DET-B Motherboard

2U Chassis
Backplane BPN-NVME5-827BHQ-S3 1 X13 BigTwin 3.5" 2U4N Hybrid Backplane
Cable CBL-NSH5-1326 4 NearStack HD (x8 to x8), 26cm,85Ohm,G5,34AWG,RoHS
CBL-PWCD-0200 2 PWCD, Japan, IEC60320, C20 to C21,12AWG,1.8M,RoHS
CBL-SAST-1221-100 4 Slimline x8 (STR) to 2x Slimline x4 (STR),INT,21/16CM,1
Drive Tray(s) MCP-220-00133-0B-BULK 12 Black gen 8 hot-swap 3.5
Air Shroud MCP-310-21734-0B 4 SC217BQ2/827BQ2 BigTwin plastic+mylar air shroud for X13DET-B
Riser Card RSC-PR-6G5 4 1U RHS TwinPro Riser card with one PCIe 5.0 X16 slot,HF
Storage Controller Card SCC-B8SB80-B1 4 1U SCC w/ 8xSAS ports, SAS3808 FatTwin, BigTwin X12, HF,RoHS
SCC-P2HM2G4-B1 4 support 2x Gen4 Hybrid M.2 and 1x PCIEx16 Gen5 Slot
SCC-P6N6SGH-B1 4 1U Hybrid board supports 2x Gen5 NVMe, 4x Gen4 SAS for
Software SFT-OOB-LIC 4 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0087VM 4 1U Passive CPU VC HS w/ Mid Air CH for X13 EGS Platform
SNK-P0087VW 4 1U Passive Customized 100-mm Width CPU VC HS for X13 EGS
*Power Supply PWS-3K04A-1R 2 1U 1400W/2880W/3000W AC/DC PSU with C22 inlet, Titanium, For Bigtwin
*Power Distributor PDB-PT217-BGTNH 1 2U Big Twin PDB input redundancy powers pass through 12V
*Fan FAN-0191L4 4 80x80x38 mm, 14.9K RPM Cooling Fan in 2U4N 2.5 inches HDD BigTwin Series Servers
*Rail Set MCP-290-00172-0N 1 2U non-tip rail set, quick release, default for 2,3U 17.6"(W)
*Fan Holder MCP-320-21702-0N 2 Bigtwin fan holder (with 4.1mm rubber feet)(hold 2 80x38 fans)
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
3.5-to-2.5" HDD Conversion Tray MCP-220-00140-0B • - Black gen 8 hot-swap 3.5-to-2.5 Tool-less HDD tray, orange tab (Qty as Needed)
Cold Plate Module SNK-P3050-ABT 1 2x Cold Plates for Attachment to CPUs (Qty per Node)
Coolant Distribution Manifolds LCS-SCDM-076V42001-ABT 1 Coolant Manifolds (Qty per Rack)
Coolant Distribution Unit LCS-SCDU-080L4001-ABT 1 Rack Mounted Coolant Distribution Unit (Qty per Rack)
M.2 NVMe RAID Controller SCC-A2NM2241G3-B1 1 2x Gen3 Marvell2241 NVMe M.2 RAID with 1x PCIEx16 Gen5 (Qty per Node)
SPI Capable TPM Options AOM-TPM-9670H-FIPS 1 SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor, Supporting FIPS 140-2 (Qty per Node)
AOM-TPM-9671H-S 1 SPI Capable TPM 1.2 Provisioned for Server, Horizontal Form Factor (Qty per Node)
AOM-TPM-9670H-S 1 SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor (Qty per Node)
SuperCloud Composer License SFT-SDDC-SINGLE - SDDC Monitor License - Single License per Monitored host
System Management Suite SFT-DCMS-Single - Supermicro System Management Software Suite node
VROC Options AOC-VROCSTNMOD 1 Intel VROC Standard, RAID 0, 1, 10 (Qty per Node)
AOC-VROCPREMOD • 1 Intel VROC Premium, RAID 0, 1, 5, 10 (Qty per Node)
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